Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5AGXBA5H4F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	500 MHz				27 mm
5CGXBC4C7U19C7	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
5CGXBC5A7M13I7N	Altera	FPGA		Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm						Bottom	S-PBGA-B383		1.1 mm	13 mm							13 mm
EP4SGX360HF35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	141440	CMOS	564	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		141440 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	4	3.6 mm	35 mm	No	e0	717 MHz	20 s	564	220 °C (428 °F)	35 mm
5AGXMA1K6F27I5N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz				27 mm
10AS027E2F27I1SP	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm							27 mm
EP1S25F672C7	Altera	FPGA	Commercial Extended	Ball	672	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	706	1.5	1.5,1.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		2852 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No	e0		20 s	706	220 °C (428 °F)	27 mm
5AGZME7K3F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz				35 mm
5CGXBC7B6F27I7N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5SGXEB6R1F43C1	Altera	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	597000	Yes	.93 V	22540	CMOS	600	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		22540 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.4 mm	42.5 mm	No				600		42.5 mm
5AGXBA5K6F31I5	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	622 MHz				31 mm
5CGXBC3D6F23I7N	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
5AGXBB7H4F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	500 MHz				35 mm
5ASXBB3E6F40I3	Altera	FPGA	Industrial	No Lead	1517	BGA	Square	Plastic/Epoxy	350000	Yes	1.18 V	13207	TSMC	540	1.15		Grid Array	BGA1517,39X39,40		1.12 V	1 mm	100 °C (212 °F)		13207 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					540		40 mm
5SGXMA4K3F40C4	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	420000	Yes			CMOS	696		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1517				No				696
5CGXBC5F6U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
5CGXFC4C6F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5CGXFC4C6U19C7N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No				240		19 mm
EP4SGX230HF35I2N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes		91200					Grid Array				1 mm			91200 CLBS			Bottom	S-PBGA-B1152		3.6 mm	35 mm							35 mm
5AGXFA7K4F31C6	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	500 MHz				31 mm
EP1S10F484C5N	Altera	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	10570	Yes	1.575 V	1200	CMOS	426	1.5	1.5,1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No	e1			426	245 °C (473 °F)	23 mm
EP4CE40F23C8	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.25 V	2475		331	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No	e0	472.5 MHz	20 s	331	220 °C (428 °F)	23 mm
EP2S30F672C3	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	33880	Yes	1.25 V	13552	CMOS	500	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	85 °C (185 °F)	4.45 ns	13552 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No	e0	717 MHz	20 s	492	220 °C (428 °F)	35 mm
5CSEMA4U23C82	Altera	FPGA		Ball	672	FBGA	Square	Plastic/Epoxy	40000	Yes			CMOS	124		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,26X26,32	Field Programmable Gate Arrays		.8 mm						Bottom	S-PBGA-B672				No				124
EP3SL200H780I2L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	200000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B780	1			No	e0	100 MHz		488
EP3C5U256I6N	Altera	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	5136	Yes	1.25 V		CMOS	182	1.2		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm					Tin Silver Copper	Bottom	S-PBGA-B256		1.5 mm	14 mm	No	e1			182		14 mm
5ASXFB3H4F31C6	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	500 MHz				31 mm
5ASXFB3H4F40C5N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e1	622 MHz				40 mm
10M08SFU169I7G	Altera	FPGA		Ball	169	BGA	Square	Plastic/Epoxy	8000	Yes			CMOS	130		3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays		.8 mm						Bottom	S-PBGA-B169				No				130
5ASXBB3D6F40C4	Altera	FPGA	Other	No Lead	1517	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207		540	1.1		Grid Array	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)		13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					540		40 mm
5CGXFC7E7F31C6N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm							31 mm
EP2AGZ225DF35I4	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	224000	Yes	.93 V	8960		554	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	100 °C (212 °F)		8960 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1152		3.4 mm	35 mm		e0			554		35 mm
5CGXBC7B6F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5AGXMA1H4F31I5N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm		e1	622 MHz				31 mm
10M50DAF672C8GES	Altera	FPGA
5CEFA4M13C6N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm							13 mm
10AS016E3F27I1SG	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V		CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm	No				240		27 mm
5CGXBC5D7M11I7	Altera	FPGA		Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm						Bottom	S-PBGA-B301		1.1 mm	11 mm							11 mm
5CGXBC4F6M13C8N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm							13 mm
5CEFA9F27C7	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5AGXFA3G4F27I5N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm		e1	622 MHz				27 mm
EP2AGX95FF35C6N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm		e1	500 MHz				35 mm
10AS032E2F27I2SP	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		11990 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672				No				240
10AX066N4F40I3LG	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V		CMOS	588	.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				588		40 mm
EP3SE260F780C2N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	255000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B780				No	e1	100 MHz		480
5SGXMA3K3F40C3	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	340000	Yes			CMOS	696		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1517				No				696
5SGXEB9R3H43I4N	Altera	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	840000	Yes	.88 V	31700	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		31700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4 mm	45 mm	No				600		45 mm
EP1S10B956C6ES	Altera	FPGA	Other	Ball	956	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B956				No	e0

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.