Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5AGXBB7H6F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
5CGTFD5D5F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
EP2C15AF256C6	Altera	FPGA	Commercial Extended	Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V			152	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No	Also requires 3.3 V supply	e0			144		17 mm
5CGXBC3D6U19C6N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5SGXEA5H2F35I3LN	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	552	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	18500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
EP2AGX260FF35C4N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy	244188	Yes	.93 V		CMOS	612	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	3	2.6 mm	35 mm	No		e1	500 MHz	30 s	612	250 °C (482 °F)	35 mm
EP3SL50F484I4L	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V		CMOS	296	.9	1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.86 V	1 mm				Tin Lead	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No	It can also operate from 1.05 to 1.15 V supply	e0	717 MHz	20 s	296	220 °C (428 °F)	23 mm
5CGXBC3B6U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXFC4E6M13C7N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm								13 mm
5AGZME5E2F35C4N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
EP20K100EFI324-3X	Altera																											3									220 °C (428 °F)
5AGXMA7D4F31C5	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	622 MHz				31 mm
5ASXBB3E4F40I5	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e0	622 MHz				40 mm
5AGXBB7K6F35C4N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
5AGXMA7D6F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
EP2AGX125DF29I5N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
5SGSMD3E2H29I3N	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	236000	Yes	.88 V	8900	CMOS	360	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	8900 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
10AS032H2F35I1MP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm								35 mm
5ASXMB3E6F35I5N	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	100 °C (212 °F)	13207 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						385		35 mm
5CGXBC9F7U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5AGZME1H3F29I3	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B780		3.6 mm	33 mm			e0	670 MHz				33 mm
EP4SGX290KF43I4N	Altera	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	291200	Yes	.93 V	116480	CMOS	880	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm		116480 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1760	3	3.5 mm	42.5 mm	No		e1	717 MHz	30 s	880	245 °C (473 °F)	42.5 mm
5AGXFB3G6F35C6	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	500 MHz				35 mm
EP2AGZ350FH29I4N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	348500	Yes			CMOS	281		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B780				No					281
EP1S20F1020C6ES	Altera	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020				No		e0
5AGXBA1H4F31C6N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	500 MHz				31 mm
5AGXMB5K4F40C6N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e1	500 MHz				40 mm
5CGXFC4F7F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXFC3A6F23C6N	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
10AT115U2F45E1SP	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm								45 mm
5CGXBC9D6F27I7	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
EP4CE40F23C9LN	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.03 V	2475		331	1	1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	2475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	265 MHz	30 s	331	260 °C (500 °F)	23 mm
5AGXFB1D6F40C5N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e1	622 MHz				40 mm
5ASXMB3D6F31C4	Altera	FPGA	Other	No Lead	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						250		31 mm
5CSEMA4U23I71N	Altera	FPGA		Ball	672	FBGA	Square	Plastic/Epoxy	40000	Yes			CMOS	124		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,26X26,32	Field Programmable Gate Arrays		.8 mm					Bottom	S-PBGA-B672				No					124
5CGXBC4E7F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5CGXFC9E6F31C6	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
EP4CE15E22C7	Altera	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	15408	Yes	1.25 V	963		81	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144		1.65 mm	20 mm	No		e0	472.5 MHz		81		20 mm
EP3CLS100U484I7	Altera	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	100448	Yes	1.25 V	100448	CMOS	278	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)	100448 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.05 mm	19 mm	No		e0	450 MHz	20 s	278	220 °C (428 °F)	19 mm
10AX090U3F45I2LG	Altera	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V		CMOS	480	.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm	No					480		45 mm
5ASXBB5D6F40C6	Altera	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434		540	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm
10AS032H2F35I1LG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm								35 mm
5CGXFC4B6U19C7	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
EP2AGX190EF35I3N	Altera	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e1	500 MHz				35 mm
EP4CGX110BF27I7N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.25 V				1.2		Grid Array			1.15 V	1 mm					Bottom	S-PBGA-B672		2.4 mm	27 mm								27 mm
5CGXFC7A6F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
EP2S90F780I3	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	4828	CMOS		1.2		Grid Array			1.15 V	1 mm		4828 CLBS		Tin Lead	Bottom	S-PBGA-B780		3.5 mm	29 mm	No		e0					29 mm
5CGXBC7B7F23C7N	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.