Through-Hole Programmable Logic Devices (PLD) 1,819

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

GAL16V8-25QD1

STMicroelectronics

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

25 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

28.5 MHz

8

GAL16V8-20HD2

STMicroelectronics

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

20 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

33.3 MHz

8

GAL16V8-25HB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

No

e0

28.5 MHz

8

GAL16V8-15HD1

STMicroelectronics

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

15 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

41.6 MHz

8

GAL20V8S-25QB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

28.5 MHz

8

GAL20V8S-15EB1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

41.6 MHz

8

GAL20V8S-25HB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

28.5 MHz

8

GAL39V18-15HF1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

15 ns

No

CMOS

20

PLS-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

75

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

67 MHz

10

GAL16V8S-25HB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

No

e0

28.5 MHz

8

GAL16V8AS-15HB3

STMicroelectronics

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

3.93 mm

7.62 mm

No

Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

e0

41.6 MHz

8

25.15 mm

8

GAL20V8-20HF1

STMicroelectronics

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

20 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

33.3 MHz

8

5962-9176012NXA

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

BICMOS

MIL-PRF-38535

5

In-Line

Macrocell

4.75 V

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

55 MHz

10

5962-9176011NXA

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

BICMOS

MIL-PRF-38535

5

In-Line

Macrocell

4.75 V

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

55 MHz

10

P3C18V8ZIN

NXP Semiconductors

OT PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

50 ns

No

3.6 V

CMOS

3.3

In-Line

Macrocell

2.7 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDIP-T20

4.2 mm

7.62 mm

No

8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

17 MHz

26.73 mm

8

PL22V10-15N

NXP Semiconductors

EE PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

5

In-Line

Macrocell

4.75 V

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

50 MHz

31.7 mm

10

5962-9176008MLX

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

9 ns

No

5.5 V

BICMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

71 MHz

10

PLS173N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.25 V

TTL

22

PLA-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.75 V

42

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 10 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Output Polarity

10

31.7 mm

10

LVT22V10-DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

12 ns

No

3.6 V

BICMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

74 MHz

31.7 mm

10

5962-8984104LA

NXP Semiconductors

Flash PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

e0

30.3 MHz

31.877 mm

10

PLUS20R4DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 4 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Power-Up Reset

60.6 MHz

31.7 mm

4

P3C18V8Z40FA

NXP Semiconductors

UV PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

40 ns

No

3.6 V

CMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-CDIP-T20

5.08 mm

7.62 mm

No

Programmable Output Polarity

22 MHz

24.305 mm

8

PLUS105-45N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

9 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

5.08 mm

15.24 mm

No

Programmable Logic Sequencer; 1 External Clock

31.3 MHz

36.51 mm

0

PLUS20R8DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Power-Up Reset

60.6 MHz

31.7 mm

0

PLHS18P8A/BRA

NXP Semiconductors

OT PLD

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

30 ns

No

In-Line

10 Dedicated Inputs, 8 I/O

10

Dual

R-CDIP-T20

No

8

PHD16N8-5N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Combinatorial

4.75 V

75 °C (167 °F)

10 Dedicated Inputs, 6 I/O

10

0 °C (32 °F)

Dual

R-PDIP-T20

No

High Speed Decoder

6

5962-8984104LX

NXP Semiconductors

Flash PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

10

5962-9176008MLA

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

7.5 ns

No

5.25 V

BICMOS

MIL-STD-883 Class B

5

In-Line

Macrocell

4.75 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

71 MHz

10

PLUS16L8/BRA

NXP Semiconductors

OT PLD

Military

Through-Hole

20

Rectangular

Ceramic, Metal-Sealed Cofired

12 ns

No

5.5 V

TTL

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-CDIP-T20

No

Security Fuse

6

P3C18V8ZIAFA

NXP Semiconductors

UV PLD

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

45 ns

No

3.6 V

CMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-CDIP-T20

5.08 mm

7.62 mm

No

Programmable Output Polarity

18 MHz

24.305 mm

8

S82S153F/883B

NXP Semiconductors

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

45 ns

No

5.5 V

TTL

18

PLA-TYPE

5

In-Line

DIP20,.3

No

4.5 V

42

125 °C (257 °F)

0 Dedicated Inputs, 10 I/O

0

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T20

e0

10

No

10

PLC415-16N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

40 ns

No

5.25 V

CMOS

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

15 Dedicated Inputs, 0 I/O

15

0 °C (32 °F)

Dual

R-PDIP-T28

5.08 mm

15.24 mm

No

Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock

13.3 MHz

36.51 mm

0

PLS159AN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

35 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

75 °C (167 °F)

4 Dedicated Inputs, 12 I/O

4

0 °C (32 °F)

Dual

R-PDIP-T20

No

Programmable Logic Sequencer; 1 External Clock

18 MHz

12

PLUS105-70N3

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

6.5 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

5.33 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

47.6 MHz

35.505 mm

0

M38510/50201BXA

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

5.5 V

Bipolar

MIL-M-38510 Class B

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDIP-T28

No

0

PLC18V8ZIAN

NXP Semiconductors

OT PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

74

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Dual

R-PDIP-T20

4.2 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

8

26.73 mm

8

ABT22V10B/BLA

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

9 ns

No

5.5 V

BICMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

71 MHz

10

5962-9176013NXA

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

5.25 V

BICMOS

MIL-PRF-38535

5

In-Line

Macrocell

4.75 V

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

71 MHz

10

PLUS20R8-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Power-Up Reset

74 MHz

31.7 mm

0

PLS101N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

50 ns

No

5.25 V

TTL

16

PLA-TYPE

5

5 V

In-Line

DIP28,.6

Programmable Logic Devices

Combinatorial

4.75 V

48

2.54 mm

75 °C (167 °F)

16 Dedicated Inputs, 0 I/O

16

0 °C (32 °F)

Dual

R-PDIP-T28

No

Open Collector Output

8

0

5962-9176013NXX

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

5.25 V

BICMOS

MIL-PRF-38535

5

In-Line

Macrocell

4.75 V

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

71 MHz

10

N82S153AFB

NXP Semiconductors

OT PLD

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

30 ns

No

TTL

18

PLA-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

42

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-XDIP-T20

e0

10

N82S103N

NXP Semiconductors

OT PLD

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

TTL

16

PAD-TYPE

5

5 V

In-Line

DIP28,.6

Programmable Logic Devices

9

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

9

PLQ22V10-7F

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

9 ns

No

5.25 V

BICMOS

5

In-Line

Macrocell

4.75 V

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-GDIP-T24

No

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

87 MHz

10

PLS168AN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

12.5 MHz

31.7 mm

0

PL22V10-12N

NXP Semiconductors

EE PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

12 ns

No

5.25 V

CMOS

5

In-Line

Macrocell

4.75 V

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

58.8 MHz

31.7 mm

10

PLC18V8Z25FA

NXP Semiconductors

UV PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.25 V

CMOS

5

In-Line

Macrocell

4.75 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset

30 MHz

24.305 mm

8

PLUS16R4-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 4 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T20

4.06 mm

7.62 mm

No

Power-Up Reset

74 MHz

26.695 mm

4

PLQ20R6-5N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8 ns

No

5.25 V

BICMOS

5

In-Line

Mixed

4.75 V

75 °C (167 °F)

12 Dedicated Inputs, 2 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

No

Register Preload; Power-Up Reset

118 MHz

2

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.