Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP2S60F484C5N	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	24176	CMOS	334	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.962 ns	24176 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No	e1	640 MHz	30 s	326	245 °C (473 °F)	23 mm
5CGXBC4B6F23C7	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
5CGXBC7F7F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
10AX027E1F29E1MG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm							29 mm
10AS057K3F40E2LP	Altera	FPGA		Ball	1517	BGA	Square	Plastic	570000	Yes			CMOS	696	.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1517				No				696
5CGXFC7C7U19C6	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
EP4CE75F29I8LN	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	75408	Yes	1.03 V	4713		429	1	1,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.97 V	1 mm			4713 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No	e1	362 MHz	30 s	429	260 °C (500 °F)	29 mm
5ASXMB5D6F35C6	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)		17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm					385		35 mm
5CGTFD5A5U19A7N	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
5SGXEA7K3F40I4	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	696	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		23472 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				696		40 mm
5AGXFA7G6F35C6	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	500 MHz				35 mm
10M25DFF672C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes							Grid Array					85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672
5CGXBC9D7F31I7N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B896		2 mm	31 mm							31 mm
5AGXFB5H6F40C5N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e1	622 MHz				40 mm
10AX057K4F35I3LP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V	21708	CMOS	396	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		21708 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No				396		35 mm
EP2AGX95EF35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	89178	Yes			CMOS	452		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1152	3			No	e0		20 s	452	220 °C (428 °F)
5CGXBC4D7M11C6N	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm							11 mm
5SGXMB6R1F40C2	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	597000	Yes			CMOS	432		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1517				No				432
5CGXFC7F6F23C7N	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
5CGTFD7B5F31C7N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm							31 mm
5CSEMA5U23C82	Altera	FPGA		Ball	672	FBGA	Square	Plastic/Epoxy	85000	Yes			CMOS	124		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,26X26,32	Field Programmable Gate Arrays		.8 mm						Bottom	S-PBGA-B672				No				124
5CGXFC5C6M13C7N	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	175	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm	No				175		13 mm
5CGXBC4E7F23C8N	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
5SGSMD6K2F40I2	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	583000	Yes			CMOS	696		0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1517				No				696
5CGXBC5F7M11A7N	Altera	FPGA	Automotive	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm							11 mm
EP1S25F1020I6N	Altera	FPGA		Ball	1020	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V		CMOS	702	1.5	1.5,1.5/3.3 V	Grid Array	BGA1020,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm					Tin/Silver/Copper	Bottom	S-PBGA-B1020	3			No	e1		40 s	702	245 °C (473 °F)
10AX016C5U19E3SG	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Fine Pitch			.87 V	.8 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		3.25 mm	19 mm							19 mm
5AGXBB7H6F40C5N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e1	622 MHz				40 mm
5CEBA7F31A7	Altera	FPGA	Automotive	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B896		2 mm	31 mm							31 mm
EP2SGX130GF1508I5	Altera	FPGA	Industrial	Ball	1508	BGA	Square	Plastic/Epoxy	132540	Yes	1.25 V	132540	CMOS	734	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	4.006 ns	132540 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1508		3.5 mm	40 mm	No	e0	622.08 MHz		734		40 mm
5AGXBA5H6F35C4N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	670 MHz				35 mm
5CGXFC7E6U19C7N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
5AGXBB5H6F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	500 MHz				35 mm
5ASTFD3E3F35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	622 MHz				35 mm
5CGXFC7A6F23C8N	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
5AGXFB5H6F35C5N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	622 MHz				35 mm
5CSEBA4U19A7S	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
5SEE9F45I3	Altera	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	840000	Yes	.88 V	31700	CMOS	840	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		31700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No				840		45 mm
10AS066H3F34E2SG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V		CMOS	492	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm	No				492		35 mm
EP4SGX230FF35M3N	Altera	FPGA	Military	Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120		564	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	125 °C (257 °F)		9120 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.4 mm	35 mm					564		35 mm
10AX115H5F34E3SP	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V		CMOS	504	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm	No				504		35 mm
5AGXBB7G6F35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	622 MHz				35 mm
5CGXFC5B7M11C7	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm							11 mm
5CSEMA2U19I72	Altera	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	25000	Yes			CMOS	66		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm						Bottom	S-PBGA-B484				No				66
10AS057H1F34I1SG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm							35 mm
5AGXFA5K4F31C6N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm		e1	500 MHz				31 mm
5AGXMA7G6F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz				35 mm
5CGXBC9F6U19C7	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.