Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP2S30F484I5	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	33880	Yes			CMOS	342		1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm				Tin Lead	Bottom	S-PBGA-B484	3			No		e0			334	220 °C (428 °F)
10AS027E1F29E1LG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
5AGXFA1G6F31C4	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	670 MHz				31 mm
10AX090S2F45I1SG	Altera	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm								45 mm
10AX090N2F45E2SG	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V		CMOS	768	.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm	No					768		45 mm
5CSEMA2U19C8N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5AGXMA1H6F31I5N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	622 MHz				31 mm
5SGXEA4K2F40I2LN	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	420000	Yes	.88 V	15850	CMOS	696	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	15850 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					696		40 mm
5CGXFC5E6F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5AGZME7E3F35I3L	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	450000	Yes	1.18 V	16980	TSMC	534	1.15		Grid Array	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)	16980 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						534		35 mm
5CGTFD9E5F35C7	Altera	FPGA		Ball	1152	BGA	Square	Plastic	301000	Yes			CMOS	560		1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1152				No					560
5AGXFA5H4F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	190000	Yes	1.13 V		CMOS	544	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm	No		e0	622 MHz		544		35 mm
5ASXFB5H6F35C4N	Altera	FPGA	Commercial Extended	Ball	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						385		35 mm
EP4SGX290NF45I2	Altera	FPGA		Ball	1932	BGA	Square	Plastic/Epoxy		Yes		116480					Grid Array				1 mm		116480 CLBS			Bottom	S-PBGA-B1932		3.6 mm	45 mm								45 mm
5AGXFB3G6F31C4	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	670 MHz				31 mm
5CGXFC7B7F27I7N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5AGXMA5H4F31C4N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	670 MHz				31 mm
5SGXMB5R2F40C3	Altera	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	490000	Yes			CMOS	432		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1517				No					432
5CGXBC5F6F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5AGXFA1D6F31I5	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	622 MHz				31 mm
5AGXFB1D4F31I5N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	622 MHz				31 mm
5AGXFA3K6F27C5N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	622 MHz				27 mm
5CGTFD9E5F23A7	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
EP2C5F256C8	Altera	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4608	Yes	1.25 V	288	CMOS	158	1.2	1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	288 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e0	402.5 MHz	20 s	150	235 °C (455 °F)	17 mm
5AGXFA5K4F27C4N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	670 MHz				27 mm
5SGXEABN1F45C2LN	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	952000	Yes	.88 V	35920	CMOS	840	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	35920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
5AGXMA3D4F31C5N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	156000	Yes	1.13 V		CMOS	416	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.7 mm	31 mm	No		e1	622 MHz		416		31 mm
5AGXBA5D6F27I3N	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	670 MHz				27 mm
5ASXMB5H6F40C5N	Altera	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	540	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm
EP2AGZ350EF29C4N	Altera	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
EP3SL70F780I2L	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	67500	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm				Tin Lead	Bottom	S-PBGA-B780	1			No		e0	100 MHz		488
10M16SAE144I7	Altera	FPGA		Gull Wing	144	QFP	Square	Plastic/Epoxy		Yes							Flatpack									Quad	S-PQFP-G144
EP1S80B672I5	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V					Tin Lead	Bottom	S-PBGA-B672				No		e0
5ASTMD3E3F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
5CGXFC9A7F31C6	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm								31 mm
EP1K50FI256-1P	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No		e0			186	220 °C (428 °F)
5CGXFC4A6M11C8	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm								11 mm
5SGXMA5K2F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	490000	Yes			CMOS	432		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1152				No					432
EP3SL200H780I2N	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	200000	Yes			CMOS	488		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays		1 mm				Tin Silver Copper	Bottom	S-PBGA-B780				No		e1	100 MHz		488
EP2AGZ300FF29I4N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm			e1	500 MHz				29 mm
5AGZME3H2F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
5SGXEB6R3F40I3	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	597000	Yes	.88 V	22540	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	22540 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					432		40 mm
5AGXFB5G6F40C4	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e0	670 MHz				40 mm
5CGXFC4B7M11I7	Altera	FPGA		Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm					Bottom	S-PBGA-B301		1.1 mm	11 mm								11 mm
5AGZME3H2F35I3LN	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584		414	0.85		Grid Array	BGA1152,34X34,40		.82 V	1 mm	100 °C (212 °F)	13584 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	4	3.5 mm	35 mm			e1		30 s	414	245 °C (473 °F)	35 mm
5CGXFC7B6U19I7N	Altera	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm					Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXBC9A6U19I7N	Altera	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm					Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5ASXMB5E6F31C5	Altera	FPGA	Other	No Lead	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434		250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						250		31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.