Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
16 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
338 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
23 mm |
338 |
|||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
87 MHz |
220 °C (428 °F) |
14 mm |
Yes |
84 |
||||||||||
Altera |
OT PLD |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP28,.5 |
Programmable Logic Devices |
Macrocell |
4.5 V |
320 |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
17.9 mm |
16 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
14.5 ns |
4992 |
Yes |
2.7 V |
CMOS |
147 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
147 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
147 |
220 °C (428 °F) |
28 mm |
147 |
|||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
9.5 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array, Low Profile |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
220 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
35 mm |
220 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 470 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B600 |
1.93 mm |
45 mm |
No |
e1 |
45 mm |
470 |
||||||||||||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
e0 |
100 MHz |
220 °C (428 °F) |
29.3116 mm |
Yes |
68 |
||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
160 Macrocells; Shared Input/Clock |
e3 |
62.5 MHz |
28 mm |
100 |
||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 172 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
20 s |
220 °C (428 °F) |
28 mm |
Yes |
172 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
17.2 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
16 ns |
9984 |
Yes |
2.7 V |
CMOS |
470 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
470 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
470 |
220 °C (428 °F) |
27 mm |
470 |
|||||||||||||
Altera |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP28,.3 |
Programmable Logic Devices |
320 |
2.54 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T28 |
No |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
|||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
17.2 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
147 |
||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
128 Macrocells |
e0 |
72.5 MHz |
220 °C (428 °F) |
20 mm |
Yes |
100 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 102 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e3 |
20 mm |
102 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
CMOS |
3.3 |
Chip Carrier |
Registered |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry |
29.3116 mm |
64 |
||||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
8 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
147 |
||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
3.5 ns |
Yes |
2.625 V |
64 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
e0 |
303 MHz |
220 °C (428 °F) |
10 mm |
Yes |
36 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
|||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
76.9 MHz |
20 mm |
80 |
||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
12.5 ns |
1728 |
Yes |
2.625 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Registered |
2.375 V |
.5 mm |
85 °C (185 °F) |
6 Dedicated Inputs, 102 I/O |
6 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
102 |
220 °C (428 °F) |
20 mm |
102 |
||||||||||||
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
160 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Registered |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 116 I/O |
4 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P160 |
5.34 mm |
39.624 mm |
No |
Labs With Fasttrack Interconnect; 452 Flip Flops; 336 Logic Elements |
39.624 mm |
116 |
||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
CMOS |
3.3 |
Chip Carrier |
Registered |
3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry |
220 °C (428 °F) |
29.3116 mm |
64 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
9984 |
Yes |
2.7 V |
CMOS |
470 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA600,35X35,50 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
470 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B600 |
3 |
1.93 mm |
45 mm |
No |
9984 Logic Elements |
e0 |
140 MHz |
20 s |
470 |
220 °C (428 °F) |
45 mm |
470 |
||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
128 Macrocells |
e0 |
166.7 MHz |
220 °C (428 °F) |
29.3116 mm |
Yes |
68 |
|||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
16.2 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 155 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
400 Macrocell |
e3 |
32 mm |
155 |
|||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
|||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
0.6 ns |
1728 |
Yes |
5.25 V |
CMOS |
189 |
5 |
3.3/5,5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
1728 Logic Elements |
e0 |
62.89 MHz |
20 s |
189 |
220 °C (428 °F) |
32 mm |
189 |
|||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
9 ns |
4992 |
Yes |
2.7 V |
CMOS |
189 |
2.5 |
2.5/3.3,3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
189 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e0 |
189 |
220 °C (428 °F) |
32 mm |
189 |
||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
64 Macrocells |
e0 |
100 MHz |
220 °C (428 °F) |
14 mm |
Yes |
68 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.375 V |
1 mm |
85 °C (185 °F) |
338 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
23 mm |
338 |
|||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
11.4 ns |
Yes |
5.5 V |
560 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP240,1.37SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 191 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
560 Macrocells; 35 Labs; 772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
144.9 MHz |
20 s |
220 °C (428 °F) |
32 mm |
Yes |
191 |
|||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 66 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.27 mm |
14 mm |
No |
e3 |
14 mm |
66 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
12.5 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
220 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
27 mm |
220 |
|||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
23.2 ns |
Yes |
5.5 V |
400 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 159 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
580 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
32 mm |
Yes |
159 |
|||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
128 Macrocells |
e0 |
116.3 MHz |
220 °C (428 °F) |
29.3116 mm |
Yes |
68 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
16 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array, Low Profile |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
274 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
35 mm |
274 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
17.2 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||
Altera |
UV PLD |
Industrial |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
17 ns |
No |
5.5 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
16 Macrocells; 2 External Clocks |
83.3 MHz |
32 mm |
16 |
||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
45 ns |
No |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
72 |
2.54 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
R-XDIP-T20 |
No |
20 MHz |
8 |
||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Ball |
256 |
LBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
2.625 V |
512 |
CMOS |
2.5 |
1.8/3.3,2.5 V |
Grid Array, Low Profile |
BGA256,20X20,50 |
Programmable Logic Devices |
Yes |
Macrocell |
2.375 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
1.7 mm |
27 mm |
No |
e0 |
119 MHz |
220 °C (428 °F) |
27 mm |
Yes |
212 |
||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
23 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 112 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3.91 mm |
28 mm |
No |
320 Macrocells; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
28 mm |
112 |
||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
16.1 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
147 |
||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
23.4 ns |
Yes |
5.5 V |
480 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 146 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
676 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
28 mm |
Yes |
146 |
|||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
384 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
384 Macrocells |
e0 |
125 MHz |
220 °C (428 °F) |
20 mm |
Yes |
120 |
||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
16.6 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 187 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
560 Macrocells |
e3 |
32 mm |
187 |
|||||||||||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
33 ns |
Yes |
5.5 V |
192 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Labs interconnected by PIA; 12 Labs; 1 External Clock |
e0 |
66.7 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
64 |
|||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
128 |
CMOS |
3.3/5,5 V |
Flatpack |
TQFP100,.63SQ |
Programmable Logic Devices |
No |
.5 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
No |
e0 |
220 °C (428 °F) |
No |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.