Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5SGXMA7K2F35C2	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	622000	Yes	.93 V	23472	CMOS	432	.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
5CGTFD7B5M15C7	Altera	FPGA			484			Plastic	149500	Yes			CMOS	240		1.1,1.2/3.3,2.5 V		BGA484,28X28,20	Field Programmable Gate Arrays												No					240
5AGXMB3G4F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
5CGXFC9E6F31C7	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	448	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm	No					448		31 mm
5CSEBA6U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy	110000	Yes	1.13 V		CMOS	66	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No					66		19 mm
5AGXMB3G6F31I5N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	622 MHz				31 mm
5AGXMA5D6F27I5	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm			e0	622 MHz				27 mm
EP2AGX45HU17I5	Altera	FPGA	Industrial	Ball	358	LFBGA	Square	Plastic/Epoxy	42959	Yes	.93 V	1805		156	0.9		Grid Array, Low Profile, Fine Pitch	BGA358,20X20,32		.87 V	.8 mm	100 °C (212 °F)	1805 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B358		1.7 mm	17 mm			e0			156		17 mm
5CGTFD5B5U19C7	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
10AX066K1F35E1MP	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm								35 mm
EP4S40G2F40I1N	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	228000	Yes	.98 V	91200	CMOS	654	.95	0.95,1.2/3,1.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.92 V	1 mm		91200 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B	3	3.8 mm	40 mm	No		e1		30 s	654	245 °C (473 °F)	40 mm
EP3C120F780C8ES	Altera	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	119088			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)	119088 CLBS	0 °C (32 °F)	Tin Lead	Bottom	R-PBGA-B780		3.5 mm	29 mm	No		e0	472.5 MHz				29 mm
EP20L100FC144-3	Altera																											3									220 °C (428 °F)
5AGXMB7G6F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	504000	Yes	1.13 V		CMOS	544	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No		e1	500 MHz		544		35 mm
5AGXMB5D4F35C6	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	500 MHz				35 mm
5AGXFA5K4F27I5N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	622 MHz				27 mm
5AGXFB7G4F35C6	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	500 MHz				35 mm
EP3C5F256I8N	Altera	FPGA		Ball	256	LBGA	Square	Plastic/Epoxy	5136	Yes	1.25 V		CMOS	182	1.2		Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			182		17 mm
10AS066K2F40E2LP	Altera	FPGA		Ball	1517	BGA	Square	Plastic	660000	Yes			CMOS	696	.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1517				No					696
5CGXFC9E7F23I7	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
EP2AGX125CF35C4N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e1	500 MHz				35 mm
10AX090H2F34I1MG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
EP1S25F780I7ES	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V					Tin Lead	Bottom	S-PBGA-B780				No		e0
5AGXMB3H4F31C5N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	622 MHz				31 mm
EP20K100RI240-1V	Altera	FPGA		Gull Wing	240	QFP	Square	Plastic/Epoxy	4160	Yes			CMOS	183		2.5,2.5/3.3 V	Flatpack	QFP240,1.3SQ,20	Field Programmable Gate Arrays		.5 mm					Quad	S-PQFP-G240				No					183	220 °C (428 °F)
EP20K1500EFI33-3	Altera	FPGA		Ball	1020	BGA	Square	Plastic/Epoxy	51840	Yes			CMOS	800		1.8,1.8/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1020	3			No					800	220 °C (428 °F)
5CEBA7F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
10M08DFU324I6	Altera	FPGA		Ball	324	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B324
5SGXEA4K2F35C2	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	.93 V	15850	CMOS	432	.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	15850 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
5AGXMB7K6F40C6	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e0	500 MHz				40 mm
5AGXMB3G4F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	500 MHz				35 mm
5CGXFC4C6M13C6	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	175	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm	No					175		13 mm
5AGXBA5K6F31C5N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	622 MHz				31 mm
5AGXFB3G6F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
5AGXFA5K6F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
5CGXFC9B6U19C6	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGTFD7A5F31C8N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
5CGXBC4F7F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
EP4SGX230FF35I4	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120	CMOS	564	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm		9120 CLBS		Tin Lead	Bottom	S-PBGA-B1152	3	3.6 mm	35 mm	No		e0	717 MHz	20 s	564	220 °C (428 °F)	35 mm
5AGXMB3K6F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	622 MHz				35 mm
5CGXFC7D7F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5AGXFA5G6F35C6	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	500 MHz				35 mm
5AGXMB7G4F40C5	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e0	622 MHz				40 mm
5CGXBC7F7F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
EP3SL70F780C2N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	67500	Yes	.94 V		CMOS	488	.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	800 MHz	30 s	488	245 °C (473 °F)	29 mm
10AS027E1F29I1SP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
10AX016C5U19E3SP	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Fine Pitch			.87 V	.8 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		3.25 mm	19 mm								19 mm
EP1AGX60CF484C6N	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	60100		229	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	60100 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No		e1	640 MHz	30 s	229	245 °C (473 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.