Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
11 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 191 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.1 mm |
17 mm |
No |
e1 |
17 mm |
191 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 470 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B600 |
1.93 mm |
45 mm |
No |
e1 |
45 mm |
470 |
||||||||||||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
40 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 52 I/O |
7 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J68 |
5.08 mm |
24.23 mm |
No |
62.5 MHz |
24.23 mm |
52 |
|||||||||||||||||||||
Altera |
UV PLD |
Industrial |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
37 ns |
No |
5.5 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
16 Macrocells; 2 External Clocks |
37 MHz |
32 mm |
16 |
||||||||||||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
64 Macrocells |
e0 |
250 MHz |
220 °C (428 °F) |
29.3116 mm |
Yes |
68 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
8 ns |
2880 |
Yes |
2.625 V |
CMOS |
249 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
Registered |
2.375 V |
1 mm |
85 °C (185 °F) |
6 Dedicated Inputs, 249 I/O |
6 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e0 |
90 MHz |
249 |
220 °C (428 °F) |
23 mm |
249 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
9.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
147 |
||||||||||||||||||||
Altera |
OT PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Metal |
25 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-MQFP-G208 |
3.96 mm |
27.69 mm |
No |
256 Macrocells; Shared Input/Clock |
e3 |
40 MHz |
27.69 mm |
160 |
||||||||||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
e0 |
250 MHz |
220 °C (428 °F) |
29.3116 mm |
Yes |
64 |
||||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
100 |
LBGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Low Profile |
BGA100,10X10,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
3 |
1.7 mm |
11 mm |
No |
e1 |
126.6 MHz |
30 s |
260 °C (500 °F) |
11 mm |
Yes |
84 |
|||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.5 ns |
4992 |
Yes |
2.625 V |
CMOS |
186 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,50 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
1 mm |
85 °C (185 °F) |
186 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
37.5 MHz |
20 s |
186 |
220 °C (428 °F) |
17 mm |
186 |
|||||||||||
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.3 mm |
27 mm |
No |
384 Macrocells |
e1 |
125 MHz |
27 mm |
212 |
||||||||||||||||||
Altera |
OT PLD |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
50 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T40 |
4.83 mm |
15.24 mm |
No |
28 Macrocells |
28.5 MHz |
52.324 mm |
24 |
||||||||||||||||||||
Altera |
OT PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
22 ns |
No |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
e0 |
55.5 MHz |
16 |
220 °C (428 °F) |
31.6865 mm |
16 |
||||||||||
Altera |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
208 |
Yes |
5.5 V |
CMOS |
68 |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
208 Logic elements; 26 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
64 |
220 °C (428 °F) |
29.3116 mm |
68 |
|||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
0.7 ns |
4992 |
Yes |
3.6 V |
CMOS |
274 |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Registered |
3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 274 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
3 |
1.63 mm |
35 mm |
No |
e0 |
20 s |
274 |
220 °C (428 °F) |
35 mm |
274 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
11 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Fine Pitch |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
147 |
||||||||||||||||||||
Altera |
OT PLD |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
9 Dedicated Inputs, 8 I/O |
9 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T20 |
7.62 mm |
No |
8 Macrocells; Shared Input/Clock |
58.8 MHz |
26.162 mm |
8 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
0.6 ns |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
16.5862 mm |
|||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 72 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
R-PQFP-G100 |
3.65 mm |
14 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
76.9 MHz |
20 mm |
72 |
||||||||||||||||||
Altera |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
37 ns |
No |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
160 |
2.54 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Dual |
R-XDIP-T24 |
No |
28.6 MHz |
16 |
|||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 160 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
Labs interconnected by PIA; 16 Labs; 2 External Clocks |
e3 |
40 MHz |
28 mm |
160 |
||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
7.5 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
No |
128 Macrocells |
e0 |
166.7 MHz |
220 °C (428 °F) |
20 mm |
No |
84 |
||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 120 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
512 Macrocells |
e0 |
87 MHz |
220 °C (428 °F) |
20 mm |
Yes |
120 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
14.5 ns |
4992 |
Yes |
2.7 V |
CMOS |
191 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
191 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
191 |
220 °C (428 °F) |
17 mm |
191 |
|||||||||||||
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
222.2 MHz |
220 °C (428 °F) |
17 mm |
Yes |
68 |
|||||||||||
Altera |
EE PLD |
Industrial |
Pin/Peg |
280 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
12 ns |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 184 I/O |
0 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P280 |
5.081 mm |
49.78 mm |
No |
400 Macrocells; 580 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
118 MHz |
49.78 mm |
184 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
8 ns |
1728 |
Yes |
2.7 V |
CMOS |
220 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
220 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B672 |
3 |
2.1 mm |
27 mm |
No |
e0 |
220 |
220 °C (428 °F) |
27 mm |
220 |
|||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
672 |
Yes |
5.5 V |
CMOS |
152 |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 152 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
672 Logic elements; 84 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
148 |
220 °C (428 °F) |
28 mm |
152 |
||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
12.5 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array, Low Profile |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
220 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
35 mm |
220 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
1.8 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Fine Pitch |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 152 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
Can also operate at 5 V supply |
e3 |
28 mm |
152 |
|||||||||||||||||||
Altera |
OT PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
22 ns |
No |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
e0 |
55.6 MHz |
16 |
220 °C (428 °F) |
31.6865 mm |
16 |
||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
5.5 V |
192 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 124 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
192 Macrocells |
e0 |
125 MHz |
220 °C (428 °F) |
28 mm |
No |
124 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
17 ns |
1728 |
Yes |
3.6 V |
CMOS |
191 |
3.3 |
3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Registered |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 191 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e1 |
191 |
220 °C (428 °F) |
17 mm |
191 |
||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
14.5 ns |
Yes |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
12.5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array, Low Profile |
Registered |
3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 274 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e1 |
35 mm |
274 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
1.7 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Chip Carrier |
Registered |
3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Can also operate at 5 V supply |
29.3116 mm |
68 |
|||||||||||||||||||||
Altera |
OT PLD |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
32 ns |
Yes |
5.5 V |
CMOS |
5 |
Small Outline |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Dual |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
No |
16 Macrocells; 2 External Clocks |
41.7 MHz |
15.4 mm |
16 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
1.8 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack |
Registered |
3 V |
.65 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 120 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Can also operate at 5 V supply |
e3 |
28 mm |
120 |
|||||||||||||||||||
Altera |
OT PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
320 |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
16 |
|||||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Chip Carrier |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
32 Macrocells |
125 MHz |
16.5862 mm |
36 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.6 ns |
2880 |
Yes |
2.7 V |
CMOS |
191 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
191 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
2880 Logic Elements |
e0 |
140 MHz |
20 s |
191 |
220 °C (428 °F) |
17 mm |
191 |
||||||||||
Altera |
EE PLD |
Industrial |
Pin/Peg |
192 |
PGA |
Square |
Ceramic |
15 ns |
No |
256 |
CMOS |
3.3/5,5 V |
Grid Array |
PGA192M,17X17 |
Programmable Logic Devices |
Yes |
2.54 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-XPGA-P192 |
1 |
No |
e0 |
220 °C (428 °F) |
Yes |
||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
23 ns |
Yes |
5.5 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 168 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
320 Macrocells |
e0 |
100 MHz |
220 °C (428 °F) |
35 mm |
Yes |
168 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
0.7 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
85 °C (185 °F) |
4 Dedicated Inputs, 413 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
No |
e1 |
413 |
|||||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
95.2 MHz |
220 °C (428 °F) |
28 mm |
Yes |
164 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
24.2 ns |
Yes |
5.25 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.75 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
3744 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
60.6 MHz |
32 mm |
189 |
||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
21.1 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 291 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
2.1 mm |
23 mm |
No |
e1 |
23 mm |
291 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.