Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP4SGX230FF35C2XN	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120	CMOS	564	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		9120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.6 mm	35 mm	No	e1	800 MHz	30 s	564	245 °C (473 °F)	35 mm
EP4SGX230FF35C2X	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes			CMOS	564		0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	3			No	e0		20 s	564	220 °C (428 °F)
5SGXMB9R1H43C2N	Altera	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	840000	Yes	.93 V	31700	CMOS	600	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		31700 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4 mm	45 mm	No				600		45 mm
5CGXFC4C7M11C8N	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm							11 mm
5AGXBA5K4F31I3N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm		e1	670 MHz				31 mm
5AGXFB1H6F31I3	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	670 MHz				31 mm
5AGXBB3D6F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	362000	Yes	1.13 V		CMOS	544	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No	e1	500 MHz		544		35 mm
EP1S25F1508C7	Altera	FPGA	Commercial Extended	Ball	1508	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508				No	e0
EP4CE75F23C8LN	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	75408	Yes	1.03 V	4713		295	1	1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		4713 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No	e1	362 MHz	30 s	295	260 °C (500 °F)	23 mm
EP1K50FI484-1X	Altera	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	2880	Yes			CMOS	249		2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3			No	e0			249	220 °C (428 °F)
10M08DAF256C8	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256
EPF10K100EBI356-3DX	Altera																																				220 °C (428 °F)
5CGTFD9D5F31C8	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm							31 mm
5AGXMA3K6F31I3	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	670 MHz				31 mm
10AX066K3F35E2SP	Altera	FPGA		Ball	1152	BGA	Square	Plastic	660000	Yes			CMOS	396	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1152				No				396
5CGXFC4C7F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm	No				336		27 mm
5SGXEA5N2F40I2L	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		18500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				600		40 mm
5AGXBA5D6F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	190000	Yes	1.13 V		CMOS	544	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No	e1	500 MHz		544		35 mm
5AGXFA7K4F35C5N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	622 MHz				35 mm
5AGXMB5D4F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	670 MHz				35 mm
5AGXMB7H6F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz				35 mm
5AGXFA1H6F31I3N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm		e1	670 MHz				31 mm
5SGXMBBR2H43C3	Altera	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	952000	Yes			CMOS	600		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1760				No				600
10M08DFU324I7G	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	8000	Yes			CMOS	246	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm						Bottom	S-PBGA-B324				No				246
5AGXFB1K4F31C6N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm		e1	500 MHz				31 mm
EP4S100G4F45C2N	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy		Yes		141440					Grid Array				1 mm	85 °C (185 °F)		141440 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B		3.6 mm	45 mm							45 mm
EP1K50FI256-3F	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No	e0			186	220 °C (428 °F)
5SGXEA4K3F35I3LN	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	.88 V	15850	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		15850 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No				432		35 mm
EP2AGX95EF25I3	Altera	FPGA	Industrial	Ball	572	BGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		260	0.9		Grid Array	BGA572,24X24,40		.87 V	1 mm	100 °C (212 °F)		3747 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B572		2.2 mm	25 mm		e0			260		25 mm
EP2AGX95CF29C6	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	85 °C (185 °F)		3747 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm		e0			372		29 mm
5AGXFB1H4F40C4N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	300000	Yes	1.13 V		CMOS	704	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	3	2.7 mm	40 mm	No	e1	670 MHz		704		40 mm
5SGXEB5R1F40I2N	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	490000	Yes	.93 V	18500	CMOS	432	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		18500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				432		40 mm
10M02SFU169C7G	Altera	FPGA	Other	Ball	169	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B169
10AX022E3F29I1MG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm							29 mm
10AX057N2F40E2SG	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V		CMOS	588	.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				588		40 mm
5AGXMA1G6F31C5	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	622 MHz				31 mm
EP3SE260F780I2	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	255000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No		100 MHz		480
EP2S60F484C3N	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	24176	CMOS	334	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.45 ns	24176 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No	e1	717 MHz	30 s	326	245 °C (473 °F)	23 mm
5CGXBC3F6U19C7	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
5CGXFC7D6F31C8N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm							31 mm
5ASXBB5G6F35I3N	Altera	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	462000	Yes	1.18 V	17434	TSMC	540	1.15		Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)		17434 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm					540		35 mm
10AX027E3F27E2LP	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm							27 mm
5AGXBB5D6F35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	622 MHz				35 mm
5ASXBB5H4F40I5	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e0	622 MHz				40 mm
5CGXFC9E7F23C8	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
5CSEMA2U19C7SN	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
5ASTFD5E3F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	622 MHz				35 mm
5CGXFC5C7M11A7	Altera	FPGA	Automotive	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm							11 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.