Industrial Programmable Logic Devices (PLD) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPF10K250AGI599-1	Altera	Loadable PLD	Industrial	Pin/Peg	599	IPGA	Square	Ceramic, Metal-Sealed Cofired	15 ns		No	3.6 V		CMOS				3.3		Grid Array, Interstitial Pitch				Registered	3 V		2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 470 I/O	4	-40 °C (-40 °F)		Perpendicular	S-CPGA-P599		5.08 mm	62.484 mm	No							62.484 mm		470
EP600PI-3	Altera	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	45 ns		No	5.5 V		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	160	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			7.62 mm	No	16 Macrocells	e0	26.3 MHz		16	220 °C (428 °F)	26.162 mm		16
EPF10K50VBI356-2	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	14 ns		Yes	3.6 V		CMOS				3.3		Grid Array, Low Profile				Registered	3 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 274 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		274
EPM7128AETI144-5	Altera	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	128	CMOS				3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	192.3 MHz			220 °C (428 °F)	20 mm	Yes	100
EPF10K200SBI356-2N	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.625 V		CMOS				2.5		Grid Array, Low Profile				Mixed	2.375 V		1.27 mm	85 °C (185 °F)	274 I/O		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		274
EPM7128AFI256-6	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	6 ns		Yes	3.6 V	128	CMOS				3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,50	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	144.9 MHz			220 °C (428 °F)	17 mm	Yes	100
EPF8636ALI84-2	Altera	Loadable PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		504	Yes	5.5 V		CMOS		68		5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 68 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	504 Logic elements; 63 Labs; Configurable I/O operation with 3.3 V or 5 V	e0			64	220 °C (428 °F)	29.3116 mm		68
EPF10K250EBI600-3	Altera	Loadable PLD	Industrial	Ball	600	HBGA	Square	Plastic/Epoxy		12160	Yes	2.7 V		CMOS		470		2.5	2.5,2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA600,35X35,50	Field Programmable Gate Arrays		Mixed	2.3 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 470 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm		470
EPM7032QI44-3	Altera	EE PLD	Industrial	Gull Wing	44	QFP	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	32	CMOS				5	5 V	Flatpack	QFP44,.5SQ,32	Programmable Logic Devices	No	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	2.45 mm	10 mm	No		e0				220 °C (428 °F)	10 mm	No	36
EPF8452AQI160-2	Altera	Loadable PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy		336	Yes	5.5 V		CMOS		120		5	3.3/5,5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays		Macrocell	4.5 V		.65 mm	85 °C (185 °F)	4 Dedicated Inputs, 120 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.07 mm	28 mm	No	336 Logic elements; 42 Labs; Configurable I/O operation with 3.3 V or 5 V	e0			116	220 °C (428 °F)	28 mm		120
EPF8636ARI208-3	Altera	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		504	Yes	5.5 V		CMOS		136		5	3.3/5,5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.5 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 136 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208		4.1 mm	28 mm	No	504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		132	220 °C (428 °F)	28 mm		136
EPM7128ABI256-10	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V		CMOS				3.3		Grid Array				Macrocell	3 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 100 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No	128 Macrocells	e1	125 MHz				27 mm		100
EPF10K100EFI484-2N	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns	4992	Yes	2.625 V		CMOS		338		2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		Mixed	2.375 V		1 mm	85 °C (185 °F)	338 I/O		-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1		40 s	338	260 °C (500 °F)	23 mm		338
EPF81188ARI208-5	Altera	Loadable PLD	Industrial	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	5.5 V		CMOS				5		Flatpack, Heat Sink/Slug, Fine Pitch				Registered	4.5 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					28 mm
EP910ILI-25	Altera	OT PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	28 ns		Yes	5.5 V		CMOS		36	PAL-TYPE	5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices		Macrocell	4.5 V	240	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44		4.57 mm	16.585 mm	No	Macrocells Interconnected By Global Bus; 24 Macrocells; 2 External Clocks	e0	40 MHz		24	220 °C (428 °F)	16.585 mm		24
EPM7096QI100-15C	Altera	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns		Yes	5.5 V		CMOS				5		Flatpack				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	0 Dedicated Inputs, 72 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100		3.65 mm	14 mm	No	Configurable I/O operation with 3.3 V or 5 V	e3	76.9 MHz				20 mm		72
EPF10K200SQI240-2X	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	12 ns		Yes	2.7 V		CMOS				2.5		Flatpack, Fine Pitch				Mixed	2.3 V		.5 mm	85 °C (185 °F)	182 I/O		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3					32 mm		182
5M2210ZF324A5N	Altera	Flash PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns		Yes		1700	CMOS	AEC-Q100				1.8,1.2/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes				1 mm	105 °C (221 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B324				No								Yes
EP910JI44-35	Altera	UV PLD	Industrial	J Bend	44	WQCCJ	Square	Ceramic, Metal-Sealed Cofired	38 ns		Yes	5.5 V		CMOS				5		Chip Carrier, Window				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 24 I/O	12	-40 °C (-40 °F)		Quad	S-CQCC-J44		4.57 mm	16.51 mm	No	24 Macrocells; 2 External Clocks		28.6 MHz				16.51 mm		24
EPM7256SQI208-7	Altera	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	7.5 ns		Yes	5.5 V	256	CMOS				5	3.3/5,5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	256 Macrocells	e0	166.7 MHz			220 °C (428 °F)	28 mm	Yes	164
EP330SI-15	Altera	OT PLD	Industrial	Gull Wing	20	SOP	Rectangular	Plastic/Epoxy	16 ns		Yes	5.5 V		CMOS		18	PAL-TYPE	5	5 V	Small Outline	SOP20,.4	Programmable Logic Devices		Macrocell	4.5 V	72	1.27 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G20		2.65 mm	7.5 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	83.3 MHz		8	220 °C (428 °F)	12.8 mm		8
5M240ZM68I5	Altera	Flash PLD	Industrial	Ball	68	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	192	CMOS				1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	100 °C (212 °F)	52 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e0	118.3 MHz				5 mm	Yes	52
EPF10K10ABI256-1	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	3.6 V						3.3		Grid Array				Mixed	3 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 150 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		2.3 mm	27 mm	No		e1					27 mm		150
EPM7256AEFI256-7	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS				3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	126.6 MHz	20 s		220 °C (428 °F)	17 mm	Yes	164
EPF10K10AFI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.5 ns		Yes	3.6 V						3.3		Grid Array				Mixed	3 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 150 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		1.86 mm	23 mm	No		e1					23 mm		150
EPF10K30EFI256-3	Altera	Loadable PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12.5 ns	1728	Yes	2.7 V		CMOS		176		2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays		Mixed	2.3 V		1 mm	85 °C (185 °F)	176 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0			176	220 °C (428 °F)	17 mm		176
EPM7256ERI208-20	Altera	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	20 ns		Yes	5.5 V	256	CMOS				5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Programmable Logic Devices	No	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Configurable I/O operation with 3.3 V or 5 V	e0	83.3 MHz			220 °C (428 °F)	28 mm	No	164
EPM7064AETI44-10	Altera	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	64	CMOS				3.3	2.5/3.3,3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	64 Macrocells	e0	100 MHz			220 °C (428 °F)	10 mm	Yes	36
EPF10K130EBI600-1	Altera	Loadable PLD	Industrial	Ball	600	BGA	Square	Plastic/Epoxy	9 ns	6656	Yes	2.7 V		CMOS		424		2.5	2.5,2.5/3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays		Mixed	2.3 V		1.27 mm	85 °C (185 °F)	424 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			424	220 °C (428 °F)	45 mm		424
EPF10K100EBI484-3	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.9 ns		Yes	2.7 V						2.5		Grid Array				Mixed	2.3 V			85 °C (185 °F)	4 Dedicated Inputs, 338 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							338
EPM7064BTI100-5	Altera	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	3.5 ns		Yes	2.625 V	64	CMOS				2.5	1.8/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 68 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0	303 MHz			220 °C (428 °F)	14 mm	Yes	68
EPF8452QI160-2	Altera	Loadable PLD	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy			Yes	5.5 V		CMOS				5		Flatpack				Registered	4.5 V		.65 mm	85 °C (185 °F)	4 Dedicated Inputs, 116 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G160		4.07 mm	28 mm	No	Labs With Fasttrack Interconnect; 452 Flip Flops; 336 Logic Elements	e3					28 mm		116
EPF10K200EBI672-3	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V						2.5		Grid Array				Mixed	2.3 V			85 °C (185 °F)	4 Dedicated Inputs, 470 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672				No		e1							470
EPF10K20QI208-4	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	20 ns		Yes	5.25 V		CMOS				5		Flatpack, Fine Pitch				Registered	4.75 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 147 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No	1152 Logic elements Configurable I/O operation with 3.3 V or 5 V	e3	60.6 MHz				28 mm		147
EPM7128BFI256-10N	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes		128	CMOS					1.8/3.3,2.5 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes				1 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256				No		e1						Yes
EPM9320GI280-20	Altera	EE PLD	Industrial	Pin/Peg	280	PGA	Square	Ceramic, Metal-Sealed Cofired	23 ns		No	5.5 V	320	CMOS				5	3.3/5,5 V	Grid Array	PGA280,19X19	Programmable Logic Devices	Yes	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	0 Dedicated Inputs, 168 I/O	0	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-CPGA-P280	1	5.08 mm	49.78 mm	No	484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V	e0	100 MHz			220 °C (428 °F)	49.78 mm	Yes	168
EPF10K130EQI240-1	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	9 ns	6656	Yes	2.7 V		CMOS		186		2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Mixed	2.3 V		.5 mm	85 °C (185 °F)	186 I/O		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			186	220 °C (428 °F)	32 mm		186
EPF10K100EBI484-1	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.6 ns		Yes	2.7 V						2.5		Grid Array				Mixed	2.3 V			85 °C (185 °F)	4 Dedicated Inputs, 338 I/O	4	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484				No		e1							338
EPF8282ALI84-4	Altera	Loadable PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		208	Yes	5.5 V		CMOS		68		5	3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		Registered	4.5 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 64 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry	e0			64	220 °C (428 °F)	29.3116 mm		64
EPF10K10AQI208-2	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns		Yes	3.6 V		CMOS				3.3		Flatpack, Fine Pitch				Registered	3 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 134 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3					28 mm		134
EPM5032DI-20	Altera	UV PLD	Industrial	Through-Hole	28	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns		No	5.5 V		CMOS		24	PAL-TYPE	5	5 V	In-Line	DIP28,.3	Programmable Logic Devices		Macrocell	4.5 V	320	2.54 mm	85 °C (185 °F)	7 Dedicated Inputs, 16 I/O	7	-40 °C (-40 °F)	Tin Lead	Dual	R-GDIP-T28				No	Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		16	220 °C (428 °F)			16
EPF8636ALI84-4N	Altera	Loadable PLD	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy			Yes	5.5 V		CMOS				5		Chip Carrier				Registered	4.5 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 64 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e3					29.3116 mm		64
EP20K600CF672I8	Altera	Loadable PLD	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	1.78 ns	24320	Yes	1.89 V		CMOS		500		1.8	1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3.5 mm	27 mm	No		e0		20 s	500	220 °C (428 °F)	27 mm		508
EPM7512AEFI256-12N	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V		CMOS				3.3		Grid Array				Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	71.9 MHz			245 °C (473 °F)	17 mm		212
EPM7064TI44-6	Altera	EE PLD	Industrial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	6 ns		Yes	5.5 V	64	CMOS				5	5 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	4.5 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	64 Macrocells	e0	200 MHz			220 °C (428 °F)	10 mm	No	36
EPM7256AFI256-7	Altera	EE PLD	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS				3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	125 MHz			220 °C (428 °F)	17 mm	Yes	164
EPM7128AETI100-10	Altera	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS				3.3	2.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 84 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No		e0	98 MHz			220 °C (428 °F)	14 mm	Yes	84
EPM7064SLI44-15	Altera	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.5 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No		e0	76.9 MHz			220 °C (428 °F)	16.5862 mm	No	32

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.