Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5CGXBC5C7U19A7N

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP1AGX60DF484C6N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.25 V

60100

1.2

Grid Array

1.15 V

1 mm

85 °C (185 °F)

60100 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B484

2.44 mm

23 mm

No

23 mm

5AGXFA3K4F31I3N

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

670 MHz

31 mm

5CGXBC7B7F23C6N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5AGXFA1H4F27C6

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

500 MHz

27 mm

5AGZME7K3F35I3LN

Altera

FPGA

Industrial

No Lead

1152

BGA

Square

Plastic/Epoxy

450000

Yes

1.18 V

16980

TSMC

534

1.15

Grid Array

BGA1152,34X34,40

1.12 V

1 mm

100 °C (212 °F)

16980 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

534

35 mm

5AGZME5E2F35I3LN

Altera

FPGA

Industrial

No Lead

1152

BGA

Square

Plastic/Epoxy

400000

Yes

1.18 V

15096

TSMC

534

1.15

Grid Array

BGA1152,34X34,40

1.12 V

1 mm

100 °C (212 °F)

15096 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

534

35 mm

5AGXBA5H4F35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

10AX115U2F45I1MP

Altera

FPGA

Industrial

Ball

1932

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1932

3.65 mm

45 mm

45 mm

EP3C55F780I7

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

55856

Yes

1.25 V

55856

CMOS

377

1.2

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

100 °C (212 °F)

55856 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e0

472.5 MHz

20 s

377

220 °C (428 °F)

29 mm

5CGXBC4C7M11C8

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5SGXEA9K1H40C2LN

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

840000

Yes

.88 V

31700

CMOS

696

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

31700 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.9 mm

45 mm

No

696

45 mm

5AGXFA5G6F27C4

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

5AGXMB1H6F31I3

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

670 MHz

31 mm

5AGXMB1K4F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5CGXFC5D6F23C6N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP1S30B956C5ES

Altera

FPGA

Other

Ball

956

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

No

e0

EP1SGX25DF672C7ES

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3.5 mm

27 mm

No

e0

27 mm

5CGXFC9C6U19C7N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP3C16Q240I8N

Altera

FPGA

Gull Wing

240

FQFP

Square

Plastic/Epoxy

15408

Yes

1.25 V

CMOS

160

1.2

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.15 V

.5 mm

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

160

32 mm

EP4SE360H29I4

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

CMOS

488

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

14144 CLBS

Tin Lead

Bottom

S-PBGA-B780

4

3.4 mm

33 mm

No

e0

717 MHz

20 s

488

220 °C (428 °F)

33 mm

5SGSMD3E2H29I3L

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

236000

Yes

.88 V

8900

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

8900 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP1SGX40FF1020C7ES

Altera

FPGA

Other

Ball

1020

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e0

33 mm

5SGXEA3K2F35I2

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

340000

Yes

.93 V

12830

CMOS

432

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

12830 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

5CGXFC4A6M11A7N

Altera

FPGA

Automotive

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGTFD9D5F27C8N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXFC3D7U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5ASXFB3E4F35C6N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

500 MHz

35 mm

5CGXBC9B6F31C8

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

5AGXBB3H4F40C5

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

622 MHz

40 mm

5CGXFC4B7F23I7N

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5AGXFA3G4F27C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

5ASXMB5E6F40C4N

Altera

FPGA

Commercial Extended

Ball

1517

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

540

1.1

Grid Array

BGA1517,39X39,40

1.07 V

1 mm

85 °C (185 °F)

17434 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

5SGXEABK2H40I3L

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

952000

Yes

.88 V

35920

CMOS

696

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

35920 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.9 mm

45 mm

No

696

45 mm

5AGTFC7G3F35I5N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

10AS066K2F40E1SG

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

40 mm

5SGXMA9K3H40I3LN

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

840000

Yes

.88 V

31700

CMOS

696

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

31700 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.9 mm

45 mm

No

696

45 mm

5AGXBA5H4F27C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

10AX057K5F40E3SP

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

CMOS

696

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

696

40 mm

5AGXMB3H6F40C4

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

670 MHz

40 mm

5ASXMB3D6F35I3

Altera

FPGA

Industrial

No Lead

1152

BGA

Square

Plastic/Epoxy

350000

Yes

1.18 V

13207

TSMC

385

1.15

Grid Array

BGA1152,34X34,40

1.12 V

1 mm

100 °C (212 °F)

13207 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

EP1SGX25GF672I6N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

3.5 mm

27 mm

No

e1

27 mm

10AX027H3F34I2SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

10162

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

10162 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.35 mm

35 mm

No

384

35 mm

10AX027H2F35I1MP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5AGXMA7H6F35C5N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

5SGXMA5K2F40I2

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

490000

Yes

CMOS

696

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1517

No

696

5AGXFB1K4F35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5CGTFD5A5F23C7

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.