Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5CGXBC4A7F23A7N

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5AGXMA7K4F31C6

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

500 MHz

31 mm

5ASTMD3K3F40I5N

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e1

622 MHz

40 mm

EP4SGX360FF35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

CMOS

564

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

14144 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

3

3.4 mm

35 mm

No

e1

717 MHz

30 s

564

245 °C (473 °F)

35 mm

5CGXFC7C7F27A7

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

EP4SGX180DF29C3

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

175750

Yes

.93 V

7030

CMOS

372

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

7030 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

4

3.5 mm

29 mm

No

e0

717 MHz

20 s

372

220 °C (428 °F)

29 mm

10AS027H3F35E2SG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

384

35 mm

10AS032H4F35I3LG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

384

35 mm

10AS032E2F29I2LG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

EPF10K30EQC208-2DX

Altera

3

220 °C (428 °F)

EP1S40F484I5

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B484

No

e0

5AGXMA1H4F27I3N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

670 MHz

27 mm

EP3CLS150F780

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.25 V

47

1.2

Grid Array

1.15 V

1 mm

47 CLBS

Bottom

S-PBGA-B780

2.4 mm

29 mm

29 mm

EP2AGZ300CF29I3

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

298000

Yes

.93 V

11920

281

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

11920 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

281

29 mm

5SGXEB5R2F40I2LN

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

490000

Yes

.88 V

18500

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

18500 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

432

40 mm

5CGXFC3D7F23C7N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5SGSMD6N2F45C3

Altera

FPGA

Ball

1932

BGA

Square

Plastic/Epoxy

583000

Yes

CMOS

840

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1932

No

840

EP1S60F1508I6ES

Altera

FPGA

Ball

1508

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B1508

No

e0

5CGXBC4B7F23C6

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5AGXFA1K4F31I5N

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

622 MHz

31 mm

5SGSMD4K2F40C2N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

360000

Yes

.93 V

13584

CMOS

696

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

13584 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

696

40 mm

5AGXMA1G4F27I5

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

622 MHz

27 mm

5ASXFB5D4F40C4N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e1

670 MHz

40 mm

10AX115K2F36I1MP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5CGXBC4C7F27C7N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXBC5D6F27C8N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5CGXBC4A7F27C8N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

EP4SE530H35C3NES

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

21248

.9

Grid Array

.87 V

1 mm

85 °C (185 °F)

21248 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B

3.7 mm

42.5 mm

No

e1

717 MHz

42.5 mm

5SGXMB5R3F43C2

Altera

FPGA

Ball

1760

BGA

Square

Plastic/Epoxy

490000

Yes

CMOS

600

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1760

No

600

EP1S30B956C5

Altera

FPGA

Commercial Extended

Ball

956

BGA

Square

Plastic/Epoxy

32470

Yes

1.575 V

3819

CMOS

726

1.5

1.5,1.5/3.3 V

Grid Array

BGA956,31X31,50

Field Programmable Gate Arrays

1.425 V

1.27 mm

85 °C (185 °F)

3819 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B956

3

3.5 mm

40 mm

No

e0

20 s

726

220 °C (428 °F)

40 mm

10AX032E5F27I3SG

Altera

FPGA

Industrial

Ball

672

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

27 mm

5CGXFC9F6F23C7N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5AGXMB3D6F31C4N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

670 MHz

31 mm

5CGXBC9E6F23C8

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

10AS027H4F34I3SG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

No

384

35 mm

10M25DFF256I7G

Altera

FPGA

Ball

256

BGA

Square

Plastic/Epoxy

25000

Yes

CMOS

178

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B256

No

e1

178

EP1K50FI484-3F

Altera

FPGA

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

2880

Yes

CMOS

249

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B484

3

No

e0

249

220 °C (428 °F)

EP2SGX130GF1508I3

Altera

FPGA

Industrial

Ball

1508

BGA

Square

Plastic/Epoxy

132540

Yes

1.25 V

132540

CMOS

734

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA1508,39X39,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

3.139 ns

132540 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B1508

3.5 mm

40 mm

No

e0

622.08 MHz

734

40 mm

5CSEMA5U23C6SN

Altera

FPGA

Other

Ball

672

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

23 mm

10M25DFF484C7

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

10M50DFF256C8G

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

50000

Yes

CMOS

178

1.2

1.2 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

No

e1

178

5CEFA4U19C8N

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

48000

Yes

1.13 V

CMOS

304

1.1

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

No

304

19 mm

5AGXFB3K6F40C6N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e1

500 MHz

40 mm

10AS027H4F35E3SP

Altera

FPGA

Ball

1152

BGA

Square

Plastic

270000

Yes

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

384

5CGXBC7A7F23C8N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP3SL260F1152I2L

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

CMOS

736

1.2/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

100 MHz

736

5CGXFC7B6F23A7N

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5ASXBB5G4F35I5N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.