Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5SGXMA5N3F45I4	Altera	FPGA		Ball	1932	BGA	Square	Plastic/Epoxy	490000	Yes			CMOS	840		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1932				No				840
5ASTMD5G3F40I5N	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e1	622 MHz				40 mm
5CGXFC5D7M13I7N	Altera	FPGA		Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm						Bottom	S-PBGA-B383		1.1 mm	13 mm							13 mm
10M50DCF256I7	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array										Bottom	S-PBGA-B256
5AGXFA1H6F31I5N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm		e1	622 MHz				31 mm
5AGXMA7H6F31C6N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm		e1	500 MHz				31 mm
EP1S80B956C5	Altera	FPGA	Commercial Extended	Ball	956	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B956				No	e0
5CGTFD7D5F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5AGZME5K2F40C3N	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	400000	Yes	.88 V	15096		674	0.85		Grid Array	BGA1517,39X39,40		.82 V	1 mm	85 °C (185 °F)		15096 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.4 mm	40 mm					674		40 mm
10AX066N3F40I2SP	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V	25168	CMOS	588	.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		25168 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				588		40 mm
5CGXFC7A6U19C6	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
5AGXFB3G6F40C6	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e0	500 MHz				40 mm
EP4SGX70DF29I3	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	72600	Yes	.93 V	2904	CMOS	372	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm			2904 CLBS		Tin Lead	Bottom	S-PBGA-B780	3	3.3 mm	29 mm	No	e0	717 MHz	20 s	372	220 °C (428 °F)	29 mm
EP3SL340H1152I2L	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	337500	Yes			CMOS	744		1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	1			No	e0	100 MHz		744
EP2AGX95HF25I3	Altera	FPGA	Industrial	Ball	572	BGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		260	0.9		Grid Array	BGA572,24X24,40		.87 V	1 mm	100 °C (212 °F)		3747 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B572		2.2 mm	25 mm		e0			260		25 mm
EP2AGX95CF35I5	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		452	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	100 °C (212 °F)		3747 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.6 mm	35 mm		e0			452		35 mm
EP2AGX95HF35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		452	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	85 °C (185 °F)		3747 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.6 mm	35 mm		e0			452		35 mm
5AGTFC3K3F31I5N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm		e1	622 MHz				31 mm
10AS048H2F34I1LG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm							35 mm
10AS048H2F34I1LP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm							35 mm
EP2S30F672C5	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	33880	Yes	1.25 V	13552	CMOS	500	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	85 °C (185 °F)	5.962 ns	13552 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No	e0	640 MHz	20 s	492	220 °C (428 °F)	35 mm
EP4CGX150DF31C8N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	149760	Yes	1.24 V	9360		475	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		9360 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.4 mm	31 mm	No	e1	472.5 MHz	30 s	475	260 °C (500 °F)	31 mm
5CGXBC4A6F23C7	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
5AGXBB3H6F40I5	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e0	622 MHz				40 mm
5CGXFC5D7F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5ASXBB3G6F31C4N	Altera	FPGA	Commercial Extended	Ball	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)		13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
10M08DFF256C8G	Altera	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes			CMOS	178	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256				No	e1			178
EP2AGX125CF29I5	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		4964 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm		e0			372		29 mm
EP1K100FC484-3F	Altera	FPGA	Commercial	Ball	484	BGA	Square	Plastic/Epoxy	4992	Yes			CMOS	333		2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3			No	e0			333	220 °C (428 °F)
EP1K100FC256-1X	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	4992	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No	e0			186	220 °C (428 °F)
5CGXBC4D6U19I7N	Altera	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm						Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
EP2AGZ300DF40C3	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	298000	Yes	.93 V	11920		734	0.9		Grid Array	BGA1517,39X39,40		.87 V	1 mm	85 °C (185 °F)		11920 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517		3.5 mm	40 mm		e0			734		40 mm
10M25DAF484I7	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes							Grid Array										Bottom	S-PBGA-B484
5SGSED6K2F40C3N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	583000	Yes		583	CMOS	696	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		583 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1517		3.5 mm	40 mm	No	e1		40 s	696	245 °C (473 °F)	40 mm
EP4SGX290FF35C3N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	291200	Yes	.93 V	11648	CMOS	564	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		11648 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.4 mm	35 mm	No	e1	717 MHz	30 s	564	245 °C (473 °F)	35 mm
EP4SGX290KF40I2N	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy		Yes		116480					Grid Array				1 mm			116480 CLBS			Bottom	S-PBGA-B1517		3.6 mm	40 mm							40 mm
EP4CE10E22C8L	Altera	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	10320	Yes	1.03 V	645		91	1	1,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	.97 V	.5 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	e0	362 MHz		91		20 mm
5AGXFA3G4F31I3N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm		e1	670 MHz				31 mm
5CGXBC7D7F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
10AS032E3F29I2SP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		11990 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No				360		29 mm
10AS066K1F35E1LP	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm							35 mm
5CGXFC5F7F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5CGXFC5F7F23C7N	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
5CGXBC3E7U19C6N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
5AGXBB1D6F35C4N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	670 MHz				35 mm
5CGXFC5B7F23I7N	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
10AX032E3F29I2SP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		11990 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No				360		29 mm
5CEFA5M13C6	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm							13 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.