Industrial Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XCR3064XL-6VQG100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6 ns	Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile, Fine Pitch				Macrocell	2.7 V		.5 mm	85 °C (185 °F)	64 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	167 MHz	30 s		260 °C (500 °F)	14 mm		64
XC95108F-20PC84I	Xilinx	Flash PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 69 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	50 MHz				29.3116 mm		69
XC7372-10PC68I	Xilinx	OT PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	23 ns	Yes	5.5 V	72	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 25 I/O	10	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68		5.08 mm	24.2316 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops	e0	71.4 MHz				24.2316 mm	No	25
XC9536-15VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	36	CMOS				5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	55.6 MHz	30 s		260 °C (500 °F)	10 mm	Yes	34
XC95288XL-10CSG280I	Xilinx	Flash PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS		192		3.3	2.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e1	100 MHz	30 s	192	260 °C (500 °F)	16 mm	Yes	192
XCR3064XL-6VQG44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	6 ns	Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile				Macrocell	2.7 V		.8 mm	85 °C (185 °F)	32 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	167 MHz	30 s		260 °C (500 °F)	10 mm		32
XC9536F-15VQ44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS				5		Flatpack, Thin Profile				Macrocell	4.5 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	56 MHz				10 mm		34
XCR5064C-12PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	67 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XCR3032XL-5CSG48I	Xilinx	EE PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	5 ns	Yes	3.6 V		CMOS				3.3		Grid Array, Fine Pitch				Macrocell	2.7 V		.8 mm	85 °C (185 °F)	32 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1	200 MHz	30 s		260 °C (500 °F)	7 mm		32
XA95144XL-15CSG144I	Xilinx	Flash PLD	Industrial	Ball	144	BGA	Square	Plastic/Epoxy	15.5 ns	Yes	3.6 V		CMOS				3.3		Grid Array				Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1		30 s		260 °C (500 °F)	12 mm		117
XCR22V10-10PC28I	Xilinx	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS				5		Chip Carrier				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No			74 MHz				11.5062 mm		10
XC7372-15PG84I	Xilinx	OT PLD	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	33 ns	No	5.5 V	72	CMOS				5	3.3/5,5 V	Grid Array	PGA84M,11X11	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 37 I/O	12	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		52.6 MHz				27.94 mm	No	37
XA2C128-7CPG132I	Xilinx	Flash PLD	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS	AEC-Q100			1.8	1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	112 MHz	30 s		260 °C (500 °F)	8 mm	Yes	100
XC95108-15TQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	HLFQFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3		30 s		260 °C (500 °F)	14 mm	Yes	81
XC7354-10WC44I	Xilinx	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	22 ns	Yes	5.5 V	54	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 25 I/O	8	-40 °C (-40 °F)	Tin Lead	Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops	e0	76.9 MHz				16.51 mm	No	25
XC7336-15PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	23 ns	Yes	5.5 V	36	CMOS				5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	66.7 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	32
XC95108-20TQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	HLFQFP	Square	Plastic/Epoxy	20 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0		30 s		225 °C (437 °F)	14 mm	Yes	81
XC7372-7PC68I	Xilinx	OT PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes		72	CMOS					3.3/5,5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68				No		e0						No
XC95144XV-7TQG144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	144	CMOS				2.5	1.8/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.37 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	125 MHz	30 s		260 °C (500 °F)	20 mm	Yes	117
XC7372-10WC84I	Xilinx	UV PLD	Industrial	J Bend	84	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	23 ns	Yes	5.5 V	72	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 37 I/O	12	-40 °C (-40 °F)		Quad	S-CQCC-J84	1	4.826 mm	29.21 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		71.4 MHz				29.21 mm	No	37
XC95108-10PQ160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	HQFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	108	CMOS				5	3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G160	3	4.1 mm	28 mm	No		e0		30 s		225 °C (437 °F)	28 mm	Yes	108
XC7372-12WC68I	Xilinx	UV PLD	Industrial	J Bend	68	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	28 ns	Yes	5.5 V	72	CMOS				5	3.3/5,5 V	Chip Carrier, Window	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 25 I/O	10	-40 °C (-40 °F)		Quad	S-CQCC-J68	1	4.826 mm	24.13 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		62.5 MHz				24.13 mm	No	25
XCR5128-15VQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	17.5 ns	Yes	5.5 V	128	CMOS				5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	63 MHz	30 s		240 °C (464 °F)	14 mm	Yes	80
XC2C32-6VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	6 ns	Yes	1.9 V	32	CMOS				1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	1.7 V		.8 mm	85 °C (185 °F)	1 Dedicated Inputs, 33 I/O	1	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	Real Digital Design Technology	e3		30 s		260 °C (500 °F)	10 mm	Yes	33
XC2C128-7CP132I	Xilinx	Flash PLD	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS		100	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	119 MHz	30 s	100	240 °C (464 °F)	8 mm	Yes	100
XC9536XV-7CS48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	36	CMOS				2.5	1.8/3.3,2.5 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.37 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0		30 s		240 °C (464 °F)	7 mm	Yes	36
XC7272-25WC68I	Xilinx	UV PLD	Industrial	J Bend	68	QCCJ	Square	Ceramic	40 ns	Yes		72	CMOS				5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No				1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)		Quad	S-XQCC-J68				No								No
XC95144XV-4TQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	4 ns	Yes	2.6 V						2.5		Flatpack, Low Profile, Fine Pitch				Registered	2.4 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0					14 mm		81
XA9536XL-10VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS	AEC-Q100			3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm	Yes	34
TC9808P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	29 ns	No	5.25 V	8	CMOS		18	PLA-TYPE	5		In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function	e0	22 MHz		9		24.6 mm		9
TC9809P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	29 ns	No	5.25 V	8	CMOS		18	PLA-TYPE	5		In-Line				Macrocell	4.75 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function	e0	22 MHz		9		24.6 mm		9
TC9800FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	60 ns	Yes	6 V	8	CMOS		18	PLA-TYPE	5		Small Outline				Macrocell	2 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock		10 MHz		9		12.8 mm		9
TC9801FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	60 ns	Yes	5.5 V	8	CMOS		18	PLA-TYPE	5		Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock		10 MHz		9		12.8 mm		9
TC9802FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	6 V	8	CMOS		18	PLA-TYPE	5		Small Outline				Macrocell	2 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Copper/Tin Silver	Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e2	14 MHz		9		12.8 mm		9
TC9803P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No	5.5 V	8	CMOS		18	PLA-TYPE	5		In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	14 MHz		9		24.6 mm		9
TC9801P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	60 ns	No	5.5 V	8	CMOS		18	PLA-TYPE	5		In-Line				Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	10 MHz		9		24.6 mm		9
TC9802P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	40 ns	No	6 V	8	CMOS		18	PLA-TYPE	5		In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	14 MHz		9		24.6 mm		9
TC9807P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	21 ns	No	5.25 V		CMOS		16	PAD-TYPE	5		In-Line				Combinatorial	4.75 V		2.54 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	Zero-Standby Function	e0			12		24.6 mm		10
TC9806P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	21 ns	No	5.25 V		CMOS		16	PAD-TYPE	5		In-Line				Combinatorial	2 V		2.54 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	Zero-Standby Function	e0			12		24.6 mm		10
TC9800P	Toshiba	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	60 ns	No	6 V	8	CMOS		18	PLA-TYPE	5		In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20		4.45 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	10 MHz		9		24.6 mm		9
TC9807FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	21 ns	Yes	5.25 V		CMOS		16	PAD-TYPE	5		Small Outline				Combinatorial	4.75 V		1.27 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)	Tin Copper/Tin Silver	Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	Zero-Standby Function	e2			12		12.8 mm		10
TC9808FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	29 ns	Yes	5.25 V	8	CMOS		18	PLA-TYPE	5		Small Outline				Macrocell	2 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function		22 MHz		9		12.8 mm		9
TC9803FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes	5.5 V	8	CMOS		18	PLA-TYPE	5		Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)	Tin Copper/Tin Silver	Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e2	14 MHz		9		12.8 mm		9
TC9809FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	29 ns	Yes	5.25 V	8	CMOS		18	PLA-TYPE	5		Small Outline				Macrocell	4.75 V		1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 9 I/O	8	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function		22 MHz		9		12.8 mm		9
TC9804P	Toshiba	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V	16	CMOS		22	PLA-TYPE	5		In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	2 Dedicated Inputs, 16 I/O	2	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		4.45 mm	7.62 mm	No	16 Macrocells; 4 External Clocks; Shared Input/Clock; Set/Reset In Asynchronous Enable	e0	12 MHz		16		29.8 mm		16
TC9805P	Toshiba	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V	16	CMOS		22	PLA-TYPE	5		In-Line				Macrocell	4.75 V		2.54 mm	85 °C (185 °F)	2 Dedicated Inputs, 16 I/O	2	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		4.45 mm	7.62 mm	No	16 Macrocells; 4 External Clocks; Shared Input/Clock; Set/Reset In Asynchronous Enable	e0	12 MHz		16		29.8 mm		16
TC9806FW	Toshiba	EE PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	21 ns	Yes	5.25 V		CMOS		16	PAD-TYPE	5		Small Outline				Combinatorial	2 V		1.27 mm	85 °C (185 °F)	6 Dedicated Inputs, 10 I/O	6	-40 °C (-40 °F)		Dual	R-PDSO-G20		2.7 mm	7.5 mm	No	Zero-Standby Function				12		12.8 mm		10
HPL4-16RC4-9	Renesas Electronics	OT PLD	Industrial	No Lead	20	QCCN	Square	Ceramic		Yes	5.5 V		CMOS		12	PAL-TYPE	5	5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	85 °C (185 °F)	8 Dedicated Inputs, 4 I/O		-40 °C (-40 °F)		Quad	S-XQCC-N20				No			5 MHz		8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.