Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
76.9 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
64 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
0.7 ns |
Yes |
Grid Array |
Mixed |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 191 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.3 mm |
27 mm |
No |
e1 |
27 mm |
191 |
||||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
17 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
9.5 ns |
2880 |
Yes |
2.7 V |
CMOS |
220 |
2.5 |
2.5,2.5/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
220 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e0 |
220 |
220 °C (428 °F) |
35 mm |
220 |
||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
11.4 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 149 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
560 Macrocells |
e3 |
28 mm |
149 |
|||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
192 |
CMOS |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
Yes |
.635 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
No |
e3 |
Yes |
|||||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
12 ns |
9984 |
Yes |
2.7 V |
CMOS |
369 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
369 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e0 |
369 |
220 °C (428 °F) |
23 mm |
369 |
|||||||||||||
Altera |
Flash PLD |
Industrial |
Ball |
324 |
LBGA |
Square |
Plastic/Epoxy |
11.2 ns |
Yes |
1.89 V |
980 |
CMOS |
1.8 |
1.8,1.2/3.3 V |
Grid Array, Low Profile |
BGA324,18X18,40 |
Programmable Logic Devices |
Yes |
Macrocell |
1.71 V |
1 mm |
100 °C (212 °F) |
271 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B324 |
1.55 mm |
19 mm |
No |
e0 |
201.1 MHz |
19 mm |
Yes |
271 |
||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
12.5 ns |
2880 |
Yes |
2.7 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.63SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
102 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
102 |
220 °C (428 °F) |
20 mm |
102 |
|||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
9.5 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
191 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.1 mm |
17 mm |
No |
e1 |
17 mm |
191 |
|||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
250 MHz |
220 °C (428 °F) |
14 mm |
Yes |
84 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
27 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
1152 Logic elements Configurable I/O operation with 3.3 V or 5 V |
e3 |
53.76 MHz |
28 mm |
|||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
|||||||||||||||||||||
Altera |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
55 ns |
No |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
160 |
2.54 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-XDIP-T24 |
No |
e0 |
18.2 MHz |
16 |
220 °C (428 °F) |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
672 |
Yes |
5.5 V |
CMOS |
112 |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 112 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
672 Logic elements; 84 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
108 |
220 °C (428 °F) |
20 mm |
112 |
||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
9 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
413 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
2.1 mm |
27 mm |
No |
e1 |
27 mm |
413 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
11 ns |
4992 |
Yes |
2.7 V |
CMOS |
147 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
147 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
147 |
220 °C (428 °F) |
28 mm |
147 |
|||||||||||||
Altera |
EE PLD |
Industrial |
Ball |
256 |
TBGA |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Grid Array, Thin Profile |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
1.1 mm |
17 mm |
No |
e1 |
17 mm |
164 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
600 |
HBGA |
Square |
Plastic/Epoxy |
12160 |
Yes |
2.7 V |
CMOS |
470 |
2.5 |
2.5,2.5/3.3 V |
Grid Array, Heat Sink/Slug |
BGA600,35X35,50 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 470 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B600 |
1.93 mm |
45 mm |
No |
e0 |
470 |
220 °C (428 °F) |
45 mm |
470 |
||||||||||||||
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
95.2 MHz |
220 °C (428 °F) |
17 mm |
Yes |
164 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
280 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
No |
5.5 V |
CMOS |
5 |
Grid Array |
Registered |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 204 I/O |
4 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P280 |
5.081 mm |
49.78 mm |
No |
1500 Flip Flops; 1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
49.78 mm |
204 |
||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
e0 |
138.9 MHz |
220 °C (428 °F) |
16.5862 mm |
Yes |
34 |
||||||||||||
Altera |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
25 ns |
Yes |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP28,.5 |
Programmable Logic Devices |
320 |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
No |
e0 |
62.5 MHz |
16 |
220 °C (428 °F) |
|||||||||||||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
64 Macrocells |
e0 |
200 MHz |
220 °C (428 °F) |
29.3116 mm |
No |
68 |
|||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
16.4 ns |
Yes |
5.5 V |
480 |
CMOS |
5 |
3.3/5,5 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP208,1.2SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 146 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
480 Macrocells; 676 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
117.6 MHz |
220 °C (428 °F) |
28 mm |
Yes |
146 |
|||||||||||
Altera |
OT PLD |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
5.5 V |
CMOS |
5 |
In-Line |
Registered |
4.5 V |
2.54 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T28 |
4.318 mm |
7.62 mm |
No |
PLS |
20 MHz |
34.29 mm |
0 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
9 ns |
9984 |
Yes |
2.7 V |
CMOS |
369 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
369 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B484 |
3 |
2.1 mm |
23 mm |
No |
e0 |
369 |
220 °C (428 °F) |
23 mm |
369 |
|||||||||||||
Altera |
Flash PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
17.7 ns |
Yes |
1.89 V |
1.8 |
Flatpack, Low Profile, Fine Pitch |
Macrocell |
1.71 V |
.5 mm |
100 °C (212 °F) |
114 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
e0 |
118.3 MHz |
20 mm |
114 |
|||||||||||||||||||||
|
Altera |
Flash PLD |
Industrial |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
17.7 ns |
Yes |
192 |
CMOS |
1.8,1.2/3.3 V |
Flatpack |
QFP144,.87SQ,20 |
Programmable Logic Devices |
Yes |
.5 mm |
105 °C (221 °F) |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
No |
Yes |
|||||||||||||||||||||||||
Altera |
Flash PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12 ns |
160 |
Yes |
5.25 V |
CMOS |
172 |
5 |
3.3/5,5 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Macrocell |
4.75 V |
.5 mm |
85 °C (185 °F) |
48 Dedicated Inputs, 120 I/O |
48 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
80 MHz |
172 |
220 °C (428 °F) |
28 mm |
120 |
||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
64 |
CMOS |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
No |
No |
|||||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 212 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
116.3 MHz |
220 °C (428 °F) |
17 mm |
Yes |
212 |
|||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 96 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G160 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
28 mm |
96 |
||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
9 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
|||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 180 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
32 mm |
180 |
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Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
9.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
147 |
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Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
250 MHz |
220 °C (428 °F) |
29.3116 mm |
Yes |
68 |
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Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
6 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V |
e0 |
156.3 MHz |
220 °C (428 °F) |
14 mm |
Yes |
84 |
||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
16 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 134 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
134 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
12.5 ns |
576 |
Yes |
2.625 V |
CMOS |
120 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Fine Pitch |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
Registered |
2.375 V |
.5 mm |
85 °C (185 °F) |
6 Dedicated Inputs, 130 I/O |
6 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
No |
e0 |
120 |
220 °C (428 °F) |
28 mm |
130 |
||||||||||||
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
232 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
1.8 ns |
No |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 184 I/O |
4 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P232 |
5.207 mm |
44.7 mm |
No |
Can also operate at 5 V supply |
44.7 mm |
184 |
|||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Ball |
484 |
BGA |
Square |
Plastic/Epoxy |
0.8 ns |
Yes |
3.6 V |
3.3 |
Grid Array |
Mixed |
3 V |
1 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 150 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B484 |
1.86 mm |
23 mm |
No |
e1 |
23 mm |
150 |
|||||||||||||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
e0 |
100 MHz |
220 °C (428 °F) |
16.5862 mm |
No |
32 |
||||||||||||
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
5.5 ns |
Yes |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 164 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
172.4 MHz |
220 °C (428 °F) |
17 mm |
Yes |
164 |
|||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
e0 |
100 MHz |
220 °C (428 °F) |
16.5862 mm |
No |
32 |
||||||||||||
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
9.5 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
503 |
IPGA |
Square |
Ceramic, Metal-Sealed Cofired |
19.1 ns |
No |
5.25 V |
CMOS |
5 |
Grid Array, Interstitial Pitch |
Registered |
4.75 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 358 I/O |
4 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P503 |
5.077 mm |
57.4 mm |
No |
57.4 mm |
358 |
||||||||||||||||||||||
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
32 Macrocells |
e0 |
103.1 MHz |
220 °C (428 °F) |
10 mm |
Yes |
36 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.