Industrial Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
PEEL18LV8ZJI-15	Diodes Incorporated	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS	18	PAL-TYPE	3	3/3.3 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	2.7 V	113	1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 10 I/O	7	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J20		4.369 mm	8.9662 mm	No		e0	31.25 MHz		8		8.9662 mm		10
PEEL22CV10ASI-25	Diodes Incorporated	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G24		2.64 mm	7.5 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz		10		15.4 mm		10
PEEL18CV8TI-10	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e0	83.3 MHz		8		6.5 mm		8
PEEL22CV10ASI-7	Diodes Incorporated	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G24		2.64 mm	7.5 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	117 MHz		10		15.4 mm		10
PEEL22CV10ATI-7	Diodes Incorporated	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	4.5 V	132	.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G24		1.1 mm	4.4 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	117 MHz		10		7.8 mm		10
PEEL18CV8TI-10L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	3	1.1 mm	4.4 mm	No		e3	83.3 MHz		8	260 °C (500 °F)	6.5 mm		8
PA7540SI-15L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS	22		5	5 V	Small Outline	SOP24,.4	Field Programmable Gate Arrays		Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 20 I/O	0	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24	3	2.64 mm	7.5 mm	No		e3	71.4 MHz		22	260 °C (500 °F)	15.4 mm		20
PEEL22CV10AZSI-25L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Macrocell	4.5 V	133	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24	3	2.64 mm	7.5 mm	No		e3	33.3 MHz		10	260 °C (500 °F)	15.4 mm		10
PEEL22CV10ATI-15L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS			5		Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24	3	1.1 mm	4.4 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	62.5 MHz			260 °C (500 °F)	7.8 mm		10
PEEL18CV8SI-10L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	3	2.64 mm	7.5 mm	No		e3	83.3 MHz	40 s	8	260 °C (500 °F)	12.8 mm		8
PA7540JNI-15	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS	22		5	5 V	Chip Carrier	LDCC28,.5SQ	Field Programmable Gate Arrays		Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 20 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28		4.369 mm	11.5062 mm	No		e0	71.4 MHz		22		11.5062 mm		20
PEEL22CV10AJI-15L	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS			5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28	3	4.369 mm	11.5062 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	62.5 MHz	40 s		260 °C (500 °F)	11.5062 mm		10
PEEL18CV8ZJI-25L	Diodes Incorporated	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	113	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20	3	4.369 mm	8.9662 mm	No		e3	33.3 MHz		8	260 °C (500 °F)	8.9662 mm		8
PEEL18CV8JI-25	Diodes Incorporated	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J20		4.369 mm	8.9662 mm	No		e0	28.5 MHz		8		8.9662 mm		8
PEEL18CV8JI-25L	Diodes Incorporated	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5	5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20	3	4.369 mm	8.9662 mm	No		e3	28.5 MHz		8	260 °C (500 °F)	8.9662 mm		8
PEEL18CV8TI-25	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP20,.25	Programmable Logic Devices		Macrocell	4.5 V	74	.65 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G20		1.1 mm	4.4 mm	No		e0	28.5 MHz		8		6.5 mm		8
PEEL18LV8ZSI-15L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS	18	PAL-TYPE	3	3/3.3 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	2.7 V	113	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	3	2.64 mm	7.5 mm	No		e3	31.25 MHz		8	260 °C (500 °F)	12.8 mm		8
PEEL22CV10API-25L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V		CMOS			5		In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin	Dual	R-PDIP-T24	3		7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	33.3 MHz			260 °C (500 °F)	31.75 mm		10
PEEL22CV10AZTI-25	Diodes Incorporated	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	4.5 V	133	.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G24		1.1 mm	4.4 mm	No		e0	33.3 MHz		10		7.8 mm		10
PEEL22CV10ATI-25	Diodes Incorporated	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	4.5 V	132	.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G24		1.1 mm	4.4 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz		10		7.8 mm		10
PEEL22CV10ASI-25L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS			5		Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G24	3	2.64 mm	7.5 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	33.3 MHz	40 s		260 °C (500 °F)	15.4 mm		10
PEEL18CV8SI-25L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	3	2.64 mm	7.5 mm	No		e3	28.5 MHz		8	260 °C (500 °F)	12.8 mm		8
PEEL18CV8ZPI-25L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V		CMOS			5		In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin	Dual	R-PDIP-T20	3		7.62 mm	No		e3	33.3 MHz			260 °C (500 °F)	26.162 mm		8
PEEL22CV10AJI-7	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28		4.369 mm	11.5062 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	117 MHz		10		11.5062 mm		10
PEEL18CV8PI-10	Diodes Incorporated	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	74	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20			7.62 mm	No		e0	83.3 MHz		8		26.162 mm		8
PEEL22CV10API-7L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.5 V		CMOS			5		In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24			7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	117 MHz			260 °C (500 °F)	31.75 mm		10
PEEL22CV10AJI-10	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS	22	PAL-TYPE	5	5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28		4.369 mm	11.5062 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	90.9 MHz		10		11.5062 mm		10
PEEL18CV8SI-15L	Diodes Incorporated	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS	18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.5 V	74	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Matte Tin	Dual	R-PDSO-G20	3	2.64 mm	7.5 mm	No		e3	41.6 MHz		8	260 °C (500 °F)	12.8 mm		8
PEEL18LV8ZJI-35L	Diodes Incorporated	EE PLD	Industrial	J Bend	20	QCCJ	Square	Plastic/Epoxy	35 ns	Yes	3.6 V		CMOS	18	PAL-TYPE	3	3/3.3 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	2.7 V	113	1.27 mm	85 °C (185 °F)	7 Dedicated Inputs, 10 I/O	7	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J20	3	4.369 mm	8.9662 mm	No		e3	17.9 MHz		8	260 °C (500 °F)	8.9662 mm		10
PA7536JI-15L	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS	26		5	5 V	Chip Carrier	LDCC28,.5SQ	Field Programmable Gate Arrays		Mixed	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 12 I/O	12	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28	3	4.369 mm	11.5062 mm	No		e3	83.3 MHz		12	260 °C (500 °F)	11.5062 mm		12
PEEL22CV10AJI-10L	Diodes Incorporated	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS			5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J28	3	4.369 mm	11.5062 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	90.9 MHz			260 °C (500 °F)	11.5062 mm		10
XC7236A-16WC44I	Xilinx	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.5 V	36	CMOS			5	3/5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V		60 MHz				16.51 mm	No	30
XCR5064-10PQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	64	CMOS			5	5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	20 mm	No	64
XC95144XV-5TQ144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4 ns	Yes	2.6 V					2.5		Flatpack, Low Profile, Fine Pitch				Registered	2.4 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0					20 mm		117
XC7354-15PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	32 ns	Yes	5.5 V	54	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 25 I/O	8	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops	e0	55.6 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	25
XC95108-20PQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	HQFP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.5 V	108	CMOS			5	3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3		30 s		245 °C (473 °F)	20 mm	Yes	81
XC95144XV-7CSG144I	Xilinx	Flash PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	144	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.37 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	125 MHz	30 s		260 °C (500 °F)	12 mm	Yes	117
XCR3032XL-10VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	32	CMOS			3.3	3/3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	95 MHz				10 mm	Yes	36
XC73108-15WB225I	Xilinx	UV PLD	Industrial	Ball	225	WBGA	Square	Ceramic, Metal-Sealed Cofired	36 ns	Yes	5.5 V	108	CMOS			5	3.3/5,5 V	Grid Array, Window	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.5 V		1.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 78 I/O	12	-40 °C (-40 °F)		Bottom	S-CBGA-B225	1			No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops		45.5 MHz					No	78
XC9572XV-7TQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	72	CMOS			2.5	1.8/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 72 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0	125 MHz	30 s		225 °C (437 °F)	14 mm	Yes	72
XC95144-15PQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	144	CMOS			5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	55.6 MHz	30 s		225 °C (437 °F)	20 mm	Yes	81
XC95144-15PQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	144	CMOS			5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	20 mm	Yes	81
XCR3064XL-6CS48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	6 ns	Yes	3.6 V		CMOS			3.3		Grid Array, Fine Pitch				Macrocell	2.7 V		.8 mm	85 °C (185 °F)	32 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	167 MHz				7 mm		32
XC9572-15PCG84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	72	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	29.3116 mm	Yes	69
XC95216-10PQG160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	216	CMOS			5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 133 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G160	3	3.7 mm	28 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3	66.7 MHz	30 s		245 °C (473 °F)	28 mm	Yes	133
XC7272A-25PC84I	Xilinx	OT PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	40 ns	Yes	5.5 V	72	CMOS			5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 42 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells	e0	40 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	42
XC95108F-15PC84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS			5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	56 MHz				29.3116 mm		69
XC2C64-5VQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5 ns	Yes	1.9 V		CMOS			1.8		Flatpack, Thin Profile, Fine Pitch				Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3		30 s		260 °C (500 °F)	14 mm		64

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.