Through-Hole Programmable Logic Devices (PLD) 1,819

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

PEEL22CV10API-7L

Diodes Incorporated

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T24

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock

e3

117 MHz

260 °C (500 °F)

31.75 mm

10

TC9808P

Toshiba

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

29 ns

No

5.25 V

8

CMOS

18

PLA-TYPE

5

In-Line

Macrocell

2 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 9 I/O

8

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

4.45 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function

e0

22 MHz

9

24.6 mm

9

TC9809P

Toshiba

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

29 ns

No

5.25 V

8

CMOS

18

PLA-TYPE

5

In-Line

Macrocell

4.75 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 9 I/O

8

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

4.45 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function

e0

22 MHz

9

24.6 mm

9

TC9803P

Toshiba

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

40 ns

No

5.5 V

8

CMOS

18

PLA-TYPE

5

In-Line

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 9 I/O

8

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

4.45 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock

e0

14 MHz

9

24.6 mm

9

TC9801P

Toshiba

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

60 ns

No

5.5 V

8

CMOS

18

PLA-TYPE

5

In-Line

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 9 I/O

8

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

4.45 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock

e0

10 MHz

9

24.6 mm

9

TC9802P

Toshiba

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

40 ns

No

6 V

8

CMOS

18

PLA-TYPE

5

In-Line

Macrocell

2 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 9 I/O

8

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

4.45 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock

e0

14 MHz

9

24.6 mm

9

TC9807P

Toshiba

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

21 ns

No

5.25 V

CMOS

16

PAD-TYPE

5

In-Line

Combinatorial

4.75 V

2.54 mm

85 °C (185 °F)

6 Dedicated Inputs, 10 I/O

6

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

4.45 mm

7.62 mm

No

Zero-Standby Function

e0

12

24.6 mm

10

TC9806P

Toshiba

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

21 ns

No

5.25 V

CMOS

16

PAD-TYPE

5

In-Line

Combinatorial

2 V

2.54 mm

85 °C (185 °F)

6 Dedicated Inputs, 10 I/O

6

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

4.45 mm

7.62 mm

No

Zero-Standby Function

e0

12

24.6 mm

10

TC9800P

Toshiba

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

60 ns

No

6 V

8

CMOS

18

PLA-TYPE

5

In-Line

Macrocell

2 V

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 9 I/O

8

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

4.45 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock

e0

10 MHz

9

24.6 mm

9

TC9804P

Toshiba

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

55 ns

No

5.25 V

16

CMOS

22

PLA-TYPE

5

In-Line

Macrocell

2 V

2.54 mm

85 °C (185 °F)

2 Dedicated Inputs, 16 I/O

2

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

4.45 mm

7.62 mm

No

16 Macrocells; 4 External Clocks; Shared Input/Clock; Set/Reset In Asynchronous Enable

e0

12 MHz

16

29.8 mm

16

TC9805P

Toshiba

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

55 ns

No

5.25 V

16

CMOS

22

PLA-TYPE

5

In-Line

Macrocell

4.75 V

2.54 mm

85 °C (185 °F)

2 Dedicated Inputs, 16 I/O

2

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

4.45 mm

7.62 mm

No

16 Macrocells; 4 External Clocks; Shared Input/Clock; Set/Reset In Asynchronous Enable

e0

12 MHz

16

29.8 mm

16

5962-01-333-2525

Renesas Electronics

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

125 ns

No

CMOS

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

8

5962-01-286-1613

Renesas Electronics

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic

55 ns

No

TTL

MIL-STD-883 Class B (Modified)

18

PLA-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

42

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

10

PLX464I-45

Broadcom

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic

No

8

CMOS

26

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

88

2.54 mm

85 °C (185 °F)

9 Dedicated Inputs, 8 I/O

9

-40 °C (-40 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

15 MHz

8

8

PLX448P-45

Broadcom

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

45 ns

No

5.25 V

8

CMOS

26

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

88

2.54 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

4.699 mm

7.62 mm

No

PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock

e0

16.7 MHz

8

31.75 mm

8

PLX448I-55

Broadcom

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic

No

8

CMOS

26

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

88

2.54 mm

85 °C (185 °F)

9 Dedicated Inputs, 8 I/O

9

-40 °C (-40 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

8

8

PLX464-45

Broadcom

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

8

CMOS

26

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

88

2.54 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

15 MHz

8

8

PLX464M-55

Broadcom

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

8

CMOS

26

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

88

2.54 mm

125 °C (257 °F)

9 Dedicated Inputs, 8 I/O

9

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

7.98 mm

No

e0

8

31.14 mm

8

PLX464-25

Broadcom

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

8

CMOS

26

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

88

2.54 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

28.5 MHz

8

8

PLX464I-55

Broadcom

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic

No

8

CMOS

26

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

88

2.54 mm

85 °C (185 °F)

9 Dedicated Inputs, 8 I/O

9

-40 °C (-40 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

8

8

PLX448M-65

Broadcom

UV PLD

Military

Through-Hole

24

WDIP

Rectangular

Ceramic, Glass-Sealed

65 ns

No

5.5 V

8

CMOS

26

PAL-TYPE

5

5 V

In-Line, Window

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

88

2.54 mm

125 °C (257 °F)

9 Dedicated Inputs, 8 I/O

9

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.3 mm

7.62 mm

No

PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock

e0

11.1 MHz

8

32.2 mm

8

PLX464P-45

Broadcom

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

45 ns

No

5.25 V

8

CMOS

26

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

88

2.54 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

4.699 mm

7.62 mm

No

PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock

e0

16.7 MHz

8

31.75 mm

8

PLX448I-45

Broadcom

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic

No

8

CMOS

26

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

88

2.54 mm

85 °C (185 °F)

9 Dedicated Inputs, 8 I/O

9

-40 °C (-40 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

15 MHz

8

8

PLX464-35

Broadcom

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

8

CMOS

26

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

88

2.54 mm

70 °C (158 °F)

9 Dedicated Inputs, 8 I/O

9

0 °C (32 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

18 MHz

8

8

CPL20R6L35WM

Samsung

Military

Through-Hole

24

DIP

Rectangular

Ceramic

40 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

16.5 MHz

8

CPL20L8-15NC

Samsung

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

CMOS

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

72

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

3

No

e0

8

CPL20R4L-20NC

Samsung

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

60

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

3

No

e0

33.3 MHz

8

CPL20R6L-15NC

Samsung

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

CMOS

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

3

No

e0

8

CPL20L8-25WM

Samsung

Military

Through-Hole

24

DIP

Rectangular

Ceramic

30 ns

No

CMOS

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

72

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

3

No

e0

8

CPL16L8L-15WC

Samsung

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

15 ns

No

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T20

3

No

e0

8

CPL16R6-25NC

Samsung

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

3

No

e0

28.5 MHz

6

CPL20R4-25NC

Samsung

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

60

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

3

No

e0

28.5 MHz

8

CPL20L10-20NC

Samsung

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

20 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

40

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

3

No

e0

10

CPL20R6-15NC

Samsung

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

CMOS

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

3

No

e0

8

CPL16R8L-15WC

Samsung

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

No

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T20

3

No

e0

41.6 MHz

8

CPL16R4-35WM

Samsung

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

3

No

e0

16.5 MHz

4

CPL20R6L-20WC

Samsung

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

20 ns

No

CMOS

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

3

No

e0

8

CPL20R8-15NC

Samsung

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

72

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

3

No

e0

41.6 MHz

8

CPL20R6L-15WC

Samsung

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

15 ns

No

CMOS

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

3

No

e0

8

CPL22V10-35NC

Samsung

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

132

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

3

No

e0

18 MHz

10

CPL16R4-15NC

Samsung

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

3

No

e0

41.6 MHz

4

CPL20L10-35WC

Samsung

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

35 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

40

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

3

No

e0

10

CPL20R4L-20WC

Samsung

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

60

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T24

3

No

e0

33.3 MHz

8

CPL20V8L-30NC

Samsung

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T24

3

No

e0

22.2 MHz

8

CPL16R8-15NC

Samsung

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic

No

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-XDIP-T20

3

No

e0

41.6 MHz

8

CPL20R6L-25NI

Samsung

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

CMOS

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

64

2.54 mm

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

3

No

e0

8

CPL16R8-25WM

Samsung

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

CMOS

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

3

No

e0

22 MHz

8

CPL20R8L25WM

Samsung

Military

Through-Hole

24

DIP

Rectangular

Ceramic

30 ns

No

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

22 MHz

8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.