Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5AGXFB7G4F40C5	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e0	622 MHz				40 mm
EPF6010AFI256-2	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	880			10000	3.3		Grid Array			3 V	1 mm		2 ns	880 CLBS, 10000 Gates		Tin Lead	Bottom	S-PBGA-B256	3		17 mm	No	e0	153 MHz			220 °C (428 °F)	17 mm
10AX027H3F34E2LP	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm							35 mm
5SGXMA5N3F40C2N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	490000	Yes	.93 V	18500	CMOS	600		.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		18500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				600		40 mm
EP1SGX40FF1020I7ES	Altera	FPGA		Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS			1.5		Grid Array			1.425 V	1 mm					Tin Lead	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No	e0					33 mm
5AGXMB1G4F31C6	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	500 MHz				31 mm
5AGXMB1G4F31C6N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm		e1	500 MHz				31 mm
EPF10K100EFI672-3DX	Altera																													3								220 °C (428 °F)
5AGXBB1G4F31C5N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm		e1	622 MHz				31 mm
5AGXBA7G4F27I3	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V					1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz				27 mm
5AGXMB7K6F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	500 MHz				35 mm
5CGXBC5C6M11C8N	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm							11 mm
5ASXMB3E4F40C6N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e1	500 MHz				40 mm
5AGXMA5H4F31I3	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V					1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	670 MHz				31 mm
EP2AGX45FF29C4N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm		e1	500 MHz				29 mm
10AX016E4F27I3LP	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V	6151	CMOS	240		.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		6151 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672				No				240
5SGXEA3K3F35I4N	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	340000	Yes	.88 V	12830	CMOS	432		.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		12830 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No				432		35 mm
10AX115N4F46E2SG	Altera	FPGA	Other																				100 °C (212 °F)			0 °C (32 °F)
10AX115H2F34E2LG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V		CMOS	504		.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm	No				504		35 mm
EP4CGX150BF23C7N	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V					1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm							23 mm
EP4CE40F23C9L	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.03 V	2475		331		1	1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No	e0	265 MHz	20 s	331	220 °C (428 °F)	23 mm
EP4CE40F23C6	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	2475		331		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No	e0	472.5 MHz	20 s	331	220 °C (428 °F)	23 mm
EP20K100RC208	Altera																																					220 °C (428 °F)
5SGSMD3E1H29I2N	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	236000	Yes	.93 V	8900	CMOS	360		.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		8900 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No				360		33 mm
EP2AGZ350DF40I3	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	348500	Yes	.93 V	13940		734		0.9		Grid Array	BGA1517,39X39,40		.87 V	1 mm	100 °C (212 °F)		13940 CLBs	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1517		3.5 mm	40 mm		e0			734		40 mm
EP2AGZ350HF29C4N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm		e1	500 MHz				29 mm
EP1SGX40GF1020C5ES	Altera	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS			1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No	e0					33 mm
5SGSMD5H2F35I2	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	457000	Yes	.93 V	17260	CMOS	552		.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		17260 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No				552		35 mm
5AGXFA7H4F35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	242950	Yes	1.13 V		CMOS	544		1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm					Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm	No	e0	622 MHz		544		35 mm
10AT090S2F45E1SG	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V					.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm							45 mm
10AS032E3F29E2SG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V		CMOS	360		.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No				360		29 mm
EP4CGX30DF23C8	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V					1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm							23 mm
5CSEMA5F31A7SN	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B896		2 mm	31 mm							31 mm
5AGXBB3D4F31I5	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm					Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	622 MHz				31 mm
5SGXMA4K2F35C3N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	.88 V	15850	CMOS	432		.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		15850 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No				432		35 mm
5CGXFC9D7F23C8	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
5AGZME1K3F29I3N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.18 V					1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B780		3.6 mm	33 mm		e1	670 MHz				33 mm
5SGXMA5N1F45I2N	Altera	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	490000	Yes	.93 V	18500	CMOS	840		.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		18500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No				840		45 mm
5ASXMB3E4F40I5	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm					Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e0	622 MHz				40 mm
EP2AGX260FF35I5N	Altera	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	244188	Yes	.93 V		CMOS	612		.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	3	2.6 mm	35 mm	No	e1	500 MHz	30 s	612	250 °C (482 °F)	35 mm
5AGXFA1H4F31C4N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm		e1	670 MHz				31 mm
5SGXEA7N2F40C2L	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	600		.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				600		40 mm
EP2SGX60CF780C3N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	364		1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.45 ns	60440 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	e1	717 MHz	30 s	364	245 °C (473 °F)	29 mm
EP2C35F672C7ES	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.25 V	2100	CMOS			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)		2100 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.6 mm	27 mm	No	e0					27 mm
10AX066K3F40E2SG	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V		CMOS	696		.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				696		40 mm
EP3CLS200F780C8	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	198464	Yes	1.25 V	198464	CMOS	413		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		198464 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No	e0	450 MHz	20 s	413	220 °C (428 °F)	29 mm
5CGXFC4C6U19C8N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
10AX057N4F40I3SP	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V		CMOS	588		.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				588		40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.