Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

10M40DCF672A7G

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

e1

10AX115S2F45I2SG

Altera

FPGA

Industrial

Ball

1932

BGA

Square

Plastic/Epoxy

1150000

Yes

.93 V

CMOS

624

.9

0.9 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1932

3.65 mm

45 mm

No

624

45 mm

5AGXBB3G4F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

10AX057H2F34I1MG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

EP2AGZ350EF40I3N

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

3.4 mm

40 mm

e1

500 MHz

40 mm

EP1AGX50DF1152I6

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

50160

Yes

514

1.2,2.5/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

514

5CGTFD7C5F27A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

EP2AGX125DF29C6N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

10M16DCF484C7

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

5CGXBC5F7F23C6

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

10AX090U5F45I3SG

Altera

FPGA

Industrial

Ball

1932

BGA

Square

Plastic/Epoxy

900000

Yes

.93 V

CMOS

480

.9

0.9 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1932

3.65 mm

45 mm

No

480

45 mm

5CGTFD7D5U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5AGXBB3K4F31C5

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

622 MHz

31 mm

10M08DAF256C7

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

5ASXBB5E4F40C5

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

622 MHz

40 mm

5CGXFC7A7F23I7

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP4CE30F29I8LN

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

28848

Yes

1.03 V

1803

535

1

1,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.97 V

1 mm

1803 CLBS

Tin/Silver/Copper

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e1

362 MHz

30 s

535

260 °C (500 °F)

29 mm

5ASXMB3G6F35C4N

Altera

FPGA

Other

Ball

1152

HBGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

TSMC

540

1.1

Grid Array, Heat Sink/Slug

BGA1152,34X34,40

1.07 V

1 mm

85 °C (185 °F)

13207 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

2.7 mm

35 mm

540

35 mm

5AGXFB1G4F40I3

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

670 MHz

40 mm

5CGTFD9A5F23A7

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC4F6F23C8N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

10AX057N2F40I2SP

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

21708

CMOS

588

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

21708 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

588

40 mm

EP4S100G2F40C1N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

91200

Grid Array

1 mm

85 °C (185 °F)

91200 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B

3.8 mm

40 mm

40 mm

10AX115S2F45I2SGE2

Altera

FPGA

Industrial

Ball

1932

BGA

Square

Plastic/Epoxy

Yes

.93 V

42720

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

42720 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1932

3.5 mm

45 mm

45 mm

EP2AGX65CF25C6N

Altera

FPGA

Other

Ball

572

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B572

2.2 mm

25 mm

e1

500 MHz

25 mm

EP4CE115F23I8LN

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

114480

Yes

1.03 V

7155

283

1

1,1.2/3.3,2.5 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

.97 V

1 mm

7155 CLBS

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.4 mm

23 mm

No

e1

362 MHz

30 s

283

260 °C (500 °F)

23 mm

10AS066H4F34I3SG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

660000

Yes

.93 V

CMOS

492

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

No

492

35 mm

10AX066K2F36I1MG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5AGXBB1K4F40C5

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

622 MHz

40 mm

EP4SGX230FF35C3N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

228000

Yes

CMOS

564

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

3

No

e1

30 s

564

245 °C (473 °F)

5CGXFC5A6M11C6N

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

EP20K60EFI672-3

Altera

3

220 °C (428 °F)

10AX115K2F36I1SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

EP3SL200F780I2N

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

200000

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin/Silver/Copper

Bottom

S-PBGA-B780

No

e1

100 MHz

480

5CGXBC5D6M13C7N

Altera

FPGA

Other

Ball

383

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B383

1.1 mm

13 mm

13 mm

5CGXFC9E7F27C6N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5SGXEA9N3F45C3

Altera

FPGA

Other

Ball

1932

BGA

Square

Plastic/Epoxy

840000

Yes

.88 V

31700

CMOS

840

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

31700 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1932

3.9 mm

45 mm

No

840

45 mm

5SGXMB5R1F43I2

Altera

FPGA

Ball

1760

BGA

Square

Plastic/Epoxy

490000

Yes

CMOS

600

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1760

No

600

10AX090R2F40I1SG

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

40 mm

5AGXMB3H4F40I5

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

622 MHz

40 mm

EP1K10QC208-2F

Altera

FPGA

Commercial

Gull Wing

208

QFP

Square

Plastic/Epoxy

576

Yes

CMOS

120

2.5,2.5/3.3 V

Flatpack

QFP208,1.2SQ,20

Field Programmable Gate Arrays

.5 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

No

e0

120

220 °C (428 °F)

5CGTFD7F5U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP2AGZ225CF35C3N

Altera

FPGA

Other

Ball

1152

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e1

500 MHz

35 mm

EP2AGZ225HF40C4N

Altera

FPGA

Other

Ball

1517

HBGA

Square

Plastic/Epoxy

224000

Yes

.93 V

CMOS

734

.9

0.9,1.2/3.3,1.5,2.5 V

Grid Array, Heat Sink/Slug

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

e1

500 MHz

734

40 mm

EP2AGZ225CF35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

224000

Yes

.93 V

8960

554

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

85 °C (185 °F)

8960 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

3.4 mm

35 mm

e0

554

35 mm

EP2AGZ300DF40C4N

Altera

FPGA

Other

Ball

1517

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

3.5 mm

40 mm

e1

500 MHz

40 mm

5SGSMD3E3H29I4N

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

236000

Yes

.88 V

8900

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

8900 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP2C70F672I6

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

68416

Yes

1.25 V

4300

CMOS

422

1.2

1.2,1.5/3.3,3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.15 V

1 mm

4300 CLBS

Tin Lead

Bottom

S-PBGA-B672

2.6 mm

27 mm

No

Also requires 3.3 V supply

e0

406

27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.