Industrial Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XCR3512XL-12FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	512	CMOS				3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
XC95288XV-10FGG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns	Yes	2.62 V	288	CMOS				2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.37 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	100 MHz	30 s		260 °C (500 °F)	17 mm	Yes	192
XC95288XL-7FG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	125 MHz	30 s	192	225 °C (437 °F)	17 mm	Yes	192
XC9572XL-7CSG48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	72	CMOS		38		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 38 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	72 Macrocells	e1	125 MHz	30 s	38	260 °C (500 °F)	7 mm	Yes	38
XC7272-30WC84I	Xilinx	UV PLD	Industrial	J Bend	84	QCCJ	Square	Ceramic	48 ns	Yes		72	CMOS				5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-XQCC-J84				No								No
XC95108-20PC84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0		30 s		225 °C (437 °F)	29.3116 mm	Yes	69
XCR3256XL-7.5CS280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS				3.3		Grid Array, Thin Profile, Fine Pitch				Macrocell	2.7 V		.8 mm	85 °C (185 °F)	160 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	167 MHz				16 mm		160
XC7336-10PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	36	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	100 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XC95288XV-7FGG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	288	CMOS				2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.37 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	125 MHz	30 s		260 °C (500 °F)	17 mm	Yes	192
XC7236A-25PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	40 ns	Yes	5.5 V	36	CMOS				5	3/5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	33 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	30
XC73144-12PQ160I	Xilinx	OT PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	30 ns	Yes	5.5 V	144	CMOS				5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	12 Dedicated Inputs, 110 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops	e0	55.6 MHz	30 s		225 °C (437 °F)	28 mm	No	110
XC95216-20PQG160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	20 ns	Yes	5.5 V	216	CMOS				5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 133 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G160	3	3.7 mm	28 mm	No		e3	50 MHz	30 s		245 °C (473 °F)	28 mm	Yes	133
XCR3032A-7VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS				3		Flatpack, Thin Profile				Macrocell	2.7 V		.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	95 MHz	30 s		240 °C (464 °F)	10 mm		32
XC95144-10PQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	144	CMOS				5	3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e3	67.7 MHz	30 s		245 °C (473 °F)	20 mm	Yes	81
XC2C64-5CPG56I	Xilinx	Flash PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	5 ns	Yes	1.9 V		CMOS				1.8		Grid Array, Low Profile, Fine Pitch				Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 45 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No		e1		30 s		260 °C (500 °F)	6 mm		45
XC95288XV-7FG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	288	CMOS				2.5	1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.37 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	125 MHz	30 s		225 °C (437 °F)	17 mm	Yes	192
XCR3064XL-10VQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	64	CMOS				3.3	3/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	95 MHz	30 s		240 °C (464 °F)	14 mm	Yes	68
XC7272A-20WC84I	Xilinx	UV PLD	Industrial	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	32 ns	Yes	5.5 V	72	CMOS				5	5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 42 I/O	12	-40 °C (-40 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	PAL Blocks interconnected by PIA; 72 Macrocells		50 MHz				29.21 mm	No	42
XCR3256XL-10CS280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS				3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.7 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	105 MHz	30 s		240 °C (464 °F)	16 mm	Yes	164
XC9572F-10PC84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	67 MHz				29.3116 mm		69
XCR22LV10-15PC28I	Xilinx	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS		22	PAL-TYPE	3.3	3.3 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	3 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No		e0	65 MHz		10		11.5062 mm		10
XC7372-15WC68I	Xilinx	UV PLD	Industrial	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	33 ns	Yes	5.5 V	72	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 25 I/O	10	-40 °C (-40 °F)		Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		52.6 MHz				24.13 mm	No	25
XC2C64-7VQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	64	CMOS				1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	14 mm	Yes	64
XCR3384XL-10FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	384	CMOS				3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	102 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XC95108F-15PQG160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5		Flatpack				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e3	56 MHz				28 mm		108
XCR3064-15PC68I	Xilinx	EE PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.6 V	64	CMOS				3.3	3.3 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	2.97 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 48 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No			58 MHz				24.2316 mm	No	48
XCR3512XL-10FTG256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	512	CMOS				3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	97 MHz	30 s		260 °C (500 °F)	17 mm	Yes	212
XA9572XL-10VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS	AEC-Q100			3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm	Yes	34
XC2C32-4CPG56I	Xilinx	Flash PLD	Industrial	Ball	56	LFBGA	Square	Plastic/Epoxy	4.5 ns	Yes	1.9 V		CMOS				1.8		Grid Array, Low Profile, Fine Pitch				Macrocell	1.7 V		.5 mm	85 °C (185 °F)	1 Dedicated Inputs, 33 I/O	1	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B56	3	1.35 mm	6 mm	No	Fast Zero Power Design Technology	e1		30 s		260 °C (500 °F)	6 mm		33
TC9808P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	29 ns	No	5.25 V	8	CMOS		18	PLA-TYPE	5		In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function	e0	22 MHz		9		24.6 mm		9
TC9809P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	29 ns	No	5.25 V	8	CMOS		18	PLA-TYPE	5		In-Line				Macrocell	4.75 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function	e0	22 MHz		9		24.6 mm		9
TC9800FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	60 ns	Yes	6 V	8	CMOS		18	PLA-TYPE	5		Small Outline				Macrocell	2 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock		10 MHz		9		12.8 mm		9
TC9801FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	60 ns	Yes	5.5 V	8	CMOS		18	PLA-TYPE	5		Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock		10 MHz		9		12.8 mm		9
TC9802FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	6 V	8	CMOS		18	PLA-TYPE	5		Small Outline				Macrocell	2 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Copper/Tin Silver	Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e2	14 MHz		9		12.8 mm		9
TC9803P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No	5.5 V	8	CMOS		18	PLA-TYPE	5		In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	14 MHz		9		24.6 mm		9
TC9801P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	60 ns	No	5.5 V	8	CMOS		18	PLA-TYPE	5		In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	10 MHz		9		24.6 mm		9
TC9802P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No	6 V	8	CMOS		18	PLA-TYPE	5		In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	14 MHz		9		24.6 mm		9
TC9807P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	21 ns	No	5.25 V		CMOS		16	PAD-TYPE	5		In-Line				Combinatorial	4.75 V		2.54 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	Zero-Standby Function	e0			12		24.6 mm		10
TC9806P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	21 ns	No	5.25 V		CMOS		16	PAD-TYPE	5		In-Line				Combinatorial	2 V		2.54 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	Zero-Standby Function	e0			12		24.6 mm		10
TC9800P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	60 ns	No	6 V	8	CMOS		18	PLA-TYPE	5		In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	10 MHz		9		24.6 mm		9
TC9807FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	21 ns	Yes	5.25 V		CMOS		16	PAD-TYPE	5		Small Outline				Combinatorial	4.75 V		1.27 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)	Tin Copper/Tin Silver	Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	Zero-Standby Function	e2			12		12.8 mm		10
TC9808FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	29 ns	Yes	5.25 V	8	CMOS		18	PLA-TYPE	5		Small Outline				Macrocell	2 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function		22 MHz		9		12.8 mm		9
TC9803FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	8	CMOS		18	PLA-TYPE	5		Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Copper/Tin Silver	Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e2	14 MHz		9		12.8 mm		9
TC9809FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	29 ns	Yes	5.25 V	8	CMOS		18	PLA-TYPE	5		Small Outline				Macrocell	4.75 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function		22 MHz		9		12.8 mm		9
TC9804P	Toshiba	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V	16	CMOS		22	PLA-TYPE	5		In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	2 Dedicated Inputs, 16 I/O	2	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		4.45 mm	7.62 mm	No	16 Macrocells; 4 External Clocks; Shared Input/Clock; Set/Reset In Asynchronous Enable	e0	12 MHz		16		29.8 mm		16
TC9805P	Toshiba	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V	16	CMOS		22	PLA-TYPE	5		In-Line				Macrocell	4.75 V		2.54 mm	85 °C (185 °F)	2 Dedicated Inputs, 16 I/O	2	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		4.45 mm	7.62 mm	No	16 Macrocells; 4 External Clocks; Shared Input/Clock; Set/Reset In Asynchronous Enable	e0	12 MHz		16		29.8 mm		16
TC9806FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	21 ns	Yes	5.25 V		CMOS		16	PAD-TYPE	5		Small Outline				Combinatorial	2 V		1.27 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	Zero-Standby Function				12		12.8 mm		10
HPL4-16RC4-9	Renesas Electronics	OT PLD	Industrial	No Lead	20	QCCN	Square	Ceramic		Yes	5.5 V		CMOS		12	PAL-TYPE	5	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 4 I/O		-40 °C (-40 °F)		Quad	S-XQCC-N20				No			5 MHz		8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.