Industrial Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
SLG46120VTR	Renesas Electronics	OT PLD	Industrial	No Lead	12	VQCCN	Square				Yes	1.89 V	12		10	PLA-TYPE	1.8	Box, Tape and Reel, 7 in		Chip Carrier	LCC12,.06SQ,16		No	Macrocell	1.71 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 9 I/O	1	-40 °C (-40 °F)		Quad	S-XQCC-N12		.6 mm	1.6 mm		Can also operate at 3.3 V or 5 V supply				9		1.6 mm	No	9
PLX464I-45	Broadcom		Industrial	Through-Hole	24	DIP	Rectangular	Ceramic			No		8	CMOS	26	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				88	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin/Lead	Dual	R-XDIP-T24				No		e0	15 MHz		8				8
PLX448I-55	Broadcom		Industrial	Through-Hole	24	DIP	Rectangular	Ceramic			No		8	CMOS	26	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				88	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin/Lead	Dual	R-XDIP-T24				No		e0			8				8
PLX464I-55	Broadcom		Industrial	Through-Hole	24	DIP	Rectangular	Ceramic			No		8	CMOS	26	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				88	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin/Lead	Dual	R-XDIP-T24				No		e0			8				8
PLX448I-45	Broadcom		Industrial	Through-Hole	24	DIP	Rectangular	Ceramic			No		8	CMOS	26	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				88	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin/Lead	Dual	R-XDIP-T24				No		e0	15 MHz		8				8
CPL20R6L-25NI	Samsung		Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No			CMOS	14	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		64	2.54 mm	105 °C (221 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0			8
CPL16R6L-25NI	Samsung		Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy			No			CMOS	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	105 °C (221 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20	3			No		e0	28.5 MHz		6
CPL20L8L-25NI	Samsung		Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No			CMOS	12	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		72	2.54 mm	105 °C (221 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0			8
CPL20R8L-25NI	Samsung		Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy			No			CMOS	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		72	2.54 mm	105 °C (221 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0	28.5 MHz		8
CPL20R4L-25NI	Samsung		Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy			No			CMOS	16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		60	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0	28.5 MHz		8
CPL20L10L-25NI	Samsung		Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No			CMOS	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	105 °C (221 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0			10
CPL16L8L-25NI	Samsung		Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns		No			CMOS	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	105 °C (221 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20	3			No		e0			8
CPL16R8L-25NI	Samsung		Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy			No			CMOS	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	105 °C (221 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20	3			No		e0	28.5 MHz		8
CPL16R4L-25NI	Samsung		Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy			No			CMOS	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Registered		64	2.54 mm	105 °C (221 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20	3			No		e0	28.5 MHz		4
EPF10K130EBI600-3	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	16 ns	6656	Yes	2.7 V		CMOS	424		2.5		2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Mixed	2.3 V		1.27 mm	85 °C (185 °F)	424 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			424	220 °C (428 °F)	45 mm		424
EP1K30TI144-2	Altera	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS	102		2.5		2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	85 °C (185 °F)	102 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	37.5 MHz	20 s	102	220 °C (428 °F)	20 mm		102
EPM7064TI44-7	Altera	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	7.5 ns		Yes	5.5 V	64	CMOS			5		5 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	64 Macrocells	e0	166.7 MHz			220 °C (428 °F)	10 mm	No	36
EPM7128SQI160-10	Altera	EE PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	128	CMOS			5		3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin/Lead	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	125 MHz	20 s		220 °C (428 °F)	28 mm	Yes	100
EPS448LI-20	Altera	OT PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy			Yes	5.5 V		CMOS			5			Chip Carrier				Registered	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 0 I/O	8	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No	Stand-Alone Microsequencer	e0	20 MHz			220 °C (428 °F)	11.5062 mm		0
EPM7160EQI160-15	Altera	EE PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	160	CMOS			5		3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 104 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	100 MHz			220 °C (428 °F)	28 mm	No	104
EPF81188ARI240-5	Altera	Loadable PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy			Yes	5.5 V		CMOS			5			Flatpack, Heat Sink/Slug, Fine Pitch				Registered	4.5 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 180 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					32 mm		180
EP1K100QI208-1	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	9 ns	4992	Yes	2.625 V		CMOS	333		2.5		2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	2.375 V		.5 mm	85 °C (185 °F)	6 Dedicated Inputs, 147 I/O	6	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	90 MHz		333	220 °C (428 °F)	28 mm		147
EPM7128ELI84-15	Altera	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	128	CMOS			5		3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	128 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock	e0	76.9 MHz			220 °C (428 °F)	29.3116 mm	No	64
EPF10K50VFI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	14 ns		Yes	3.6 V		CMOS			3.3			Grid Array				Registered	3 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 291 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		291
EPF10K20LI84-5	Altera	Loadable PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	27 ns		Yes	5.5 V		CMOS			5			Chip Carrier				Registered	4.5 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	1152 Logic elements; Built-in JTAG boundry-scan test circuitry		53.76 MHz				29.3116 mm
EPF10K50EQI208-3	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	13.5 ns	2880	Yes	2.7 V		CMOS	147		2.5		2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.3 V		.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			147	220 °C (428 °F)	28 mm		147
EPM7512AEQI208-12	Altera	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	512	CMOS			3.3		2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 176 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	512 Macrocells	e0	71.9 MHz			220 °C (428 °F)	28 mm	Yes	176
EPM5016SI-17	Altera		Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	17 ns		Yes			CMOS	16	PAL-TYPE	5		5 V	Small Outline	SOP20,.4	Programmable Logic Devices				160	1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G20				No		e0			8	220 °C (428 °F)
EPF10K100EFI672-2X	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	12 ns		Yes	2.7 V		CMOS			2.5			Grid Array				Mixed	2.3 V		1 mm	85 °C (185 °F)	338 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		338
EPF10K50EFI672-3	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	13.5 ns	2880	Yes	2.7 V		CMOS	254		2.5		2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Mixed	2.3 V		1 mm	85 °C (185 °F)	254 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			254	220 °C (428 °F)	27 mm		254
EPM9560RI240-15	Altera	EE PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	16.6 ns		Yes	5.5 V	560	CMOS			5		3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 191 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No	560 Macrocells; 772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	117.6 MHz			220 °C (428 °F)	32 mm	Yes	191
EPM9560ARI240-15	Altera	EE PLD	Industrial	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	16.6 ns		Yes	5.5 V		CMOS			5			Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 191 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.2 mm	32 mm	No	560 Macrocells; 35 Labs; 772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e3				220 °C (428 °F)	32 mm		191
EPM5032PI-20	Altera	OT PLD	Industrial	Through-Hole	28	DIP	Rectangular	Plastic/Epoxy	20 ns		No	5.5 V		CMOS	24	PAL-TYPE	5		5 V	In-Line	DIP28,.3	Programmable Logic Devices		Macrocell	4.5 V	320	2.54 mm	85 °C (185 °F)	7 Dedicated Inputs, 16 I/O	7	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)			16
EPM7064QI100-10C	Altera	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns		Yes	5.5 V		CMOS			5			Flatpack				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100		3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	100 MHz				20 mm		64
EPM5128GI-2	Altera	UV PLD	Industrial	Pin/Peg	68	PGA	Square	Ceramic, Metal-Sealed Cofired	45 ns		No	5.5 V	128	CMOS			5		5 V	Grid Array	PGA68,11X11	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	7 Dedicated Inputs, 52 I/O	7	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-CPGA-P68	1			No	Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock	e0	40 MHz			220 °C (428 °F)		No	52
EPM7128EQI100-15	Altera	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns		Yes	5.5 V	128	CMOS			5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	100 MHz			220 °C (428 °F)	20 mm	No	84
EPF10K100EBI356-3X	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	16 ns		Yes	2.7 V		CMOS			2.5			Grid Array, Low Profile				Mixed	2.3 V		1.27 mm	85 °C (185 °F)	274 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		274
EP1K30QI208-2	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.4 ns	1728	Yes	2.625 V		CMOS	147		2.5		2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Mixed	2.375 V		.5 mm	85 °C (185 °F)	147 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	37.5 MHz		147	220 °C (428 °F)	28 mm		147
EPM3064ATI44-10	Altera	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS			3.3		2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No		e0	100 MHz	20 s		235 °C (455 °F)	10 mm	Yes	34
EP610DI-15	Altera	UV PLD	Industrial	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns		No	5.5 V					5			In-Line				Macrocell	4.5 V			85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)		Dual	R-GDIP-T24				No			83.3 MHz						16
EP610DI-30	Altera	UV PLD	Industrial	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	32 ns		No	5.5 V		CMOS	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	160	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)	Tin Lead	Dual	R-GDIP-T24				No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks	e0	33.3 MHz		16	220 °C (428 °F)			16
EPM7032JI44-15	Altera	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.5 V		CMOS			5			Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)		Quad	S-PQCC-J44		4.572 mm	16.5862 mm	No			100 MHz			220 °C (428 °F)	16.5862 mm		36
5962-01-364-7971	Altera	OT PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	70 ns		Yes		48	CMOS			5		5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68	1			No		e0						No
EPF8282ATI100-2	Altera	Loadable PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		208	Yes	5.5 V		CMOS	78		5		3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays		Macrocell	4.5 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 78 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	208 Logic elements; 26 Labs; Configurable I/O operation with 3.3 V or 5 V	e0			74	220 °C (428 °F)	14 mm		78
EPF10K30EFI484-2X	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	9.5 ns		Yes	2.7 V		CMOS			2.5			Grid Array				Mixed	2.3 V		1 mm	85 °C (185 °F)	220 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1					23 mm		220
EPM5128GI68-2	Altera	UV PLD	Industrial	Pin/Peg	68	WPGA	Square	Ceramic, Metal-Sealed Cofired	45 ns		No	5.5 V		CMOS			5			Grid Array, Window				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	7 Dedicated Inputs, 52 I/O	7	-40 °C (-40 °F)		Perpendicular	S-CPGA-P68		4.96 mm	27.94 mm	No	128 Macrocells; 8 Labs		50 MHz				27.94 mm		52
EP610LI-20T	Altera	OT PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	22 ns		Yes	5.5 V		CMOS			5			Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)		Quad	S-PQCC-J28		4.57 mm	11.505 mm	No			55.6 MHz				11.505 mm		16
EPM7256AEFI256-7N	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS			3.3		2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	126.6 MHz	30 s		260 °C (500 °F)	17 mm	Yes	164

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.