Altera Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5CGXBC5B7F27C6

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

5SGXMA4H2F35C3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

420000

Yes

CMOS

552

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

552

EP4CE75F29C8

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

75408

Yes

1.25 V

4713

429

1.2

1.2,1.2/3.3,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

4713 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B780

3

2.4 mm

29 mm

No

e0

472.5 MHz

20 s

429

220 °C (428 °F)

29 mm

EP1K50TC144-1X

Altera

FPGA

Commercial

Gull Wing

144

QFP

Square

Plastic/Epoxy

2880

Yes

CMOS

102

2.5,2.5/3.3 V

Flatpack

QFP144,.87SQ,20

Field Programmable Gate Arrays

.5 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

No

e0

102

220 °C (428 °F)

EP1K100QC208-1X

Altera

FPGA

Commercial

Gull Wing

208

QFP

Square

Plastic/Epoxy

4992

Yes

CMOS

147

2.5,2.5/3.3 V

Flatpack

QFP208,1.2SQ,20

Field Programmable Gate Arrays

.5 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

No

e0

147

220 °C (428 °F)

10M08DFV81I7

Altera

FPGA

Ball

81

BGA

Square

Plastic/Epoxy

Yes

Grid Array

Bottom

S-PBGA-B81

EP20K400FC784-2

Altera

3

220 °C (428 °F)

EP2SGX30CF780I5

Altera

FPGA

Industrial

Ball

780

BGA

Square

Plastic/Epoxy

33380

Yes

1.25 V

33880

CMOS

361

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

4.006 ns

33880 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B780

3.5 mm

29 mm

No

e0

622.08 MHz

361

29 mm

5ASXBB5E6F35I3

Altera

FPGA

Industrial

No Lead

1152

BGA

Square

Plastic/Epoxy

462000

Yes

1.18 V

17434

TSMC

385

1.15

Grid Array

BGA1152,34X34,40

1.12 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

5CSEBA5U19C6S

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5AGXMA3H6F31C4

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B896

2.7 mm

31 mm

e0

670 MHz

31 mm

5SGXEA5K2F40I3

Altera

FPGA

Industrial

Ball

1517

BGA

Square

Plastic/Epoxy

490000

Yes

.88 V

18500

CMOS

696

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1517,39X39,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

18500 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

3.5 mm

40 mm

No

696

40 mm

EP1S60F484I6

Altera

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.575 V

CMOS

1.5

Grid Array

1.425 V

Tin Lead

Bottom

S-PBGA-B484

No

e0

5CGXFC7B6U19A7N

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

EP2AGX45CF25C6N

Altera

FPGA

Other

Ball

572

HBGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array, Heat Sink/Slug

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B572

2.2 mm

25 mm

e1

500 MHz

25 mm

5AGXMA1D4F27C4N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

75000

Yes

1.13 V

CMOS

336

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

2.7 mm

27 mm

No

e1

670 MHz

336

27 mm

5AGXFA1K4F27C4N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.7 mm

27 mm

e1

670 MHz

27 mm

5AGXBB1G6F35I3N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

10AX115S4F45I3SG

Altera

FPGA

Industrial

Ball

1932

BGA

Square

Plastic/Epoxy

1150000

Yes

.93 V

CMOS

624

.9

0.9 V

Grid Array

BGA1932,44X44,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1932

3.65 mm

45 mm

No

624

45 mm

5AGXFA7K6F31I3N

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

670 MHz

31 mm

5AGXMA7K4F35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5AGXFA7D6F35C5N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

5AGXBA3G4F31C6N

Altera

FPGA

Other

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

500 MHz

31 mm

EP4SGX360HF35C2N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

141440

CMOS

564

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

141440 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

4

3.6 mm

35 mm

No

e1

800 MHz

30 s

564

245 °C (473 °F)

35 mm

5CGXFC5F6F27C8N

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

EP3SL340F1760C3LN

Altera

FPGA

Ball

1760

BGA

Square

Plastic/Epoxy

337500

Yes

CMOS

1120

1.2/3.3 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1760

No

e1

100 MHz

1120

5CGXBC9E6F31A7N

Altera

FPGA

Automotive

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B896

2 mm

31 mm

31 mm

5AGXMB3H4F40C5N

Altera

FPGA

Other

Ball

1517

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1517

2.7 mm

40 mm

e1

622 MHz

40 mm

5CGTFD9F5U19C6

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CGXFC9A6U19C6

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5AGZME7E3F40I3LN

Altera

FPGA

Industrial

No Lead

1517

BGA

Square

Plastic/Epoxy

450000

Yes

1.18 V

16980

TSMC

674

1.15

Grid Array

BGA1517,39X39,40

1.12 V

1 mm

100 °C (212 °F)

16980 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1517

2.7 mm

40 mm

674

40 mm

5CGXFC3B6F23C6

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

31000

Yes

1.13 V

CMOS

224

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

No

224

23 mm

10AS027H3F34E2SP

Altera

FPGA

Ball

1152

BGA

Square

Plastic

270000

Yes

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

384

5CGXBC5C6U19C8

Altera

FPGA

Other

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5CEBA2U15C8

Altera

FPGA

Other

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Low Profile, Fine Pitch

1.07 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B324

1.5 mm

15 mm

15 mm

5AGTMC3D3F27I5

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B672

2.7 mm

27 mm

e0

622 MHz

27 mm

5SGSMD4E2H29C3

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

360000

Yes

.88 V

13584

CMOS

360

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

13584 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B780

3.6 mm

33 mm

No

360

33 mm

EP4SE530H35I2

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

212480

Grid Array

1 mm

212480 CLBS

Bottom

S-PBGA-B1152

3.7 mm

42.5 mm

42.5 mm

5CGTFD7A5F23C7N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXFC7F7F23C7N

Altera

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B484

2 mm

23 mm

23 mm

5CGXBC7E6U19A7

Altera

FPGA

Automotive

Ball

484

FBGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array, Fine Pitch

1.07 V

.8 mm

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B484

1.9 mm

19 mm

19 mm

5ASXFB3H6F31C6N

Altera

FPGA

Commercial Extended

Ball

896

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

TSMC

250

1.1

Grid Array

BGA896,30X30,40

1.07 V

1 mm

85 °C (185 °F)

13207 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B896

2.7 mm

31 mm

250

31 mm

10AX066H2F34I1SG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

5AGXBB1K4F31I5N

Altera

FPGA

Ball

896

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B896

2.7 mm

31 mm

e1

622 MHz

31 mm

5CGTFD7E5F27I7N

Altera

FPGA

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Bottom

S-PBGA-B672

2 mm

27 mm

27 mm

EP4SGX230DF29C2XN

Altera

FPGA

Other

Ball

780

BGA

Square

Plastic/Epoxy

228000

Yes

.93 V

9120

CMOS

372

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA780,28X28,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

9120 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B780

4

3.5 mm

29 mm

No

e1

800 MHz

30 s

372

245 °C (473 °F)

29 mm

10M40DAF672C8

Altera

FPGA

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

Grid Array

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B672

10AX115S1F45E1MP

Altera

FPGA

Other

Ball

1932

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1932

3.65 mm

45 mm

45 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.