Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP2AGX65EF25C4	Altera	FPGA	Other	Ball	572	BGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		252	0.9		Grid Array	BGA572,24X24,40		.87 V	1 mm	85 °C (185 °F)	2530 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B572		2.2 mm	25 mm			e0			252		25 mm
5CGXBC7B7F31A7N	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
5CGXBC7B7F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5SGTMC7K3F40I3N	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	23472 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					600		40 mm
5AGXFA5D6F35C4N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
5AGXBB1K4F31I3N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	670 MHz				31 mm
5CGXBC4F7F23I7N	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
10AS048E1F29I1SP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
5CGXBC4E6M11I7	Altera	FPGA		Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm					Bottom	S-PBGA-B301		1.1 mm	11 mm								11 mm
5CSEMA5U19C61N	Altera	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	85000	Yes			CMOS	66		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm					Bottom	S-PBGA-B484				No					66
EP4SE820H40M3N	Altera	FPGA	Military	Ball	1517	BGA	Square	Plastic/Epoxy	813050	Yes	.93 V	32522		976	0.9		Grid Array	BGA1517,39X39,40		.87 V	1 mm	125 °C (257 °F)	32522 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1517		3.5 mm	42.5 mm						976		42.5 mm
5AGXBA5G4F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	500 MHz				35 mm
EP4SGX360FF35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144	CMOS	564	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm		14144 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.4 mm	35 mm	No		e1	717 MHz	30 s	564	245 °C (473 °F)	35 mm
5CGXBC9F6F27C7N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXFC9E7F31C6	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
10AT090N2F40E1LP	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm								40 mm
5AGXMA5K6F27C5	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm			e0	622 MHz				27 mm
EP3C40F324I6N	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V		CMOS	195	1.2		Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B324		1.9 mm	19 mm	No		e1			195		19 mm
5AGXMB5K6F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
EP4SGX70DF29C3	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	72600	Yes	.93 V	2904	CMOS	372	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	2904 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	3.3 mm	29 mm	No		e0	717 MHz	20 s	372	220 °C (428 °F)	29 mm
EP4SGX70DF29M3	Altera	FPGA	Military	Ball	780	BGA	Square	Plastic/Epoxy	72600	Yes	.93 V	2904		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	125 °C (257 °F)	2048 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B780		3.3 mm	29 mm				637.5 MHz		372		29 mm
5AGZME3E3H29C4N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584		342	0.85		Grid Array	BGA780,28X28,40		.82 V	1 mm	85 °C (185 °F)	13584 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm						342		33 mm
EP3SL50F780I4L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm				Tin Lead	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	488	220 °C (428 °F)	29 mm
5AGXMA5H6F31C5N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	622 MHz				31 mm
5ASXFB3H6F35C4	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207		385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						385		35 mm
EP3SL70F484C3LN	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	67500	Yes			CMOS	296		1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm				Tin Silver Copper	Bottom	S-PBGA-B484				No		e1	100 MHz		296
EP4SGX230DF29I4	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120	CMOS	372	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm		9120 CLBS		Tin Lead	Bottom	S-PBGA-B780	4	3.5 mm	29 mm	No		e0	717 MHz	20 s	372	220 °C (428 °F)	29 mm
5AGTMD3D3F40I5	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e0	622 MHz				40 mm
EP4CGX150BF31C8	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2.4 mm	31 mm								31 mm
5AGXMB5D4F40C4N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e1	670 MHz				40 mm
10M04SFE144A7G	Altera	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy		Yes							Flatpack					125 °C (257 °F)		-40 °C (-40 °F)		Quad	S-PQFP-G144
5CGXBC5A7M13C7N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm								13 mm
5ASXMB5G6F31I5N	Altera	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	100 °C (212 °F)	17434 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						250		31 mm
10AX027H2F34I1MP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
EP2A15F672I-9	Altera																											3									220 °C (428 °F)
5AGXBB5D6F40C5N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e1	622 MHz				40 mm
5AGXFA3H4F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	500 MHz				27 mm
EP3CLS100F484C7	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	100448	Yes	1.25 V	100448	CMOS	278	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	100448 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	450 MHz	20 s	278	220 °C (428 °F)	23 mm
10AX090K1F36I1LG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm								35 mm
5SGXEB6R2F43I3LN	Altera	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	597000	Yes	.88 V	22540	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	22540 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.4 mm	42.5 mm	No					600		42.5 mm
EP1S25F1020C7N	Altera	FPGA	Commercial Extended	Ball	1020	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	702	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,31X31,50	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2852 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e1		40 s	702	245 °C (473 °F)	33 mm
EP2AGZ225DF35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	224000	Yes	.93 V	8960		554	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	85 °C (185 °F)	8960 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		3.4 mm	35 mm			e0			554		35 mm
5CGXBC7C7F31I7	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
5CGTFD9D5F31C6N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
10M25DCF484C7	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484
5ASXMB3G6F31C4	Altera	FPGA	Other	No Lead	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207		250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						250		31 mm
EP2C20F256C8	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS	152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	1172 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e0	402.5 MHz		136		17 mm
5CGXFC9F7U19C7N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.