Industrial Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
P3C18V8ZIADH	NXP Semiconductors	OT PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	45 ns	Yes	3.6 V		CMOS			3.3			Small Outline, Thin Profile, Shrink Pitch				Macrocell	3 V		.65 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		1.1 mm	4.4 mm	No	Programmable Output Polarity		18 MHz				6.5 mm		8
PL22V10I15A	NXP Semiconductors	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS			5			Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		50 MHz				11.505 mm		10
PZ5128IS15BE	NXP Semiconductors	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	17.5 ns	Yes	5.5 V		CMOS			5			Flatpack, Low Profile, Fine Pitch				Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			63 MHz				20 mm		96
PZ5064I10BC-S	NXP Semiconductors	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12.5 ns	Yes	5.5 V		CMOS			5			Flatpack, Thin Profile				Macrocell	4.5 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			77 MHz				10 mm		32
PZ5064N10A44	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	5.5 V		CMOS			5			Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	64 Macrocells		77 MHz				16.5862 mm		32
P3Z22V10IBD-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS			3.3			Small Outline				Macrocell	3 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			65 MHz				15.4 mm		10
PZ5032I10A44	NXP Semiconductors	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS			5			Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			59 MHz				16.5862 mm		32
CY37384P208-66NI	Infineon Technologies	EE PLD	Industrial	Gull Wing	208	QFP	Square	Plastic/Epoxy	20 ns	Yes	5.5 V	384	CMOS					3.3/5,5 V	Flatpack	QFP208,1.2SQ,20	Programmable Logic Devices	Yes		4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O		-40 °C (-40 °F)	Tin/Lead	Quad	S-PQFP-G208			28 mm	No		e0	47.6 MHz				28 mm	Yes
CY37064VP48-143BAI	Infineon Technologies	EE PLD	Industrial	Ball	48	FBGA	Rectangular	Plastic/Epoxy	8.5 ns	Yes		64	CMOS			3.3		3.3 V	Grid Array, Fine Pitch	BGA48,6X8,32	Programmable Logic Devices	Yes				.8 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	R-PBGA-B48				No		e0						Yes
CY37064P84-100JI	Infineon Technologies	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	12 ns	Yes		64	CMOS					3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Quad	S-PQCC-J84				No		e0						Yes
CY37064VP44-83JI	Infineon Technologies	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes		64	CMOS			3.3		3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Quad	S-PQCC-J44				No		e0						Yes
CY37064P44-100AI	Infineon Technologies	EE PLD	Industrial	Gull Wing	44	QFP	Square	Plastic/Epoxy	12 ns	Yes		64	CMOS					3.3/5,5 V	Flatpack	QFP44,.47SQ,32	Programmable Logic Devices	Yes				.8 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44				No		e0						Yes
CY37064VP84-83JI	Infineon Technologies	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes		64	CMOS			3.3		3.3 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Quad	S-PQCC-J84				No		e0						Yes
CY37064P100-100AI	Infineon Technologies	EE PLD	Industrial	Gull Wing	100	QFP	Square	Plastic/Epoxy	12 ns	Yes		64	CMOS					3.3/5,5 V	Flatpack	QFP100,.63SQ,20	Programmable Logic Devices	Yes				.5 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100				No		e0						Yes
CY37064VP100-83AI	Infineon Technologies	EE PLD	Industrial	Gull Wing	100	QFP	Square	Plastic/Epoxy	15 ns	Yes		64	CMOS			3.3		3.3 V	Flatpack	QFP100,.63SQ,20	Programmable Logic Devices	Yes				.5 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Quad	S-PQFP-G100				No		e0						Yes
CY37064P44-100JI	Infineon Technologies	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes		64	CMOS					3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Quad	S-PQCC-J44				No		e0						Yes
CY37384P256-66BGI	Infineon Technologies	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	20 ns	Yes	5.5 V	384	CMOS					3.3/5,5 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes		4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O		-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B256			27 mm	No		e0	47.6 MHz				27 mm	Yes
CY37064VP44-83AI	Infineon Technologies	EE PLD	Industrial	Gull Wing	44	QFP	Square	Plastic/Epoxy	15 ns	Yes		64	CMOS			3.3		3.3 V	Flatpack	QFP44,.47SQ,32	Programmable Logic Devices	Yes				.8 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead	Quad	S-PQFP-G44				No		e0						Yes
CY37064VP100-100AXIT	Infineon Technologies	EE PLD	Industrial	Gull Wing	100	QFP	Square	Plastic/Epoxy	12 ns	Yes		64	CMOS				Tape and Reel	3.3/5 V	Flatpack	QFP100,.63SQ,20	Programmable Logic Devices	Yes				.5 mm	85 °C (185 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3			No		e3		40 s		260 °C (500 °F)		Yes
PA7572FI-20L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS	24	PLA-TYPE	5		5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices		Macrocell	4.5 V	124	.8 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	12 mm	No		e3	66.6 MHz	40 s	24	260 °C (500 °F)	12 mm		24
PEEL22CV10API-10	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V		CMOS	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	90.9 MHz		10		31.75 mm		10
PEEL18CV8SI-25	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5		5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G20		2.64 mm	7.5 mm	No		e0	28.5 MHz		8		12.8 mm		8
PEEL22CV10API-10L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V		CMOS			5			In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24			7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	90.9 MHz			260 °C (500 °F)	31.75 mm		10
PEEL18CV8TI-15	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5		5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e0	41.6 MHz		8		6.5 mm		8
PA7536SI-15	Diodes Incorporated	EE PLD	Industrial	Gull Wing	28	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS	26		5		5 V	Small Outline	SOP28,.4	Field Programmable Gate Arrays		Mixed	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 12 I/O	12	-40 °C (-40 °F)		Dual	R-PDSO-G28		2.64 mm	7.5 mm	No			83.3 MHz		12	245 °C (473 °F)	17.9 mm		12
PA7540PI-15	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS	22		5		5 V	In-Line	DIP24,.3	Field Programmable Gate Arrays		Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	0 Dedicated Inputs, 20 I/O	0	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			7.62 mm	No		e0	71.4 MHz		22		31.75 mm		20
PEEL22CV10AJI-25L	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS			5			Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28	3	4.369 mm	11.5062 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	33.3 MHz	40 s		260 °C (500 °F)	11.5062 mm		10
PEEL18CV8ZTI-25	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5		5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	113	.65 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e0	33.3 MHz		8		6.5 mm		8
PEEL18LV8ZSI-35	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	35 ns	Yes	3.6 V		CMOS	18	PAL-TYPE	3		3/3.3 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	2.7 V	113	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G20		2.64 mm	7.5 mm	No		e0	17.9 MHz		8		12.8 mm		8
PEEL18CV8JI-10L	Diodes Incorporated	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20	3	4.369 mm	8.9662 mm	No		e3	83.3 MHz		8	260 °C (500 °F)	8.9662 mm		8
PEEL22CV10AZPI-25L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V		CMOS	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	133	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24			7.62 mm	No		e3	33.3 MHz		10	260 °C (500 °F)	31.75 mm		10
PEEL22CV10AJI-15	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28		4.369 mm	11.5062 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		10		11.5062 mm		10
PEEL22CV10ASI-15	Diodes Incorporated	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5		5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G24		2.64 mm	7.5 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		10		15.4 mm		10
PEEL18CV8JI-10	Diodes Incorporated	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J20		4.369 mm	8.9662 mm	No		e0	83.3 MHz		8		8.9662 mm		8
PEEL22CV10AJI-25	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28		4.369 mm	11.5062 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz		10		11.5062 mm		10
PEEL22CV10AZJI-25L	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	133	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28	3	4.369 mm	11.5062 mm	No		e3	33.3 MHz		10	260 °C (500 °F)	11.5062 mm		10
PEEL22CV10API-7	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.5 V		CMOS	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	117 MHz		10		31.75 mm		10
PA7536JI-15	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS	26		5		5 V	Chip Carrier	LDCC28,.5SQ	Field Programmable Gate Arrays		Mixed	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 12 I/O	12	-40 °C (-40 °F)		Quad	S-PQCC-J28		4.369 mm	11.5062 mm	No			83.3 MHz		12	245 °C (473 °F)	11.5062 mm		12
PEEL18LV8ZTI-15L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS	18	PAL-TYPE	3		3/3.3 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	2.7 V	113	.65 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	3	1.1 mm	4.4 mm	No		e3	31.25 MHz		8	260 °C (500 °F)	6.5 mm		8
PEEL18CV8TI-15L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5		5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	3	1.1 mm	4.4 mm	No		e3	41.6 MHz		8	260 °C (500 °F)	6.5 mm		8
PEEL18CV8PI-15	Diodes Incorporated	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS	18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	74	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			7.62 mm	No		e0	41.6 MHz		8		26.162 mm		8
PA7540JNI-15L	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS	22		5		5 V	Chip Carrier	LDCC28,.5SQ	Field Programmable Gate Arrays		Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 20 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28	3	4.369 mm	11.5062 mm	No		e3	71.4 MHz		22	260 °C (500 °F)	11.5062 mm		20
PEEL18CV8ZSI-25L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS			5			Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	3	2.64 mm	7.5 mm	No		e3	33.3 MHz	40 s		260 °C (500 °F)	12.8 mm		8
PA7536SI-15L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	28	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS	26		5		5 V	Small Outline	SOP28,.4	Field Programmable Gate Arrays		Mixed	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 12 I/O	12	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G28	3	2.64 mm	7.5 mm	No		e3	83.3 MHz		12	260 °C (500 °F)	17.9 mm		12
PA7572PI-20L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	40	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V		CMOS	24	PLA-TYPE	5		5 V	In-Line	DIP40,.6	Programmable Logic Devices		Macrocell	4.5 V	124	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T40			15.24 mm	No		e3	66.6 MHz		24	260 °C (500 °F)	52.07 mm		24
PEEL18LV8ZPI-35L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	35 ns	No	3.6 V		CMOS	18	PAL-TYPE	3		3/3.3 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	2.7 V	113	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20			7.62 mm	No		e3	17.9 MHz		8	260 °C (500 °F)	26.162 mm		8
PA7540JI-15L	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS	22		5		5 V	Chip Carrier	LDCC28,.5SQ	Field Programmable Gate Arrays		Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 20 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28	3	4.369 mm	11.5062 mm	No		e3	71.4 MHz		22	260 °C (500 °F)	11.5062 mm		20
PEEL18LV8ZJI-35	Diodes Incorporated	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	35 ns	Yes	3.6 V		CMOS	18	PAL-TYPE	3		3/3.3 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	2.7 V	113	1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 10 I/O	7	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J20		4.369 mm	8.9662 mm	No		e0	17.9 MHz		8		8.9662 mm		10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.