Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5CGXFC9A6U19A7N

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

301000

Yes

1.13 V

CMOS

240

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

No

240

19 mm

5AGXFB7K6F35I5

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5AGXMB1K6F35C5N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

5CGTFD7C5U19C6

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5AGXFA7H4F31C4N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

670 MHz

31 mm

5CEBA7U19I7

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP2AGZ225FF35I4

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

224000

Yes

.93 V

8960

554

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

100 °C (212 °F)

8960 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B1152

3.4 mm

35 mm

e0

554

35 mm

5CGXFC4A6M11C7

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5AGXBB3D4F40I3N

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e1

670 MHz

40 mm

EPB1400PC

Altera

FPGA

Commercial

Through-Hole

40

DIP

Rectangular

Plastic

No

CMOS

In-Line

DIP40,.6

Field Programmable Gate Arrays

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T40

No

e0

220 °C (428 °F)

5AGXMA3K6F31C6N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

500 MHz

31 mm

5CSEBA2U19C6S

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXBC5E6M13I7N

Altera

FPGA

Ball

383

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B383

1.1 mm

13 mm

13 mm

5CGXBC5D7F23C8N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5SEEBH40C3

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

952000

Yes

.88 V

35920

CMOS

696

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

35920 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.9 mm

45 mm

No

696

45 mm

5ASXFB5E6F40I5N

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

540

1.1

Grid Array

BGA1517,39X39,40

1.07 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

5AGXMA1G4F27C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

5AGXFA5H6F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5ASXFB5H4F40C4N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e1

670 MHz

40 mm

10AS057N2F40E1SG

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

CMOS

588

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

588

40 mm

EP3SE50F484I2LN

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

47500

Yes

CMOS

296

1.2/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B484

No

e1

100 MHz

296

10AX090U2F45I2LG

Altera

FPGA

Industrial

Ball

1932

BGA

Square

Plastic/Epoxy

900000

Yes

.93 V

CMOS

480

.9

0.9 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1932

3.65 mm

45 mm

No

480

45 mm

5CGXFC4F6F23C8N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

10AS032E2F27I1LP

Altera

FPGA

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

27 mm

EPF10K100EQC208-2DX

Altera

3

220 °C (428 °F)

EP2AGZ300CF40I4N

Altera

FPGA

Industrial

Ball

1517

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

3.5 mm

40 mm

e1

500 MHz

40 mm

EP2AGX190CF35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

181165

Yes

.93 V

7612

612

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

85 °C (185 °F)

7612 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e0

612

35 mm

EP2C70F896I7

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

68416

Yes

1.25 V

4300

CMOS

622

1.2

1.2,1.5/3.3,3.3 V

Grid Array

BGA896,30X30,40

Field Programmable Gate Arrays

1.15 V

1 mm

4300 CLBS

Tin Lead

Bottom

S-PBGA-B896

2.6 mm

31 mm

No

Also requires 3.3 V supply

e0

606

31 mm

5SGXEB6R3F43C2

Altera

FPGA

Other

Ball

1760

BGA

Square

Plastic/Epoxy

597000

Yes

.93 V

22540

CMOS

600

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

22540 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1760

3.4 mm

42.5 mm

No

600

42.5 mm

5ASXFB5H6F40I3

Altera

FPGA

Industrial

No Lead

1517

BGA

Square

Plastic/Epoxy

462000

Yes

1.18 V

17434

540

1.15

Grid Array

BGA1517,39X39,40

1.12 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

540

40 mm

5ASXFB5D6F35I3N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

462000

Yes

1.18 V

17434

TSMC

385

1.15

Grid Array

BGA1152,34X34,40

1.12 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

2.7 mm

35 mm

385

35 mm

EP2AGX260FF35C4

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

244188

Yes

CMOS

612

0.9,1.2/3.3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B1152

3

No

e0

20 s

612

220 °C (428 °F)

EP2AGX45FF29C6N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

5CGTFD7A5U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5SGXEA7N1F40I2

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

622000

Yes

.93 V

23472

CMOS

600

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

23472 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

600

40 mm

5CGXFC4B6M11C6N

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5ASXBB5D4F35C6

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

500 MHz

35 mm

5SGXEA5N3F40I3N

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

490000

Yes

.88 V

18500

CMOS

600

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

18500 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

600

40 mm

5CGXBC3F6U19I7N

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5AGXFA5D4F31C6

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

500 MHz

31 mm

10AS057H1F34E1LP

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

EP3C5U256C7

Altera

FPGA

Other

Ball

256

LFBGA

Square

Plastic/Epoxy

5136

Yes

1.25 V

5136

CMOS

182

1.2

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.15 V

.8 mm

85 °C (185 °F)

5136 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.5 mm

14 mm

No

e0

472.5 MHz

20 s

182

235 °C (455 °F)

14 mm

EP4CGX22CF14C8N

Altera

FPGA

Other

Ball

169

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array, Low Profile

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B169

1.55 mm

14 mm

14 mm

5SGXMA3K2F35C1

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

340000

Yes

CMOS

432

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

432

5AGXBA3D6F27I5N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

10AS027E4F29I3SG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

3

3.35 mm

29 mm

No

e1

30 s

360

245 °C (473 °F)

29 mm

10AS027E2F27I1SG

Altera

FPGA

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

27 mm

10M16DFU324A7G

Altera

FPGA

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.