Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
8.2 ns |
Yes |
5.5 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 132 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
4.07 mm |
28 mm |
No |
320 Macrocells; 484 Flip Flops; 20 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
220 °C (428 °F) |
28 mm |
Yes |
132 |
||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
156.3 MHz |
220 °C (428 °F) |
28 mm |
Yes |
164 |
||||||||||
Altera |
EE PLD |
Industrial |
Ball |
100 |
BGA |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Macrocell |
3 V |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
No |
128 Macrocells |
e1 |
100 MHz |
84 |
||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
64 Macrocells |
e0 |
125 MHz |
220 °C (428 °F) |
29.3116 mm |
Yes |
68 |
|||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
304 |
HFQFP |
Square |
Plastic/Epoxy |
16.6 ns |
Yes |
5.5 V |
560 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP304,1.7SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 216 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G304 |
4.5 mm |
40 mm |
No |
560 Macrocells; 772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
117.6 MHz |
220 °C (428 °F) |
40 mm |
Yes |
216 |
|||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
64 Macrocells |
e0 |
166.7 MHz |
220 °C (428 °F) |
20 mm |
No |
68 |
||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 144 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
144 |
||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
0.5 ns |
4992 |
Yes |
2.625 V |
CMOS |
189 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
189 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
No |
e0 |
189 |
220 °C (428 °F) |
32 mm |
189 |
|||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
13 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 246 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
23 mm |
246 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
17.2 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 291 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
23 mm |
291 |
||||||||||||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
28 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 48 I/O |
12 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J68 |
5.08 mm |
24.23 mm |
No |
Macrocells Interconnected By Global And/Or Local Bus; 48 Macrocells; 4 External Clocks |
40 MHz |
24.23 mm |
48 |
||||||||||||||||||||
Altera |
OT PLD |
Industrial |
Gull Wing |
100 |
QFP |
Square |
Plastic/Epoxy |
55 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.635 mm |
85 °C (185 °F) |
19 Dedicated Inputs, 64 I/O |
19 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
No |
Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
220 °C (428 °F) |
No |
64 |
|||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
8 ns |
2880 |
Yes |
2.7 V |
CMOS |
191 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
191 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
191 |
220 °C (428 °F) |
17 mm |
191 |
|||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
147 |
||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
192.3 MHz |
220 °C (428 °F) |
14 mm |
Yes |
84 |
|||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.27 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
76.9 MHz |
14 mm |
80 |
||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
19.1 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
304 |
FQFP |
Square |
Plastic/Epoxy |
23.6 ns |
Yes |
5.5 V |
560 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
HQFP304,1.7SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 216 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G304 |
3 |
4.5 mm |
40 mm |
No |
772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
40 mm |
Yes |
216 |
||||||||||
Altera |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
25 ns |
No |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP28,.3 |
Programmable Logic Devices |
320 |
2.54 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-XDIP-T28 |
No |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
|||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
12 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array, Low Profile |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
274 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
35 mm |
274 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
12.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 369 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
23 mm |
369 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
9 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
424 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B600 |
1.93 mm |
45 mm |
No |
e1 |
45 mm |
424 |
|||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
64 |
CMOS |
5 |
5 V |
Flatpack |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
.8 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G44 |
No |
e3 |
No |
||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
160 |
HQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug |
Registered |
4.5 V |
.65 mm |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
3.91 mm |
28 mm |
No |
636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
|||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Low Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B100 |
3 |
1.7 mm |
11 mm |
No |
e0 |
222.2 MHz |
220 °C (428 °F) |
11 mm |
Yes |
68 |
|||||||||||
Altera |
EE PLD |
Industrial |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Low Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B100 |
3 |
1.7 mm |
11 mm |
No |
e0 |
116.3 MHz |
220 °C (428 °F) |
11 mm |
Yes |
84 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
Yes |
3.6 V |
3.3 |
Grid Array |
Mixed |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 150 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
1.86 mm |
23 mm |
No |
e1 |
23 mm |
150 |
|||||||||||||||||||||
Altera |
Flash PLD |
Industrial |
Ball |
100 |
TFBGA |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
128 |
CMOS |
1.8 |
1.2/3.3,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA100,11X11,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
79 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B100 |
1.2 mm |
6 mm |
No |
e0 |
118.3 MHz |
6 mm |
Yes |
79 |
||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
11 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 102 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e3 |
20 mm |
102 |
||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
5.5 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,20X20,50 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.3 mm |
27 mm |
No |
512 Macrocells |
e0 |
163.9 MHz |
20 s |
220 °C (428 °F) |
27 mm |
Yes |
212 |
|||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
16.1 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 80 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
220 °C (428 °F) |
20 mm |
No |
80 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.8 ns |
Yes |
3.6 V |
3.3 |
Grid Array |
Mixed |
3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 150 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.3 mm |
27 mm |
No |
e1 |
27 mm |
150 |
|||||||||||||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
192 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Labs interconnected by PIA; 12 Labs; 1 External Clock |
e0 |
83.3 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
64 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
192 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
1.7 ns |
No |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 152 I/O |
4 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P192 |
5.43 mm |
45.15 mm |
No |
Can also operate at 5 V supply |
45.15 mm |
152 |
|||||||||||||||||||||
Altera |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
22 ns |
No |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
160 |
2.54 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
55.5 MHz |
16 |
220 °C (428 °F) |
||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
160 Macrocells; 10 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
20 s |
235 °C (455 °F) |
14 mm |
Yes |
84 |
|||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
16.6 ns |
Yes |
5.5 V |
560 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 153 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
560 Macrocells; 772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
117.6 MHz |
220 °C (428 °F) |
28 mm |
Yes |
153 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
16 ns |
4992 |
Yes |
2.625 V |
CMOS |
333 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Registered |
2.375 V |
.5 mm |
85 °C (185 °F) |
6 Dedicated Inputs, 147 I/O |
6 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
333 |
220 °C (428 °F) |
28 mm |
147 |
||||||||||||
Altera |
Flash PLD |
Industrial |
Ball |
68 |
TFBGA |
Square |
Plastic/Epoxy |
14 ns |
Yes |
1.89 V |
64 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA68,9X9,20 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
52 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B68 |
1.2 mm |
5 mm |
No |
e0 |
118.3 MHz |
5 mm |
Yes |
52 |
||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
16.1 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 102 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e3 |
20 mm |
102 |
||||||||||||||||||||
Altera |
UV PLD |
Industrial |
Pin/Peg |
68 |
WPGA |
Square |
Ceramic, Metal-Sealed Cofired |
40 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array, Window |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P68 |
4.96 mm |
27.94 mm |
No |
128 Macrocells; 8 Labs |
62.5 MHz |
27.94 mm |
52 |
||||||||||||||||||||
Altera |
UV PLD |
Industrial |
J Bend |
84 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
55 ns |
Yes |
5.5 V |
192 |
CMOS |
5 |
5 V |
Chip Carrier, Window |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 64 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-CQCC-J84 |
5.08 mm |
29.21 mm |
No |
Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
40 MHz |
220 °C (428 °F) |
29.21 mm |
No |
64 |
|||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
100 MHz |
220 °C (428 °F) |
20 mm |
Yes |
100 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 184 I/O |
4 |
-40 °C (-40 °F) |
Quad |
S-PQFP-G240 |
4.2 mm |
32 mm |
No |
32 mm |
184 |
|||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
232 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Registered |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 180 I/O |
4 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P232 |
5.207 mm |
44.7 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
44.7 mm |
180 |
||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
14.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 369 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
23 mm |
369 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
16 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
182 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
182 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.