Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

EP20K200RI208-3V

Altera

FPGA

Gull Wing

208

QFP

Square

Plastic/Epoxy

8320

Yes

CMOS

138

2.5,2.5/3.3 V

Flatpack

QFP208,1.2SQ,20

Field Programmable Gate Arrays

.5 mm

Quad

S-PQFP-G208

No

138

220 °C (428 °F)

5SGXMA5K3F40

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

Grid Array

1 mm

Bottom

S-PBGA-B1517

3.4 mm

40 mm

12.5 MHz

40 mm

EP2AGZ300FF40C3N

Altera

FPGA

Other

Ball

1517

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

3.5 mm

40 mm

e1

500 MHz

40 mm

EP2AGX95EF35C5ES

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

93675

.9

Grid Array

.87 V

1 mm

85 °C (185 °F)

93675 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

500 MHz

35 mm

5CGXBC4C6F23C8N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5SGXEA5H2F35I2N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

490000

Yes

.93 V

18500

CMOS

552

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

18500 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

5AGZME3H3F35I4N

Altera

FPGA

EP2AGX45EF25C4

Altera

FPGA

Other

Ball

572

BGA

Square

Plastic/Epoxy

42959

Yes

.93 V

1805

252

0.9

Grid Array

BGA572,24X24,40

.87 V

1 mm

85 °C (185 °F)

1805 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B572

2.2 mm

25 mm

e0

252

25 mm

EP2AGX95CF29C5N

Altera

FPGA

Other

Ball

780

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

2.7 mm

29 mm

e1

500 MHz

29 mm

EP2AGX95FF35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

89178

Yes

.93 V

3747

452

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

85 °C (185 °F)

3747 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e0

452

35 mm

5AGXFA1D6F31C4N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

670 MHz

31 mm

EP1SGX10DF1020C6ES

Altera

FPGA

Other

Ball

1020

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1020

3.5 mm

33 mm

No

e0

33 mm

10M40DFF484I6G

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Tin Silver Copper

Bottom

S-PBGA-B484

e1

10AX115K3F36I2LG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

1150000

Yes

.93 V

CMOS

432

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

432

35 mm

10AX115S3F45I2LP

Altera

FPGA

Industrial

Ball

1932

BGA

Square

Plastic/Epoxy

1150000

Yes

.93 V

CMOS

624

.9

0.9 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1932

3.65 mm

45 mm

No

624

45 mm

5AGXBB3G4F35I5N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

HC20K1000FC672

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

38400

Yes

CMOS

500

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

No

e0

500

220 °C (428 °F)

5SGXMA5K2F40C1N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

490000

Yes

.93 V

18500

CMOS

696

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

18500 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

696

40 mm

5ASTFD5K3F31I3

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

670 MHz

31 mm

5AGXMB1G4F31I5

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

622 MHz

31 mm

5AGXFA5K4F27I3

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

670 MHz

27 mm

EP2C8AF256I8NES

Altera

FPGA

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1.25 V

516

1.2

Grid Array, Low Profile

1.15 V

1 mm

516 CLBS

Tin/Silver/Copper

Bottom

S-PBGA-B256

1.55 mm

17 mm

No

e1

402.5 MHz

40 s

260 °C (500 °F)

17 mm

EP2C8Q208C6N

Altera

FPGA

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.25 V

540

CMOS

1.2

Flatpack, Fine Pitch

1.15 V

.5 mm

85 °C (185 °F)

540 CLBS

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Also requires 3.3 V supply

e3

28 mm

5SGXEA7K3F35C3

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

622000

Yes

.88 V

23472

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

23472 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

5AGZME5E3F40I3N

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e1

670 MHz

40 mm

5SGXMA9K3H40I3

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

840000

Yes

CMOS

696

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1517

No

696

EP2AGZ300EF40I3N

Altera

FPGA

Industrial

Ball

1517

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

3.5 mm

40 mm

e1

500 MHz

40 mm

EPB1400DI

Altera

FPGA

Industrial

Through-Hole

40

DIP

Rectangular

Ceramic

No

CMOS

In-Line

DIP40,.6

Field Programmable Gate Arrays

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-XDIP-T40

No

e0

220 °C (428 °F)

5AGTFC7D3F31I5

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

622 MHz

31 mm

5CGXBC7C6F23C7N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

149500

Yes

1.13 V

CMOS

240

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2 mm

23 mm

No

e1

240

23 mm

5CGXBC9B6F23C8

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5AGXFA3K4F27C5N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

622 MHz

27 mm

5CGXFC7B7F27C8N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5AGXMB1D4F31C5

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

622 MHz

31 mm

10AS016E3F27E1LP

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

3.25 mm

27 mm

27 mm

5AGXBB3D6F31C5N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

622 MHz

31 mm

EP2AGX95FF29I5

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

89178

Yes

.93 V

3747

372

0.9

Grid Array

BGA780,28X28,40

.87 V

1 mm

100 °C (212 °F)

3747 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

2.6 mm

29 mm

e0

372

29 mm

EP4SGX530KH40I2N

Altera

FPGA

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

212480

Grid Array

1 mm

212480 CLBS

Bottom

S-PBGA-B1517

3.8 mm

42.5 mm

42.5 mm

5ASXFB5D4F40C5N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e1

622 MHz

40 mm

10AX066N1F40I1SP

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

40 mm

5CGXFC3C7F23C7

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

10AX057H1F34I1LG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

10AX057K2F40E2LP

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

CMOS

696

.9

0.9 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

696

40 mm

EP1S10F780I6ES

Altera

FPGA

Ball

780

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B780

No

e0

EP20K1500EFC33-2V

Altera

3

220 °C (428 °F)

5CGXBC4B6F23C7N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

10AS022E3F29E1LP

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B780

3.35 mm

29 mm

29 mm

10AS057K1F35E1MP

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.