Industrial Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XCR3384XL-10PQG208I	Xilinx	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	384	CMOS		3.3	3/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 172 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	102 MHz	30 s		245 °C (473 °F)	28 mm	Yes	172
XC95108-7PQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	HQFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.5 V	108	CMOS		5	3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V	.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e3		30 s		245 °C (473 °F)	20 mm	Yes	81
XCR3384XL-12FGG324I	Xilinx	EE PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	384	CMOS		3.3	3/3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 220 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	83 MHz	30 s		250 °C (482 °F)	23 mm	Yes	220
XCR5064C-10PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	64	CMOS		5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XC9572XL-7PC44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	72	CMOS		3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	72 Macrocells	e0	125 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XCR3384XL-12FG324I	Xilinx	EE PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	384	CMOS		3.3	3/3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 220 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0	83 MHz	30 s		225 °C (437 °F)	23 mm	Yes	220
XC7272-30PG84I	Xilinx	UV PLD	Industrial	Pin/Peg	84	PGA	Square	Ceramic	48 ns	No		72	CMOS		5	5 V	Grid Array	PGA84M,11X11	Programmable Logic Devices	No			2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)		Perpendicular	S-XPGA-P84				No								No
XC9572XV-7PC44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	72	CMOS		2.5	1.8/3.3,2.5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.37 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	125 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	34
XCR3128-12PQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12 ns	Yes	3.63 V	128	CMOS		3.3	3.3 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	2.97 V	.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	69 MHz	30 s		225 °C (437 °F)	20 mm	Yes	80
XCR3064-12PC84I	Xilinx	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	64	CMOS		3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	2.97 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	67 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	64
XC73108-20PC84I	Xilinx	OT PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	45 ns	Yes	5.5 V	108	CMOS		5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 37 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	35.7 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	37
XCR3512XL-12FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	512	CMOS		3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	77 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XC73144-12BG225I	Xilinx	OT PLD	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	30 ns	Yes	5.5 V	144	CMOS		5	3.3/5,5 V	Grid Array	BGA225,15X15	Programmable Logic Devices	No	Macrocell	4.5 V	1.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 120 I/O	12	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225	3	3.5 mm	27 mm	No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops	e0	55.6 MHz	30 s		225 °C (437 °F)	27 mm	No	120
XC95216-20HQG208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS		5		Flatpack, Fine Pitch				Macrocell	4.5 V	.4 mm	85 °C (185 °F)	0 Dedicated Inputs, 166 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	50 MHz	30 s		245 °C (473 °F)	28 mm		166
XCR3256XL-10PQG208I	Xilinx	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS		3.3	3/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	105 MHz	30 s		245 °C (473 °F)	28 mm	Yes	164
XC9536XV-5VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	3.5 ns	Yes	2.6 V				2.5		Flatpack, Thin Profile				Registered	2.4 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3					10 mm		34
XC95144XV-4CS144I	Xilinx	Flash PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	4 ns	Yes	2.6 V				2.5		Grid Array, Thin Profile, Fine Pitch				Registered	2.4 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0					12 mm		117
XC9536-7PCG44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V	36	CMOS		5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	83.3 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC9572XL-7CS48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	72	CMOS	38	3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 38 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	72 Macrocells	e0	125 MHz	30 s	38	240 °C (464 °F)	7 mm	Yes	38
XCR3128XL-7CS144I	Xilinx	EE PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	128	CMOS		3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	119 MHz	30 s		240 °C (464 °F)	12 mm	Yes	108
XC95216-20BGG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS		5		Grid Array, Low Profile				Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 166 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.4 mm	35 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e1	50 MHz	30 s		260 °C (500 °F)	35 mm		166
XA9572XL-15VQG64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	15.5 ns	Yes	3.6 V		CMOS		3.3		Flatpack, Thin Profile, Fine Pitch				Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 52 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm		52
XC95144XV-4CSG144I	Xilinx	Flash PLD	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	4 ns	Yes	2.6 V				2.5		Grid Array, Thin Profile, Fine Pitch				Registered	2.4 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1					12 mm		117
XC7272A-16WC68I	Xilinx	UV PLD	Industrial	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	25 ns	Yes	5.5 V	72	CMOS		5	5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 38 I/O	8	-40 °C (-40 °F)		Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells		55 MHz				24.13 mm	No	38
XC7272A-16PC68I	Xilinx	OT PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	25 ns	Yes	5.5 V	72	CMOS		5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 38 I/O	8	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells		55 MHz				24.2316 mm	No	38
XC95288XV-7CSG280I	Xilinx	Flash PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	288	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e1	125 MHz	30 s		260 °C (500 °F)	16 mm	Yes	192
XCR3384XL-10FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	384	CMOS		3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	102 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
XC7354-10PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	22 ns	Yes	5.5 V	54	CMOS		5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 25 I/O	8	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops	e0	76.9 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	25
XC2C32-6PCG44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS		1.8	1.5/3.3,1.8 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V	1.27 mm	85 °C (185 °F)	1 Dedicated Inputs, 33 I/O	1	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Real Digital Design Technology	e3		30 s		245 °C (473 °F)	16.5862 mm	Yes	33
XC95288XL-7CSG280I	Xilinx	Flash PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	288	CMOS	192	3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e1	125 MHz	30 s	192	260 °C (500 °F)	16 mm	Yes	192
XC7272-25PG84I	Xilinx	UV PLD	Industrial	Pin/Peg	84	PGA	Square	Ceramic	40 ns	No		72	CMOS		5	5 V	Grid Array	PGA84M,11X11	Programmable Logic Devices	No			2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)		Perpendicular	S-XPGA-P84				No								No
XC7272-25PC68I	Xilinx	OT PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	40 ns	Yes		72	CMOS		5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No			1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68				No		e0						No
XC2C64-7CPG56I	Xilinx	Flash PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS		1.8	1.5/3.3,1.8 V	Grid Array, Low Profile, Fine Pitch	BGA56,10X10,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 45 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Real Digital Design Technology	e1		30 s		260 °C (500 °F)	6 mm	Yes	45
XC9536XV-4PCG44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	3.5 ns	Yes	2.6 V				2.5		Chip Carrier				Registered	2.4 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e3					16.5862 mm		34
XCR5032C-10VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	32	CMOS		5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	59 MHz	30 s		240 °C (464 °F)	10 mm	Yes	32
XC7272A-25WC84I	Xilinx	UV PLD	Industrial	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	40 ns	Yes	5.5 V	72	CMOS		5	5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 42 I/O	12	-40 °C (-40 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells		40 MHz				29.21 mm	No	42
XC95144XL-7TQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	144	CMOS	81	3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e4	138.88 MHz		81		14 mm	Yes	81
XC9536-7VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	5.5 V	36	CMOS		5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	83.3 MHz	30 s		260 °C (500 °F)	10 mm	Yes	34
XCR5064C-10VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	64	CMOS		5	5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	77 MHz	30 s		240 °C (464 °F)	10 mm	Yes	32
XC73108-12WC84I	Xilinx	UV PLD	Industrial	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V	108	CMOS		5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 37 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	55.6 MHz				29.21 mm	No	37
XC7372-12PC84I	Xilinx	OT PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	28 ns	Yes	5.5 V	72	CMOS		5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 37 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops	e0	62.5 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	37
XC7336-12WC44I	Xilinx	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	19 ns	Yes	5.5 V	36	CMOS		5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops		80 MHz				16.51 mm	No	32
XC7336-12PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	19 ns	Yes	5.5 V	36	CMOS		5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	80 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XCR3032C-10VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.63 V	32	CMOS		3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.97 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	58.8 MHz	30 s		240 °C (464 °F)	10 mm	Yes	32
XCR3032-10PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12.5 ns	Yes	3.6 V		CMOS		3.3		Chip Carrier				Macrocell	3 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 33 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No			58.8 MHz				16.5862 mm		33
XCR3128-12TQ128I	Xilinx	EE PLD	Industrial	Gull Wing	128	LFQFP	Rectangular	Plastic/Epoxy	12 ns	Yes	3.63 V	128	CMOS		3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.63X.87,20	Programmable Logic Devices	Yes	Macrocell	2.97 V	.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 96 I/O	2	-40 °C (-40 °F)		Quad	R-PQFP-G128		1.6 mm	14 mm	No			69 MHz				20 mm	Yes	96
XC95108F-15PCG84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS		5		Chip Carrier				Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e3	56 MHz				29.3116 mm		69
XC95288XV-10TQG144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	2.62 V	288	CMOS		2.5	1.8/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	100 MHz	30 s		260 °C (500 °F)	20 mm	Yes	117

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.