Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5CGXFC4E6F27C8N	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm							27 mm
5SGXEBBR2H43I2	Altera	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	952000	Yes	.93 V	35920	CMOS	600	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	35920 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4 mm	45 mm	No				600		45 mm
10AS066K2F35I2SP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V	25168	CMOS	396	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	25168 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No				396		35 mm
5SGXEA4K3F40C4N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	420000	Yes	.88 V	15850	CMOS	696	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	15850 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				696		40 mm
5CGXFC3A6U19C8	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
5AGXMB5D6F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	670 MHz				35 mm
5CGXBC4D7F23C7N	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
5AGXBB7G6F40C5N	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		2.7 mm	40 mm		e1	622 MHz				40 mm
5AGXBB3G4F31I3	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	670 MHz				31 mm
10M16SFE144C7G	Altera	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy	16000	Yes			CMOS	101		3/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays		.5 mm	85 °C (185 °F)		0 °C (32 °F)		Quad	S-PQFP-G144				No				101
5CEFA2F23A7N	Altera	FPGA	Automotive	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
5CGXFC5D7U19I7N	Altera	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm					Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
5SGXMB6R2F43C3	Altera	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	597000	Yes			CMOS	600		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1760				No				600
5AGXFB3H4F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	362730	Yes	1.13 V		CMOS	544	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm	No	e1	500 MHz		544		35 mm
10AS027H2F34I1LP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm							35 mm
EP1K50FC256-3F	Altera	FPGA	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes			CMOS	186		2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		1 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3			No	e0			186	220 °C (428 °F)
EP20K1000EFI33-2X	Altera	FPGA		Ball	1020	BGA	Square	Plastic/Epoxy	38400	Yes			CMOS	700		1.8,1.8/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1020	3			No				700	220 °C (428 °F)
EP1K50TC144-1DX	Altera	FPGA	Commercial	Gull Wing	144	QFP	Square	Plastic/Epoxy	2880	Yes			CMOS	102		2.5,2.5/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays		.5 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3			No	e0			102	220 °C (428 °F)
EP1K30TC144-2X	Altera	FPGA	Commercial	Gull Wing	144	QFP	Square	Plastic/Epoxy	1728	Yes			CMOS	102		2.5,2.5/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays		.5 mm	70 °C (158 °F)		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3			No	e0			102	220 °C (428 °F)
5CGTFD9F5F23I7N	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
5ASXMB3E6F31C6	Altera	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207		250	1.1		Grid Array, Heat Sink/Slug	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
5SGXMB9R3H43I3LN	Altera	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	840000	Yes	.88 V	31700	CMOS	600	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	31700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		4 mm	45 mm	No				600		45 mm
5CEFA9U19C6	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
5AGXBA5G6F31C4	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	670 MHz				31 mm
EP2AGX65DF25I5	Altera	FPGA		Ball	572	BGA	Square	Plastic/Epoxy	60214	Yes			CMOS	252		0.9,1.2/3.3,1.5,2.5 V	Grid Array	BGA572,24X24,40	Field Programmable Gate Arrays		1 mm				Tin Lead	Bottom	S-PBGA-B572	3			No	e0		20 s	252	220 °C (428 °F)
EP1C6Q240I6ES	Altera	FPGA		Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	1.575 V	5980			1.5		Flatpack, Fine Pitch			1.425 V	.5 mm		5980 CLBS		Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	e0	405 MHz				32 mm
EP4CGX150CF23	Altera	FPGA		Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.24 V	47			1.2		Grid Array			1.16 V	1 mm		47 CLBS			Bottom	S-PBGA-B484		2.4 mm	23 mm							23 mm
5SGXEA7N2F45I2N	Altera	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	622000	Yes	.93 V	23472	CMOS	840	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	23472 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No				840		45 mm
5AGXBA5H4F31I3	Altera	FPGA		Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B896		2.7 mm	31 mm		e0	670 MHz				31 mm
5AGXBB1D6F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz				35 mm
EP20K200FI484-3X	Altera																											3								220 °C (428 °F)
EP1S10F780I7ES	Altera	FPGA		Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V					Tin Lead	Bottom	S-PBGA-B780				No	e0
5CGXFC5D6F23C7N	Altera	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm							23 mm
EP1SGX25CF1020C5ES	Altera	FPGA	Other	Ball	1020	BGA	Square	Plastic/Epoxy		Yes	1.575 V		CMOS		1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020		3.5 mm	33 mm	No	e0					33 mm
5AGXBA3H4F27C4	Altera	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672		2.7 mm	27 mm		e0	670 MHz				27 mm
5CGXBC4E7U19C8	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm							19 mm
EP2AGZ350FF40I4N	Altera	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517		3.4 mm	40 mm		e1	500 MHz				40 mm
5AGTFD7K3F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	622 MHz				35 mm
10AX090N1F40E1MP	Altera	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm							40 mm
10AX016E3F27I1MP	Altera	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B672		3.25 mm	27 mm							27 mm
5ASXMB5D6F31I5N	Altera	FPGA	Industrial	Ball	896	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	250	1.1		Grid Array	BGA896,30X30,40		1.07 V	1 mm	100 °C (212 °F)	17434 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					250		31 mm
10AS032H1F35E1MG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm							35 mm
EP2AGZ300DF29I4N	Altera	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm		e1	500 MHz				29 mm
EP3C40U484I6	Altera	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	39600	Yes	1.25 V		CMOS	331	1.2		Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm				Tin Lead	Bottom	S-PBGA-B484	1	2.05 mm	19 mm	No	e0			331		19 mm
5CSEBA6U23C7S	Altera	FPGA	Other	Ball	672	FBGA	Square	Plastic/Epoxy	110000	Yes	1.13 V		CMOS	145	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA672,28X28,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		1.85 mm	23 mm	No				145		23 mm
5CSXFC5D6F31C8	Altera	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	85000	Yes	1.13 V		CMOS	288	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm	No				288		31 mm
10AX048H2F34E2SP	Altera	FPGA		Ball	1152	BGA	Square	Plastic	480000	Yes			CMOS	492	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1152				No				492
5AGXBB1D6F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.13 V		CMOS	544	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No	e1	500 MHz		544		35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.