Through-Hole Programmable Logic Devices (PLD) 1,819

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	No. of I/O Lines
PLC18V8ZIFA	NXP Semiconductors	UV PLD	Industrial	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		18 MHz		24.305 mm	8
5962-8670901XA	NXP Semiconductors	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	35 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Registered	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T28				No		e0				0
PLUS16R8-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.06 mm	7.62 mm	No	Power-Up Reset		74 MHz		26.695 mm	0
PLUS405-55N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	15 Dedicated Inputs, 0 I/O	15	0 °C (32 °F)		Dual	R-PDIP-T28		5.08 mm	15.24 mm	No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock		38.5 MHz		36.51 mm	0
5962-8768201RX	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	45 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 10 I/O	8	-55 °C (-67 °F)		Dual	R-CDIP-T20				No						10
PLC18V8ZIN	NXP Semiconductors	OT PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No	5.5 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.5 V	74	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		18 MHz	8	26.73 mm	8
N82S100I	NXP Semiconductors	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Ceramic		No		TTL		16	PLA-TYPE	5	5 V	In-Line	DIP28,.6	Programmable Logic Devices			48	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Dual	R-XDIP-T28				No		e0		8
PLQ16R4-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	BICMOS				5		In-Line			Mixed	4.75 V			75 °C (167 °F)	8 Dedicated Inputs, 4 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20				No	Register Preload; Power-Up Reset		118 MHz			4
10020EV8-4F	NXP Semiconductors	OT PLD	Other	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	4.7 ns	No		ECL		20	PAL-TYPE		-4.5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		90	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 8 I/O	11	0 °C (32 °F)		Dual	R-GDIP-T24	1	5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		204 MHz	8	31.955 mm	8
PLC18V8Z35N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	35 ns	No	5.25 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.75 V	74	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		21 MHz	8	26.73 mm	8
PLUS16R8DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 0 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.06 mm	7.62 mm	No	Power-Up Reset		60.6 MHz		26.695 mm	0
P3C18V8Z35N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	45 ns	No	3.6 V	CMOS				3.3		In-Line			Macrocell	2.7 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		21 MHz		26.73 mm	8
P3C18V8ZIFA	NXP Semiconductors	UV PLD	Industrial	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	50 ns	No	3.6 V	CMOS				3.3		In-Line			Macrocell	2.7 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		17 MHz		24.305 mm	8
PLUS105-55N3	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28		5.33 mm	7.62 mm	No	Programmable Logic Sequencer; 1 External Clock		35.7 MHz		35.505 mm	0
82S153A/BRA	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	45 ns	No	5.5 V	TTL				5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 10 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20				No						10
ABT22V10A/BLA	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V	BICMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm	No			55 MHz			10
PLC415-16FA	NXP Semiconductors	UV PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.25 V	CMOS				5		In-Line			Registered	4.75 V			75 °C (167 °F)	15 Dedicated Inputs, 0 I/O	15	0 °C (32 °F)		Dual	R-GDIP-T28				No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock		13.3 MHz			0
5962-9176014NXX	NXP Semiconductors	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V	BICMOS	MIL-PRF-38535			5		In-Line			Macrocell	4.75 V			85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24				No		e0	71 MHz			10
5962-8850701LX	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 12 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T24				No			20 MHz			12
PLUS153DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	12 ns	No	5.25 V	TTL		18	PLA-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial	4.75 V	42	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 10 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20				No	Programmable Output Polarity			10		10
LVT16V8-6N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7 ns	No	3.6 V	BICMOS				3.3		In-Line			Macrocell	3 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		111 MHz		26.73 mm	8
M38510/50202BXA	NXP Semiconductors	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Metal-Sealed Cofired		No	5.5 V	Bipolar	MIL-M-38510 Class B			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-CDIP-T28				No						0
N82S105N	NXP Semiconductors	OT PLD	Commercial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy		No		TTL		16	PLS-TYPE	5	5 V	In-Line	DIP28,.6	Programmable Logic Devices			48	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T28				No		e0	9.8 MHz	8
PLC18V8Z/BRA	NXP Semiconductors	UV PLD	Military	Through-Hole	20	WDIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V	CMOS				5		In-Line, Window			Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No			25 MHz			8
LVT22V10-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	8.5 ns	No	3.6 V	BICMOS		22	PAL-TYPE	3.3	3.3 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	3 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		95 MHz	10	31.7 mm	10
M38510/50201BXX	NXP Semiconductors	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Metal-Sealed Cofired		No	5.5 V	Bipolar	MIL-M-38510 Class B			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-CDIP-T28				No						0
PLUS16R6DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Mixed	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 2 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.06 mm	7.62 mm	No	Power-Up Reset		60.6 MHz		26.695 mm	2
PLUS405-45N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	TTL		16	PLS-TYPE	5	5 V	In-Line	DIP28,.6	Programmable Logic Devices	Registered	4.75 V	64	2.54 mm	75 °C (167 °F)	15 Dedicated Inputs, 8 I/O	15	0 °C (32 °F)		Dual	R-PDIP-T28		5.08 mm	15.24 mm	No	Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock		29.4 MHz	8	36.51 mm	8
PLUS173BN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	TTL		22	PLA-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial	4.75 V	42	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 10 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	Programmable Output Polarity			10	31.7 mm	10
PLUS153BN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	TTL		18	PLA-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Combinatorial	4.75 V	42	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 10 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20				No	Programmable Output Polarity			10		10
PLC18V8Z25N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V	CMOS		18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Macrocell	4.75 V	74	2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		30 MHz	8	26.73 mm	8
82S101/BXA	NXP Semiconductors	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	80 ns	No	5.5 V	TTL				5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	16 Dedicated Inputs, 0 I/O	16	-55 °C (-67 °F)		Dual	R-GDIP-T28				No						0
5962-9201201MLA	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	35 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Registered	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24				No		e0	10.5 MHz			0
PLUS20L8DN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Combinatorial	4.75 V		2.54 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No					31.7 mm	6
PLUS153-10N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Combinatorial	4.75 V			75 °C (167 °F)	8 Dedicated Inputs, 10 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20				No	Programmable Output Polarity					10
PLUS16R8/BRA	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic		No		TTL	38535Q/M;38534H;883B	8	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices	Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Dual	R-XDIP-T20				No		e0	50 MHz	8
5962-8984105LA	NXP Semiconductors	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V	CMOS	MIL-STD-883			5		In-Line			Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No		e0	42 MHz			10
PLUS105-70N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	6.5 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28		5.08 mm	15.24 mm	No	Programmable Logic Sequencer; 1 External Clock		47.6 MHz		36.51 mm	0
LVT22V10-BN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	3.6 V	BICMOS				3.3		In-Line			Macrocell	3 V		2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock		50 MHz		31.7 mm	10
PLUS105-55N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	16 Dedicated Inputs, 0 I/O	16	0 °C (32 °F)		Dual	R-PDIP-T28		5.08 mm	15.24 mm	No	Programmable Logic Sequencer; 1 External Clock		35.7 MHz		36.51 mm	0
PLS167AN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No	5.25 V	TTL				5		In-Line			Registered	4.75 V		2.54 mm	75 °C (167 °F)	14 Dedicated Inputs, 0 I/O	14	0 °C (32 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	Programmable Logic Sequencer; 1 External Clock		12.5 MHz		31.7 mm	0
PLUS16R6-7N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	TTL				5		In-Line			Mixed	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 2 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.06 mm	7.62 mm	No	Power-Up Reset		74 MHz		26.695 mm	2
PLS153AN	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	30 ns	No	5.25 V	TTL				5		In-Line			Combinatorial	4.75 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 10 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.06 mm	7.62 mm	No	Programmable Output Polarity				26.695 mm	10
P3C18V8Z40N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No	3.6 V	CMOS				3.3		In-Line			Macrocell	3 V		2.54 mm	75 °C (167 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)		Dual	R-PDIP-T20		4.2 mm	7.62 mm	No	Programmable Output Polarity		22 MHz		26.73 mm	8
PLC18V8ZIAFA	NXP Semiconductors	UV PLD	Industrial	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset		30 MHz		24.305 mm	8
PL22V10I15N	NXP Semiconductors	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDIP-T24		4.7 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		50 MHz		31.7 mm	10
5962-8768201MRA	NXP Semiconductors	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	45 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 10 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20				No		e0				10
PLHS473/BLA	NXP Semiconductors	OT PLD		Through-Hole	24	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	20 ns	No		Bipolar						In-Line								11 Dedicated Inputs, 9 I/O	11			Dual	R-CDIP-T24				No						9

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.