Altera Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10AX090N2F45I2SP	Altera	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	CMOS	768	.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		33962 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No				768		45 mm
EP2AGZ400EF40I3N	Altera	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm			500 MHz				40 mm
5AGXFA7K6F31I3	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	670 MHz				31 mm
5CGTFD9E5U19A7	Altera	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
10AX032E3F27I2SG	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V		CMOS	240	.9	0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm	No				240		27 mm
5CGXFC5D7F23C8	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
5CGXFC9E6U19C7N	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
5AGXBA5K4F27C6	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	500 MHz				27 mm
10M50DFF256I6G	Altera	FPGA		Ball	256	BGA	Square	Plastic/Epoxy		Yes							Grid Array									Tin Silver Copper	Bottom	S-PBGA-B256					e1
10M16SAU169I7	Altera	FPGA		Ball	169	BGA	Square	Plastic/Epoxy	16000	Yes			CMOS	130		3/3.3 V	Grid Array	BGA169,13X13,32	Field Programmable Gate Arrays		.8 mm						Bottom	S-PBGA-B169				No				130
5AGXFA7D4F31C6	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	500 MHz				31 mm
5AGXFA7D4F27C4	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	242950	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm	No	e0	670 MHz		336		27 mm
5AGXBB7K6F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	622 MHz				35 mm
5AGXBA3D6F31I3N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B896		2.7 mm	31 mm		e1	670 MHz				31 mm
5CGXFC4F6F27A7N	Altera	FPGA	Automotive	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5CGXBC5A6M11A7N	Altera	FPGA	Automotive	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm							11 mm
EP2AGX190EF29I3	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	181165	Yes	.93 V	7612		372	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	100 °C (212 °F)		7612 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B780		2.6 mm	29 mm		e0			372		29 mm
5AGTMC7G3F35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	622 MHz				35 mm
5SGXEB6R3F43C3N	Altera	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	597000	Yes	.88 V	22540	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		22540 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.4 mm	42.5 mm	No				600		42.5 mm
5SGXEA5N2F45C1	Altera	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	490000	Yes	.93 V	18500	CMOS	840	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		18500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No				840		45 mm
5AGXFB1K6F40C4N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e1	670 MHz				40 mm
5AGXBB5G6F35I5	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	622 MHz				35 mm
10AS048E2F29I1MP	Altera	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm							29 mm
5SGTMC5K2F40C1N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	425000	Yes	.93 V	16040	CMOS	600	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		16040 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				600		40 mm
EP2S130F1508C5	Altera	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy	132540	Yes	1.25 V	53016	CMOS	1126	1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.962 ns	53016 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No	e0	640 MHz	20 s	1118	220 °C (428 °F)	40 mm
10AS022E3F29E1SG	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V		CMOS	288	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No				288		29 mm
EP4SE360H29M3N	Altera	FPGA	Military	Ball	780	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144	TSMC	488	0.9		Grid Array	BGA780,28X28,40		.87 V	1 mm	125 °C (257 °F)		14144 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B780		3.4 mm	33 mm					488		33 mm
5SGXMBBR2H43I3	Altera	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	952000	Yes			CMOS	600		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1760				No				600
5CGXFC9A7F31I7N	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm						Bottom	S-PBGA-B896		2 mm	31 mm							31 mm
EP1K10FI256-2F	Altera	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes			CMOS	136		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No	e0			136	220 °C (428 °F)
5CGTFD7F5F31C6N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm							31 mm
5ASXMB3E6F31C4	Altera	FPGA	Other	No Lead	896	BGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207		250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)		13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
5CSEMA5U23A7S	Altera	FPGA	Automotive	Ball	672	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm							23 mm
5AGXBB3D4F31C5	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	622 MHz				31 mm
5SGXEB5R2F40C2N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	490000	Yes	.93 V	18500	CMOS	432	.9	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		18500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				432		40 mm
5CGXBC9F7F23C7	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
5AGXFA1D4F27C5	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	622 MHz				27 mm
5CSTFD5D5F31C7N	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm							31 mm
5CSXFC5C6U23C6N	Altera	FPGA	Other	Ball	672	FBGA	Square	Plastic/Epoxy	85000	Yes	1.13 V		CMOS	145	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,28X28,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm	No				145		23 mm
EP3SL260F1152C4L	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes			CMOS	736		1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm						Bottom	S-PBGA-B1152				No		100 MHz		736
5AGZME7H3F40C4N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e1	670 MHz				40 mm
5SGXEABK2H40C3	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	952000	Yes	.88 V	35920	CMOS	696	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		35920 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.9 mm	45 mm	No				696		45 mm
EP2AGX95DF25C5N	Altera	FPGA	Other	Ball	572	HBGA	Square	Plastic/Epoxy	89178	Yes	.93 V	93675	CMOS	260	.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA572,24X24,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		93675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B572	3	2.2 mm	25 mm	No	e1	500 MHz	30 s	260	260 °C (500 °F)	25 mm
5CGXBC7B7U19C6	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
5CGTFD7E5F27C6N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
EP20K400CF672I9	Altera	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	16640	Yes			CMOS	480		1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B672	3			No	e0			480	220 °C (428 °F)
5CGXBC4F7M11A7	Altera	FPGA	Automotive	Ball	301	TFBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Thin Profile, Fine Pitch			1.07 V	.5 mm	125 °C (257 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B301		1.1 mm	11 mm							11 mm
10AS048E5F29E3SP	Altera	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V		CMOS	360	.9	0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No				360		29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.