Altera Field Programmable Gate Arrays (FPGA) 2,400+

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5AGXMA5G4F31C4N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

190000

Yes

1.13 V

CMOS

384

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA896,30X30,40

Field Programmable Gate Arrays

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B896

3

2.7 mm

31 mm

No

e1

670 MHz

384

31 mm

5CGXBC7D7U19C6

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

10M02SCM153A7G

Altera

FPGA

Automotive

Ball

153

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B153

EP4S100G5H40I3

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

531200

Yes

.98 V

212480

CMOS

654

.95

0.95,1.2/3,1.5,2.5 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.92 V

1 mm

212480 CLBS

Tin Lead

Bottom

S-PBGA-B

4

3.8 mm

42.5 mm

No

e0

717 MHz

20 s

654

220 °C (428 °F)

42.5 mm

5AGXMB3K6F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5CGXFC7F6F23I7

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

10AX057K2F35I1MG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

EP1S30F1508I7ES

Altera

FPGA

Ball

1508

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B1508

No

e0

10AS057K4F40I3SG

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

CMOS

696

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

696

40 mm

10AS057H2F34I1MG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

5CGXFC5D7U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5ASXBB5G6F31I3N

Altera

FPGA

Industrial

Ball

896

BGA

Square

Plastic/Epoxy

462000

Yes

1.18 V

17434

TSMC

250

1.15

Grid Array

BGA896,30X30,40

1.12 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B896

2.7 mm

31 mm

250

31 mm

5CGXBC4E7M13C6

Altera

FPGA

Other

Ball

383

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B383

1.1 mm

13 mm

13 mm

10AX027E5F27E3SG

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

27 mm

5SGSMD8K3F40C2

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

695000

Yes

CMOS

696

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1517

No

696

10M16DFU324I6G

Altera

FPGA

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B324

5SEE9H40C2

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

840000

Yes

.93 V

31700

CMOS

696

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

31700 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.9 mm

45 mm

No

696

45 mm

EP20K100EFI144-1

Altera

FPGA

Ball

144

BGA

Square

Plastic/Epoxy

4160

Yes

CMOS

85

1.8,1.8/3.3 V

Grid Array

BGA144,12X12,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B144

3

No

85

220 °C (428 °F)

EP2AGZ225HF40I3

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

224000

Yes

.93 V

8960

734

0.9

Grid Array

BGA1517,39X39,40

.87 V

1 mm

100 °C (212 °F)

8960 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B1517

3.5 mm

40 mm

e0

734

40 mm

5CGXFC9A6F31C6N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

EP4CGX30DF23C8N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2.4 mm

23 mm

23 mm

5AGXMA3K4F31C4N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

670 MHz

31 mm

5CGXFC5E6M11C7N

Altera

FPGA

Other

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5CGXBC7A7F27C6N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5ASXBB3G4F31C4

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

670 MHz

31 mm

EP2AGX45DF29C5

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

42959

Yes

CMOS

364

0.9,1.2/3.3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B780

3

No

e0

20 s

364

220 °C (428 °F)

EP2AGX45FU17C4N

Altera

FPGA

Other

Ball

358

LFBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Low Profile, Fine Pitch

.87 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B358

1.7 mm

17 mm

e1

500 MHz

17 mm

5ASXMB5H4F35C5N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

5CGXBC7D7U19C7

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

10M40DCF256C7

Altera

FPGA

Other

Ball

256

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B256

5AGXBB5G6F40I3

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

670 MHz

40 mm

5AGXBB5G6F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5CGXBC4A7M11I7

Altera

FPGA

Ball

301

TFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Thin Profile, Fine Pitch

1.07 V

.5 mm

Bottom

S-PBGA-B301

1.1 mm

11 mm

11 mm

5AGXMA1G6F31I5

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

622 MHz

31 mm

5ASXFB5H4F40I5

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

622 MHz

40 mm

5CGXFC4D7F27A7N

Altera

FPGA

Automotive

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5AGXFB7K6F40C6N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

504000

Yes

1.13 V

CMOS

704

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

3

2.7 mm

40 mm

No

e1

500 MHz

704

40 mm

5AGXMA3D4F31I5

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

622 MHz

31 mm

5AGXMB1K6F40C5

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

622 MHz

40 mm

EP2AGX125FF35I5N

Altera

FPGA

Industrial

Ball

1152

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e1

500 MHz

35 mm

5SGXEA7K1F40C2

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

622000

Yes

.93 V

23472

CMOS

696

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

23472 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

696

40 mm

5CGXBC9D7F27I7

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5SGXEB6R3F40C3

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

597000

Yes

.88 V

22540

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

22540 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

432

40 mm

5AGXMB5H4F40C5

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

622 MHz

40 mm

5AGXFB3G6F31I5N

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

622 MHz

31 mm

5CSEBA4U19C6S

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5SGXEBBR2H43I2L

Altera

FPGA

Industrial

Ball

1760

BGA

Square

Plastic/Epoxy

952000

Yes

.88 V

35920

CMOS

600

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

35920 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1760

4 mm

45 mm

No

600

45 mm

EP2AGX95CF25I3

Altera

FPGA

Industrial

Ball

572

BGA

Square

Plastic/Epoxy

89178

Yes

.93 V

3747

260

0.9

Grid Array

BGA572,24X24,40

.87 V

1 mm

100 °C (212 °F)

3747 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B572

2.2 mm

25 mm

e0

260

25 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.