Altera Field Programmable Gate Arrays (FPGA) 2,400+

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP1S20F484I7ES

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B484

No

e0

EP2AGX95EF35C5

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

89178

Yes

CMOS

452

0.9,1.2/3.3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B1152

3

No

e0

20 s

452

220 °C (428 °F)

10AX066N3F40I2LG

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

660000

Yes

.93 V

CMOS

588

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

588

40 mm

5CGXBC4F7F23A7N

Altera

FPGA

Automotive

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5AGXFB1D4F35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5AGXFA3H6F27C4

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

5AGXFA7K4F27C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

10AX057H1F34E1LG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

10AX057N1F40E1LP

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

40 mm

5SGSED6K3F40C2

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

583000

Yes

.93 V

22000

CMOS

696

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

22000 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

696

40 mm

5CSEMA5U19C62

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

85000

Yes

CMOS

66

1.1,1.2/3.3,2.5 V

Grid Array, Fine Pitch

BGA484,22X22,32

Field Programmable Gate Arrays

.8 mm

Bottom

S-PBGA-B484

No

66

EP1S30B672C7

Altera

FPGA

Commercial Extended

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

No

e0

5CGXBC7F7U19I7N

Altera

FPGA

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC5D7F23C6N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5AGXMA7K6F35I5

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5AGXFB7H4F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

503500

Yes

1.13 V

CMOS

544

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

No

e0

622 MHz

544

35 mm

EP2AGX125CF25I5N

Altera

FPGA

Industrial

Ball

572

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B572

2.2 mm

25 mm

e1

500 MHz

25 mm

10M08DFU324A7G

Altera

FPGA

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

Yes

Grid Array

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

EPF10K30EFI484-1DX

Altera

3

220 °C (428 °F)

5CSEMA5U23A7SN

Altera

FPGA

Automotive

Ball

672

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B672

1.85 mm

23 mm

23 mm

EP3SL200F1517C4N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

200000

Yes

.94 V

CMOS

976

.9

1.2/3.3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

4

3.9 mm

40 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

717 MHz

30 s

976

245 °C (473 °F)

40 mm

EP3SE80F780I2LN

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

80000

Yes

CMOS

488

1.2/3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B780

No

e1

100 MHz

488

5ASXBB3D4F35I5

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5CGXBC9D6F31C8

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

5SGXMB6R2F43I3

Altera

FPGA

Ball

1760

BGA

Square

Plastic/Epoxy

597000

Yes

CMOS

600

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1760

No

600

5AGXFB1G6F40C6N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e1

500 MHz

40 mm

EP4CGX150DF27I7

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

149760

Yes

1.25 V

393

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.15 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

3

2.4 mm

27 mm

No

e0

20 s

393

220 °C (428 °F)

27 mm

5SGSMD4E3H29C2LN

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

360000

Yes

.88 V

13584

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

13584 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

5SGXMA9N3F45C3

Altera

FPGA

Ball

1932

BGA

Square

Plastic/Epoxy

840000

Yes

CMOS

840

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1932

No

840

EP4SGX360KF43C4N

Altera

FPGA

Other

Ball

1760

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

141440

CMOS

880

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

141440 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1760

3

3.7 mm

42.5 mm

No

e1

717 MHz

30 s

880

245 °C (473 °F)

42.5 mm

EP4CGX75CF23C8

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

73920

Yes

1.24 V

4620

290

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.16 V

1 mm

85 °C (185 °F)

4620 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.4 mm

23 mm

No

e0

472.5 MHz

20 s

290

220 °C (428 °F)

23 mm

5CGXFC5F6U19A7N

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5AGXMA7H6F27I3

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

5CGXBC5E7F23C6N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5AGXFB3H6F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

EP1S25B672I7ES

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B672

No

e0

5SGXMA5N3F40

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

Grid Array

1 mm

Bottom

S-PBGA-B1517

3.4 mm

40 mm

12.5 MHz

40 mm

5AGXMA1H6F31C4N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

670 MHz

31 mm

5CGXBC7B6F23C7

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

EP1AGX50DF484I6N

Altera

FPGA

Industrial

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.25 V

50160

1.2

Grid Array

1.15 V

1 mm

100 °C (212 °F)

50160 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B484

2.44 mm

23 mm

No

23 mm

EP4CGX110DF23C7N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.25 V

1.2

Grid Array

1.15 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2.4 mm

23 mm

23 mm

5ASXFB5H6F31I5

Altera

FPGA

Industrial

No Lead

896

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

250

1.1

Grid Array

BGA896,30X30,40

1.07 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B896

2.7 mm

31 mm

250

31 mm

10AX048E4F29I3SG

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

360

.9

0.9 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

No

360

29 mm

5ASXBB3G4F35C5N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

5ASXBB3G4F40C4

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e0

670 MHz

40 mm

5ASXBB5H6F35C4N

Altera

FPGA

Commercial Extended

Ball

1152

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

85 °C (185 °F)

17434 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

2.7 mm

35 mm

385

35 mm

5ASXMB3H4F31C6N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

500 MHz

31 mm

5AGXBB3D6F40C4N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e1

670 MHz

40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.