Altera Field Programmable Gate Arrays (FPGA) 2,400+

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP4CGX30BF23C7N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2.4 mm

23 mm

23 mm

EP1S40F672I7

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B672

No

e0

10AS027H5F35I3SG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

10162

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

10162 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.35 mm

35 mm

No

384

35 mm

5ASXBB5E6F40C4N

Altera

FPGA

Commercial Extended

Ball

1517

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

540

1.1

Grid Array

BGA1517,39X39,40

1.07 V

1 mm

85 °C (185 °F)

17434 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

5SGSED8N1F45I2N

Altera

FPGA

Industrial

Ball

1932

BGA

Square

Plastic/Epoxy

695000

Yes

.93 V

26240

CMOS

840

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

26240 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1932

3.9 mm

45 mm

No

840

45 mm

EP2AGX95DF29C5N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

5AGXMA5H6F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5CGXBC7E6F31C8N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

EP3C25E144I8N

Altera

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

24624

Yes

1.25 V

CMOS

82

1.2

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.15 V

.5 mm

Matte Tin

Quad

S-PQFP-G144

1.65 mm

20 mm

No

e3

82

20 mm

10AS066N1F40I1LP

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

40 mm

5AGXBB1G6F31C6

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

500 MHz

31 mm

5CGXFC5A6U19I7

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC5B7U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5AGXFA7K6F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

10AX022C4U19E3SP

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Fine Pitch

.87 V

.8 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

3.25 mm

19 mm

19 mm

EP20K200EQC240-3V

Altera

3

220 °C (428 °F)

5SGSED6N3F45I3L

Altera

FPGA

Industrial

Ball

1932

BGA

Square

Plastic/Epoxy

583000

Yes

.88 V

22000

CMOS

840

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

22000 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1932

3.9 mm

45 mm

No

840

45 mm

EP20K1500EFI1020-2

Altera

FPGA

Industrial

Ball

1020

BGA

Square

Plastic/Epoxy

51840

Yes

CMOS

808

1.8,2.5,3.3 V

Grid Array

BGA1020,32X32,40

Field Programmable Gate Arrays

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B1020

3

No

e0

808

220 °C (428 °F)

5AGXMB5G6F35I5

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

EP2AGX125DF25I5

Altera

FPGA

Ball

572

BGA

Square

Plastic/Epoxy

118143

Yes

CMOS

260

0.9,1.2/3.3,1.5,2.5 V

Grid Array

BGA572,24X24,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B572

3

No

e0

20 s

260

220 °C (428 °F)

EP1SGX40CF1020I7N

Altera

FPGA

Ball

1020

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e1

33 mm

5CGXFC5C7U19C6N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5SEEBF45I4

Altera

FPGA

Industrial

Ball

1932

BGA

Square

Plastic/Epoxy

952000

Yes

.88 V

35920

CMOS

840

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

35920 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1932

3.9 mm

45 mm

No

840

45 mm

5CGXBC4D6U19C6N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5ASXFB3G4F35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

EPF10K100BQC208-2DX

Altera

3

220 °C (428 °F)

EPF10K100BFI256-1DX

Altera

3

220 °C (428 °F)

5SGXEB5R2F43I3LN

Altera

FPGA

Industrial

Ball

1760

BGA

Square

Plastic/Epoxy

490000

Yes

.88 V

18500

CMOS

600

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

18500 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1760

3.4 mm

42.5 mm

No

600

42.5 mm

5ASXBB5E6F35I5

Altera

FPGA

Industrial

No Lead

1152

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

EP1SGX10CF672I5

Altera

FPGA

Military

Ball

672

BGA

Square

Plastic/Epoxy

10570

Yes

CMOS

362

1.5,1.5/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

135 °C (275 °F)

-65 °C (-85 °F)

Bottom

S-PBGA-B672

3

No

362

220 °C (428 °F)

10AS027E2F27E1SP

Altera

FPGA

Ball

672

BGA

Square

Plastic

270000

Yes

CMOS

240

.9

0.9 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B672

No

240

5CGTFD9A5F27C7N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CEBA2F17I7

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile

1.07 V

1 mm

Bottom

S-PBGA-B256

1.55 mm

17 mm

17 mm

5CGXBC5D7M13I7

Altera

FPGA

Ball

383

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B383

1.1 mm

13 mm

13 mm

5CGXFC4B7M13C7

Altera

FPGA

Other

Ball

383

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B383

1.1 mm

13 mm

13 mm

5CGXFC3C6U19C6N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC9A6F31C6N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

5SGXMA7N2F45I2LN

Altera

FPGA

Industrial

Ball

1932

BGA

Square

Plastic/Epoxy

622000

Yes

.88 V

23472

CMOS

840

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

23472 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1932

3.9 mm

45 mm

No

840

45 mm

5CGXBC5F6M13C6N

Altera

FPGA

Other

Ball

383

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B383

1.1 mm

13 mm

13 mm

5AGXFA5D6F31C4N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

670 MHz

31 mm

10M02DFV36A7

Altera

FPGA

Automotive

Ball

36

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B36

10AX115N3F40I2SG

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

1150000

Yes

.93 V

CMOS

600

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

600

40 mm

5AGXBB5K4F40C4

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

670 MHz

40 mm

5AGXFA5G6F31C6N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

500 MHz

31 mm

5CGXBC5B6M11C8

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CSEMA6U23C62

Altera

FPGA

Ball

672

FBGA

Square

Plastic/Epoxy

110000

Yes

CMOS

124

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA672,26X26,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B672

No

124

10AS057K2F40I1MG

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

40 mm

5CSTFD6D5F31A7N

Altera

FPGA

Automotive

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.