Industrial Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC95288-20BG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	20 ns	Yes	5.5 V	288	CMOS			5	3.3/5,5 V	Grid Array, Low Profile	BGA352,26X26,50	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	50 MHz	30 s		225 °C (437 °F)	35 mm	Yes	192
XC2C384-10FG324I	Xilinx	Flash PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	384	CMOS	240	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 240 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0	83 MHz	30 s	240	225 °C (437 °F)	23 mm	Yes	240
XC95288XL-7PQ208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	288	CMOS	168		3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 168 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	125 MHz		168		28 mm	Yes	168
XCR3256XL-12FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	256	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	88 MHz	30 s		225 °C (437 °F)	17 mm	Yes	164
XCR3256XL-10CSG280I	Xilinx	EE PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	256	CMOS			3.3	3/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e1	105 MHz	30 s		260 °C (500 °F)	16 mm	Yes	164
XC7372-15PC68I	Xilinx	OT PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	33 ns	Yes	5.5 V	72	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 25 I/O	10	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		52.6 MHz				24.2316 mm	No	25
XC9536XL-7VQG64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V	36	CMOS	36		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e3	138.88 MHz	30 s	36	260 °C (500 °F)	10 mm	Yes	36
XC9572XL-10CS48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	72	CMOS	38		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 38 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	72 Macrocells	e0	100 MHz	30 s	38	240 °C (464 °F)	7 mm	Yes	38
XCR3320-8TQ144I	Xilinx	Loadable PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8.5 ns	Yes	3.6 V	320	CMOS			3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	.5 mm	85 °C (185 °F)	12 Dedicated Inputs, 3 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	95 MHz	30 s		225 °C (437 °F)	20 mm	Yes	3
XCR5064-12PQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	12 ns	Yes	5.5 V	64	CMOS			5	5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	No	Macrocell	4.5 V	.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	67 MHz	30 s		225 °C (437 °F)	20 mm	No	64
XCR3064-12PC68I	Xilinx	EE PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	64	CMOS			3.3	3.3 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	2.97 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 48 I/O	2	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No			67 MHz				24.2316 mm	No	48
XC9536XV-5PC44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	3.5 ns	Yes	2.6 V					2.5		Chip Carrier				Registered	2.4 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0					16.5862 mm		34
XC95144XV-5TQG144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4 ns	Yes	2.6 V					2.5		Flatpack, Low Profile, Fine Pitch				Registered	2.4 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3					20 mm		117
XC9572XV-7PCG44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	72	CMOS			2.5	1.8/3.3,2.5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.37 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e3	125 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC7372-12PC68I	Xilinx	OT PLD	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	28 ns	Yes	5.5 V	72	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 25 I/O	10	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops		62.5 MHz				24.2316 mm	No	25
XC7336-15PQ44I	Xilinx	OT PLD	Industrial	Gull Wing	44	QFP	Square	Plastic/Epoxy	23 ns	Yes	5.5 V	36	CMOS			5	3.3/5,5 V	Flatpack	QFP44,.5SQ,32	Programmable Logic Devices	No	Macrocell	4.5 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	2.35 mm	10 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops	e0	66.7 MHz	30 s		225 °C (437 °F)	10 mm	No	32
XC9536XV-4VQ44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	3.5 ns	Yes	2.6 V					2.5		Flatpack, Thin Profile				Registered	2.4 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0					10 mm		34
XC2C128-7TQ144I	Xilinx	Flash PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	1.9 V	128	CMOS	100	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	119 MHz		100		20 mm	Yes	100
XC95216-15PQ160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	216	CMOS			5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 133 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	3.7 mm	28 mm	No	216 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	55.6 MHz	30 s		225 °C (437 °F)	28 mm	Yes	133
XC95108F-20PQ160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS			5		Flatpack				Macrocell	4.5 V	.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e0	50 MHz				28 mm		108
XC9536F-15VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS			5		Flatpack, Thin Profile				Macrocell	4.5 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e3	56 MHz				10 mm		34
XCR3128-15VQ100I	Xilinx	EE PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	15 ns	Yes	3.63 V	128	CMOS			3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.97 V	.5 mm	85 °C (185 °F)	2 Dedicated Inputs, 80 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	59 MHz	30 s		240 °C (464 °F)	14 mm	Yes	80
XC95288-15BGG352I	Xilinx	Flash PLD	Industrial	Ball	352	LBGA	Square	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS			5		Grid Array, Low Profile				Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	288 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e1	55.6 MHz	30 s		260 °C (500 °F)	35 mm		192
XCR3032C-12PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	3.63 V	32	CMOS			3.3	3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	2.97 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	47 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XC95108F-20PQG160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	20 ns	Yes	5.5 V		CMOS			5		Flatpack				Macrocell	4.5 V	.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No		e3	50 MHz				28 mm		108
XC2C64-5VQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS			1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0		30 s		240 °C (464 °F)	14 mm	Yes	64
XC2C384-10PQ208I	Xilinx	Flash PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns	Yes	1.9 V	384	CMOS	173	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 173 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	83 MHz		173		28 mm	Yes	173
XC9536XV-5VQ44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	3.5 ns	Yes	2.6 V					2.5		Flatpack, Thin Profile				Registered	2.4 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0					10 mm		34
XCR5032C-10PC44I	Xilinx	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	32	CMOS			5	5 V	Chip Carrier	QFP44,.5SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0	59 MHz	30 s		225 °C (437 °F)	16.5862 mm	Yes	32
XCR3256XL-7.5TQG144I	Xilinx	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7.5 ns	Yes	3.6 V		CMOS			3.3		Flatpack, Low Profile, Fine Pitch				Macrocell	2.7 V	.5 mm	85 °C (185 °F)	116 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	167 MHz	30 s		260 °C (500 °F)	20 mm		116
XC9572-10TQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	72	CMOS			5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 72 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0	66.7 MHz	30 s		225 °C (437 °F)	14 mm	Yes	72
XCR5032-10VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS			5		Flatpack, Thin Profile				Macrocell	4.5 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-PQFP-G44		1.2 mm	10 mm	No			59 MHz				10 mm		32
XCR3128-15PC84I	Xilinx	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	3.63 V	128	CMOS			3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	2.97 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	59 MHz	30 s		225 °C (437 °F)	29.3116 mm	Yes	64
XCR3320-8BG256I	Xilinx	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	8.5 ns	Yes	3.6 V	320	CMOS			3.3	3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 3 I/O	12	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	95 MHz	30 s		225 °C (437 °F)	27 mm	Yes	3
XC9536XV-3CSG48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	3.5 ns	Yes	2.6 V					2.5		Grid Array, Fine Pitch				Registered	2.4 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e1					7 mm		36
XCR3064A-12VQ44I	Xilinx	EE PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	12 ns	Yes	3.6 V	64	CMOS			3	3/3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.7 V	.8 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	77 MHz	30 s		240 °C (464 °F)	10 mm	Yes	32
XC95108-20PQ160I	Xilinx	Flash PLD	Industrial	Gull Wing	160	HQFP	Rectangular	Plastic/Epoxy	20 ns	Yes	5.5 V	108	CMOS			5	3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP160,1.2SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 108 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G160	3	4.1 mm	28 mm	No		e0		30 s		225 °C (437 °F)	28 mm	Yes	108
XC73108-20PQ160I	Xilinx	OT PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	45 ns	Yes	5.5 V	108	CMOS			5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V	.65 mm	85 °C (185 °F)	12 Dedicated Inputs, 78 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops	e0	35.7 MHz	30 s		225 °C (437 °F)	28 mm	No	78
XC7236A-20PC44I	Xilinx	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	32 ns	Yes	5.5 V	36	CMOS			5	3/5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No	PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V	e0	40 MHz	30 s		225 °C (437 °F)	16.5862 mm	No	30
XC95288XL-10BG256I	Xilinx	Flash PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	288	CMOS	192		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e0	100 MHz	30 s	192	225 °C (437 °F)	27 mm	Yes	192
XC2C64-5PC44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns	Yes	1.9 V	64	CMOS			1.8	1.5/3.3,1.8 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	1.7 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 33 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J44	3	4.57 mm	16.5862 mm	No		e0		30 s		225 °C (437 °F)	16.5862 mm	Yes	33
XC9536-15PCG44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns	Yes	5.5 V	36	CMOS			5	3.3/5,5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3	55.6 MHz	30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XC7336Q-12WC44I	Xilinx	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	19 ns	Yes	5.5 V	36	CMOS			5	3.3/5,5 V	Chip Carrier, Window	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 32 I/O	2	-40 °C (-40 °F)		Quad	S-CQCC-J44	1	4.826 mm	16.51 mm	No	36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops		80 MHz				16.51 mm	No	32
XC95288XV-7CS280I	Xilinx	Flash PLD	Industrial	Ball	280	TFBGA	Square	Plastic/Epoxy	7.5 ns	Yes	2.62 V	288	CMOS			2.5	1.8/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Programmable Logic Devices	Yes	Macrocell	2.37 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 192 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No		e0	125 MHz	30 s		240 °C (464 °F)	16 mm	Yes	192
XC9536XL-10PCG44I	Xilinx	Flash PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns	Yes	3.6 V	36	CMOS			3.3	2.5/3.3,3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	3 V	1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No		e3		30 s		245 °C (473 °F)	16.5862 mm	Yes	34
XCR5064-12PC84I	Xilinx	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	12 ns	Yes	5.5 V	64	CMOS			5	5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No	Macrocell	4.5 V	1.27 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No		e0	67 MHz	30 s		225 °C (437 °F)	29.3116 mm	No	64
XC95108F-15PQ100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V		CMOS			5		Flatpack				Macrocell	4.5 V	.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 81 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No		e0	56 MHz				20 mm		81
XC9536-10VQ44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns	Yes	5.5 V	36	CMOS	34		5	3.3/5,5 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	4.5 V	.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	66.7 MHz	30 s	34	240 °C (464 °F)	10 mm	Yes	34

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.