Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5CGXBC3D6U19C7	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
10AX057H2F34I2SP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V	21708	CMOS	492	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	21708 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					492		35 mm
10M40DAF256I7	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B256
5AGXBA1G6F27C5N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.7 mm	27 mm			e1	622 MHz				27 mm
5CGXBC5D6M11A7	Altera	FPGA	Automotive	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm								11 mm
10AX057H2F34I1LP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
5CGXFC5D6F27C8	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
10AX032E5F29I3SG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
5AGTFD3G3F31I5N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm			e1	622 MHz				31 mm
5SGXMA3E2H29C1N	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	340000	Yes	.93 V	12830	CMOS	360	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	12830 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.6 mm	33 mm	No					360		33 mm
5AGXMA5G4F31C4	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	670 MHz				31 mm
EP4SE360F35C3N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	141440	CMOS	744	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	141440 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	4	3.6 mm	35 mm	No		e1	717 MHz	30 s	744	245 °C (473 °F)	35 mm
5CEFA4U15C8N	Altera	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Low Profile, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm								15 mm
10M16SCU169I6G	Altera	FPGA		Ball	169	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Bottom	S-PBGA-B169
EP2C8Q208I7N	Altera	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	8256	Yes	1.25 V	540	CMOS	138	1.2	1.2,1.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm		540 CLBS		Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Also requires 3.3 V supply	e3			130		28 mm
EP1S80F780I7ES	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V					Tin Lead	Bottom	S-PBGA-B780				No		e0
EP1S25F780C7N	Altera	FPGA	Commercial Extended	Ball	780	BGA	Square	Plastic/Epoxy	25660	Yes	1.575 V	2852	CMOS	706	1.5	1.5,1.5/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	2852 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.5 mm	29 mm	No		e1		30 s	706	245 °C (473 °F)	29 mm
5AGXMA5K6F31I3	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	670 MHz				31 mm
EP1S40F1508I5	Altera	FPGA		Ball	1508	BGA	Square	Plastic/Epoxy	41250	Yes	1.575 V		CMOS	822	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm				Tin Lead	Bottom	S-PBGA-B1508	3			No		e0			822	220 °C (428 °F)
5CSEMA5U23C8S	Altera	FPGA	Other	Ball	672	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm								23 mm
5AGXFB5D4F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
5CGXFC5C7M13C8	Altera	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	175	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm	No					175		13 mm
5CEBA2F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm								23 mm
5ASTFD5E3F31C6	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	503500	Yes			CMOS	178		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B896				No					178
5ASXBB3E6F31C6	Altera	FPGA	Other	No Lead	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm						250		31 mm
5AGXFA1K4F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm			e0	500 MHz				27 mm
EP1S20F484C6ES	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V		85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484				No		e0
5CGXFC4E6F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5CGXFC4E6M11C6	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm								11 mm
5AGXFA7H6F35C5N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	622 MHz				35 mm
10AS032H4F34I3LP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	CMOS	384	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	11990 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					384		35 mm
5SGXMB5R3F40I3N	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	18500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					432		40 mm
10AS066N3F40I2SGES	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm								40 mm
5CGXFC4B6M11C6	Altera	FPGA	Other	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm								11 mm
5AGXBB1G6F40C6	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e0	500 MHz				40 mm
5SGSMD6N3F45C2LN	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	583000	Yes	.88 V	22000	CMOS	840	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	22000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
5ASXFB5E4F35C4N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
10AX032E3F27I2LG	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V		CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm	No					240		27 mm
5AGXBA1K4F31C5	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	622 MHz				31 mm
10AX027E5F29I3SG	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm								29 mm
EP4S40G5H40C2	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes		212480					Grid Array				1 mm	85 °C (185 °F)	212480 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B		3.8 mm	42.5 mm								42.5 mm
5AGXFB1K4F40C5N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm			e1	622 MHz				40 mm
5AGXFB1K4F31I5	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm			e0	622 MHz				31 mm
5SGXEB9R2H43C2LN	Altera	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	840000	Yes	.88 V	31700	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	31700 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		4 mm	45 mm	No					600		45 mm
5AGZME7H3F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
5CGXFC7A7U19C8N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm								19 mm
5CGXBC7F6F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm								27 mm
5ASXFB5G6F40I5	Altera	FPGA	Industrial	No Lead	1517	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434		540	1.1		Grid Array	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)	17434 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						540		40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.