Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

10AS027E5F27E3SG

Altera

FPGA

Ball

672

BGA

Square

Plastic

270000

Yes

CMOS

240

.9

0.9 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B672

No

240

EP4CGX110BF27C8

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2.4 mm

27 mm

27 mm

EP1S60B956C7

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

57120

Yes

1.575 V

6570

CMOS

1022

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

85 °C (185 °F)

6570 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

3

3.5 mm

40 mm

No

e0

20 s

1022

220 °C (428 °F)

40 mm

EP3SL150F780C2N

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

142500

Yes

.94 V

CMOS

488

.9

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

3

3.5 mm

29 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

800 MHz

30 s

488

245 °C (473 °F)

29 mm

EP2AGX260CF35I5N

Altera

FPGA

Industrial

Ball

1152

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e1

500 MHz

35 mm

5AGXFA5K6F31C5

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

622 MHz

31 mm

5SGXMABK2H40I2LN

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

952000

Yes

.88 V

35920

CMOS

696

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

35920 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.9 mm

45 mm

No

696

45 mm

EP2C35U484C7N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

33216

Yes

1.25 V

2076

CMOS

322

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Fine Pitch

BGA484,22X22,40

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

2076 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.2 mm

19 mm

No

Also requires 3.3 V supply

e1

450 MHz

30 s

306

260 °C (500 °F)

19 mm

EP4SGX530KF43I2N

Altera

FPGA

Ball

1760

BGA

Square

Plastic/Epoxy

Yes

212480

Grid Array

1 mm

212480 CLBS

Bottom

S-PBGA-B1760

3.7 mm

42.5 mm

42.5 mm

10AX066K1F40I1LP

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

40 mm

10AX090N3F45I2SP

Altera

FPGA

Industrial

Ball

1932

BGA

Square

Plastic/Epoxy

900000

Yes

.93 V

33962

CMOS

768

.9

0.9 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

33962 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1932

3.5 mm

45 mm

No

768

45 mm

EP1SGX10FF1020C5ES

Altera

FPGA

Other

Ball

1020

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e0

33 mm

5CGXFC3C7U19A7N

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

10AX115S1F45E1SP

Altera

FPGA

Other

Ball

1932

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1932

3.65 mm

45 mm

45 mm

5CSEMA6U23C8S

Altera

FPGA

Other

Ball

672

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

23 mm

5CGXBC9D6F31C6N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

10AX057K2F35I2LP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

CMOS

396

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

396

35 mm

5SGXMB6R3F43I4N

Altera

FPGA

Industrial

Ball

1760

BGA

Square

Plastic/Epoxy

597000

Yes

.88 V

22540

CMOS

600

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

22540 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1760

3.4 mm

42.5 mm

No

600

42.5 mm

EP1S30F484I5

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B484

No

e0

5SGXMA3K3F35C3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

340000

Yes

CMOS

432

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

432

5SGXMB6R2F40C2N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

597000

Yes

.93 V

22540

CMOS

432

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

22540 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

432

40 mm

5SGXMA5N2F45C1

Altera

FPGA

Ball

1932

BGA

Square

Plastic/Epoxy

490000

Yes

CMOS

840

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1932

No

840

5SGSMD3E2H29C2

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

236000

Yes

.93 V

8900

CMOS

360

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

8900 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP1S80F672C7ES

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

No

e0

10M08SAU169C7G

Altera

FPGA

Other

Ball

169

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

EPF10K100EQC240-1DX

Altera

3

220 °C (428 °F)

5CGXFC5B6F27C7

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

EP2SGX90EF1152C3N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

90960

Yes

1.25 V

90960

CMOS

558

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

4.45 ns

90960 CLBS

0 °C (32 °F)

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Bottom

S-PBGA-B1152

3

3.5 mm

35 mm

No

e1

717 MHz

30 s

558

245 °C (473 °F)

35 mm

EP2C15AF256I8

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

14448

Yes

1.25 V

152

1.2

1.2,1.5/3.3,3.3 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

Also requires 3.3 V supply

e0

144

17 mm

5CSXFC2C6U23C7N

Altera

FPGA

Other

Ball

672

FBGA

Square

Plastic/Epoxy

25000

Yes

1.13 V

CMOS

145

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA672,28X28,32

Field Programmable Gate Arrays

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

No

145

23 mm

5CGXBC7A7F23I7

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

10AS048K2F35I2SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

18359

CMOS

396

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

18359 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.35 mm

35 mm

No

396

35 mm

5ASXMB3H6F40C6

Altera

FPGA

Other

No Lead

1517

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

TSMC

540

1.1

Grid Array

BGA1517,39X39,40

1.07 V

1 mm

85 °C (185 °F)

13207 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

5SGXEBBR3H43I3L

Altera

FPGA

Industrial

Ball

1760

BGA

Square

Plastic/Epoxy

952000

Yes

.88 V

35920

CMOS

600

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

35920 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1760

4 mm

45 mm

No

600

45 mm

EP2AGX45DF25C5N

Altera

FPGA

Other

Ball

572

HBGA

Square

Plastic/Epoxy

42959

Yes

.93 V

CMOS

252

.9

0.9,1.2/3.3,1.5,2.5 V

Grid Array, Heat Sink/Slug

BGA572,24X24,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B572

3

2.2 mm

25 mm

No

e1

500 MHz

30 s

252

260 °C (500 °F)

25 mm

5CGTFD5E5U19C6

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP2AGX65CF29I3N

Altera

FPGA

Industrial

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

5AGXMB3G6F40C6N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

362000

Yes

1.13 V

CMOS

704

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

3

2.7 mm

40 mm

No

e1

500 MHz

704

40 mm

EP1C20F324I6ES

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

1.575 V

20060

1.5

Grid Array

1.425 V

1 mm

20060 CLBS

Tin Lead

Bottom

S-PBGA-B324

2.2 mm

19 mm

No

e0

405 MHz

19 mm

5AGXBB1K4F35I5

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5AGXFB1K6F31C4N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

670 MHz

31 mm

5AGXBB1G6F31I3

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

670 MHz

31 mm

5CGXFC5A6M13C8N

Altera

FPGA

Other

Ball

383

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B383

1.1 mm

13 mm

13 mm

EP1C6T144I8

Altera

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

5980

Yes

1.575 V

598

98

1.5

1.5,1.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.425 V

.5 mm

100 °C (212 °F)

598 CLBS

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

275 MHz

98

220 °C (428 °F)

20 mm

EP1C6T144C6N

Altera

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

5980

Yes

1.575 V

598

98

1.5

1.5,1.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.425 V

.5 mm

85 °C (185 °F)

598 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

405 MHz

30 s

98

260 °C (500 °F)

20 mm

5CGXBC5A7M11I7N

Altera

FPGA

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5AGXFA7D4F27I3

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

5ASXBB3G6F40C5

Altera

FPGA

Other

No Lead

1517

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

TSMC

540

1.1

Grid Array

BGA1517,39X39,40

1.07 V

1 mm

85 °C (185 °F)

13207 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.