Altera Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10AX032H4F35E3LG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V		CMOS	384		.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No					384		35 mm
5CGXBC4A6F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CEBA4U15C7	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm								15 mm
EP3SL70F780C4	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	67500	Yes	.94 V		CMOS	488		.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	488	220 °C (428 °F)	29 mm
EPF6010AFC256-3	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	880			10000	3.3		Grid Array			3 V	1 mm	85 °C (185 °F)	2.5 ns	880 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3		17 mm	No		e0	133 MHz			220 °C (428 °F)	17 mm
5AGXMA7G6F35C6	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	500 MHz				35 mm
EP2SGX90EF35C4NES	Altera	FPGA	Commercial Extended	Ball	35	BGA	Square	Plastic/Epoxy		Yes	1.25 V	4828	CMOS			1.2		Grid Array			1.15 V		85 °C (185 °F)		4828 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B35				No		e1
5ASXBB5H4F40C6	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e0	500 MHz				40 mm
5CGTFD7C5F31C6	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
10AX090U2F45E2LG	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V		CMOS	480		.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm	No					480		45 mm
5CGXFC9A7U19C6	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
10M08SFM153C7	Altera	FPGA	Other	Ball	153	BGA	Square	Plastic/Epoxy		Yes								Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B153
EP3SL340H1152I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	337500	Yes	.94 V		CMOS	744		.9	1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.86 V	1 mm					Tin Lead	Bottom	S-PBGA-B1152	4	3.9 mm	40 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	744	220 °C (428 °F)	40 mm
10AS032H4F35E3LP	Altera	FPGA		Ball	1152	BGA	Square	Plastic	320000	Yes			CMOS	384		.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1152				No					384
5AGXFB7D4F40C4N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e1	670 MHz				40 mm
5AGXFB7D4F40C5N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e1	622 MHz				40 mm
5CGXBC7A7F31A7	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
5CGXFC9F7F23I7	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CGXFC7B6F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
EP4S100G2F40C3	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes		91200						Grid Array				1 mm	85 °C (185 °F)		91200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B		3.8 mm	40 mm								40 mm
5AGXFA1K4F27C5N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	622 MHz				27 mm
5CGXBC7B7F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CGXBC7E6U19I7N	Altera	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Fine Pitch			1.07 V	.8 mm						Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
10AS066K1F35I1SGES	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm								35 mm
10AS048K2F35I1SP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm								35 mm
HC1S40F780N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	41250	Yes				613			1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					613
5AGXMB1K4F31C6	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	500 MHz				31 mm
5CEFA2F17I7N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Low Profile			1.07 V	1 mm						Bottom	S-PBGA-B256		1.55 mm	17 mm								17 mm
5CGXFC5D7M11I7N	Altera	FPGA		Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm						Bottom	S-PBGA-B301		1.1 mm	11 mm								11 mm
5SGXEA3E2H29I2	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	340000	Yes			CMOS	360			0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B780				No					360
5SGSMD3E2H29I2LN	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	236000	Yes	.88 V	8900	CMOS	360		.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		8900 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
10AS032H1F34I1SP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
5AGXMB7K6F40I3	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.18 V					1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e0	670 MHz				40 mm
5CSEBA5U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	85000	Yes	1.13 V		CMOS	66		1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No					66		19 mm
5AGXBB1D4F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	500 MHz				35 mm
EP3C80F780C7	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	81264	Yes	1.25 V	81264	CMOS	429		1.2		Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		81264 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e0	472.5 MHz	20 s	429	220 °C (428 °F)	29 mm
5CGXFC4E7M11C8N	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm								11 mm
5CGTFD9C5U19C7	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5AGXBA5G6F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
5AGXMB1G6F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
EP2AGX95HF29C5N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
5AGXMA1K4F31C4N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	670 MHz				31 mm
5SGXEA5H3F35C2N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	490000	Yes	.93 V	18500	CMOS	552		.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		18500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
5ASXFB5D4F40I3N	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.18 V					1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e1	670 MHz				40 mm
5AGZME7K2F35I3L	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	450000	Yes	1.18 V	16980	TSMC	534		1.15		Grid Array	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)		16980 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						534		35 mm
10AX066N1F40E1SG	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V		CMOS	588		.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					588		40 mm
10AS048E1F29E1SG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V		CMOS	360		.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
10AX115K4F36E3SG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V		CMOS	432		.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No					432		35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.