Through-Hole Programmable Logic Devices (PLD) 1,819

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
GAL16V8S-20QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	33.3 MHz	8
GAL20V8S-20QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	33.3 MHz	8
GAL39V18-25HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	40 MHz	10
GAL20V8-20HF2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	33.3 MHz	8
GAL20V8AS-25QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL16V8AS-20HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V	CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8	25.15 mm	8
GAL20V8S-25HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL16V8-20QD2	STMicroelectronics	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	20 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	33.3 MHz	8
GAL16V8AS-25HB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL20V8AS-20QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8		8
GAL20V8-35QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	18.1 MHz	8
GAL39V18-20HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	50 MHz	10
GAL20V8S-25QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL20V8AS-10HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	58.8 MHz	8		8
GAL39V18-15QD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	67 MHz	10
GAL20V8-30HD2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	22.2 MHz	8
GAL20V8AS-15QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8		8
GAL16V8S-20HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	33.3 MHz	8
GAL16V8-15HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	41.6 MHz	8
GAL16V8AS-15QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8	25.15 mm	8
GAL16V8S-20HB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	33.3 MHz	8
GAL20V8AS-12HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	12 ns	No	5.25 V	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	48.5 MHz	8		8
GAL20V8-15HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	41.6 MHz	8
GAL39V18-35HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	29 MHz	10
GAL20V8AS-20HB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8		8
GAL39V18-35QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	29 MHz	10
GAL16V8-20HF2	STMicroelectronics	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	20 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	33.3 MHz	8
GAL16V8-30QF2	STMicroelectronics	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	30 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	22.2 MHz	8
GAL16V8S-25QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL20V8S-20EB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8		8
GAL16V8-25QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Ceramic	25 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	28.5 MHz	8
GAL20V8-20QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	33.3 MHz	8
GAL16V8AS-25QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20			No		e0	28.5 MHz	8
GAL39V18-30QD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	33 MHz	10
GAL16V8AS-10HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	3.93 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	58.8 MHz	8	25.15 mm	8
GAL20V8AS-15EB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8		8
GAL20V8AS-25HB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL20V8-15HF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	41.6 MHz	8
GAL39V18-30QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	33 MHz	10
GAL39V18-25HF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	40 MHz	10
GAL16V8-20QF2	STMicroelectronics	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic	20 ns	No		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T20			No		e0	33.3 MHz	8
GAL39V18-25QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	40 MHz	10
GAL39V18-30HF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	33 MHz	10
GAL20V8-20HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	33.3 MHz	8
GAL20V8-25HF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	28.5 MHz	8
GAL39V18-25QD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	40 MHz	10
GAL20V8-20QD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	33.3 MHz	8
GAL39V18-30HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		CMOS	20	PLS-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices			75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	33 MHz	10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.