| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
576 |
Yes |
2.625 V |
CMOS |
66 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
Registered |
2.375 V |
.5 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
90 MHz |
66 |
220 °C (428 °F) |
14 mm |
||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
FQFP |
Square |
Plastic/Epoxy |
11 ns |
Yes |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 147 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
e3 |
28 mm |
147 |
||||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
560 |
BGA |
Square |
Plastic/Epoxy |
23.8 ns |
Yes |
5.5 V |
CMOS |
5 |
Grid Array |
Registered |
4.5 V |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B560 |
No |
3744 Logic elements Configurable I/O operation with 3.3 V or 5 V |
e1 |
60.6 MHz |
|||||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
9 ns |
Yes |
2.625 V |
CMOS |
2.5 |
Flatpack, Fine Pitch |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 186 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
186 |
||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
No |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
62.5 MHz |
220 °C (428 °F) |
10 mm |
No |
32 |
||||||||||
|
Altera |
UV PLD |
Industrial |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
27 ns |
No |
5.5 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
16 Macrocells; 2 External Clocks |
47.6 MHz |
32 mm |
16 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 148 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
148 |
||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 98 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
3.5 mm |
17 mm |
No |
e0 |
20 s |
220 °C (428 °F) |
17 mm |
Yes |
98 |
|||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
336 |
Yes |
5.5 V |
CMOS |
68 |
5 |
3.3/5,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
336 Logic elements; 42 Labs; Configurable I/O operation with 3.3 V or 5 V |
e0 |
64 |
220 °C (428 °F) |
14 mm |
68 |
||||||||||||
|
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
76.9 MHz |
220 °C (428 °F) |
29.3116 mm |
Yes |
64 |
|||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
HLBGA |
Square |
Plastic/Epoxy |
27 ns |
Yes |
5.5 V |
CMOS |
5 |
Grid Array, Heat Sink/Slug, Low Profile |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
1728 Logic elements Configurable I/O operation with 3.3 V or 5 V |
e1 |
53.76 MHz |
35 mm |
|||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
16 ns |
4992 |
Yes |
2.625 V |
CMOS |
333 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Registered |
2.375 V |
1 mm |
85 °C (185 °F) |
6 Dedicated Inputs, 186 I/O |
6 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
333 |
220 °C (428 °F) |
17 mm |
186 |
||||||||||||
|
Altera |
OT PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J44 |
4.572 mm |
16.5862 mm |
No |
16.5862 mm |
24 |
||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
12.5 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
176 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B256 |
2.1 mm |
17 mm |
No |
e1 |
17 mm |
176 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
0.9 ns |
1728 |
Yes |
3.6 V |
CMOS |
246 |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Registered |
3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 246 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
1728 Logic Elements; 216 Labs |
e0 |
80 MHz |
246 |
220 °C (428 °F) |
35 mm |
246 |
|||||||||||
|
Altera |
OT PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
55 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
7 Dedicated Inputs, 28 I/O |
7 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
64 Macrocells; Shared Input/Clock; Shared Product Terms |
e0 |
33.3 MHz |
220 °C (428 °F) |
16.5862 mm |
No |
28 |
|||||||||||
|
Altera |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
1.7 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Chip Carrier |
Registered |
3 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
Can also operate at 5 V supply |
29.3116 mm |
68 |
|||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
16.4 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Macrocell |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 142 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
480 Macrocells |
e3 |
28 mm |
142 |
|||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Ball |
256 |
TBGA |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Grid Array, Thin Profile |
BGA256,16X16,40 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
1.1 mm |
17 mm |
No |
e0 |
100 MHz |
220 °C (428 °F) |
17 mm |
Yes |
100 |
|||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 74 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G100 |
1.27 mm |
14 mm |
No |
282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
14 mm |
74 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
13.5 ns |
2880 |
Yes |
2.7 V |
CMOS |
189 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Heat Sink/Slug, Fine Pitch |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
189 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e0 |
189 |
220 °C (428 °F) |
32 mm |
189 |
||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
672 |
BGA |
Square |
Plastic/Epoxy |
0.9 ns |
Yes |
2.7 V |
2.5 |
Grid Array |
Mixed |
2.3 V |
85 °C (185 °F) |
4 Dedicated Inputs, 413 I/O |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B672 |
No |
e1 |
413 |
|||||||||||||||||||||||||
|
Altera |
OT PLD |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
28 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T40 |
4.83 mm |
15.24 mm |
No |
Macrocells Interconnected By Global Bus; 24 Macrocells; 2 External Clocks |
40 MHz |
52.425 mm |
24 |
||||||||||||||||||||
|
Altera |
OT PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
17 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Dual |
R-PDIP-T24 |
4.318 mm |
7.62 mm |
No |
16 Macrocells; 2 External Clocks |
83.3 MHz |
31.6865 mm |
16 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
0.5 ns |
576 |
Yes |
2.625 V |
CMOS |
92 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
Mixed |
2.375 V |
.5 mm |
85 °C (185 °F) |
92 I/O |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
37.5 MHz |
92 |
220 °C (428 °F) |
20 mm |
92 |
||||||||||||
|
Altera |
OT PLD |
Industrial |
Gull Wing |
100 |
QFP |
Rectangular |
Plastic/Epoxy |
35 ns |
Yes |
128 |
CMOS |
5 |
5 V |
Flatpack |
QFP100,.7X.9 |
Programmable Logic Devices |
No |
.635 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
R-PQFP-G100 |
3 |
No |
e0 |
220 °C (428 °F) |
No |
|||||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Pin/Peg |
160 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
12 ns |
No |
5.5 V |
192 |
CMOS |
5 |
3.3/5,5 V |
Grid Array |
PGA160M,15X15 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 124 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Perpendicular |
S-CPGA-P160 |
1 |
5.34 mm |
39.624 mm |
No |
192 Macrocells |
e0 |
125 MHz |
220 °C (428 °F) |
39.624 mm |
No |
124 |
||||||||||
|
Altera |
UV PLD |
Industrial |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
10 ns |
No |
5.25 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.75 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
16 Macrocells; 2 External Clocks |
125 MHz |
32 mm |
16 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
HLBGA |
Square |
Plastic/Epoxy |
23.8 ns |
Yes |
5.5 V |
CMOS |
5 |
Grid Array, Heat Sink/Slug, Low Profile |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
2304 Logic elements Configurable I/O operation with 3.3 V or 5 V |
e1 |
60.6 MHz |
35 mm |
|||||||||||||||||||
|
Altera |
UV PLD |
Industrial |
Through-Hole |
40 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
5.25 V |
CMOS |
5 |
In-Line, Window |
Macrocell |
4.75 V |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 24 I/O |
12 |
-40 °C (-40 °F) |
Dual |
R-GDIP-T40 |
5.715 mm |
15.24 mm |
No |
62.5 MHz |
52.07 mm |
24 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
600 |
BGA |
Square |
Plastic/Epoxy |
16 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Grid Array |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
470 I/O |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B600 |
1.93 mm |
45 mm |
No |
e1 |
45 mm |
470 |
|||||||||||||||||||||
|
Altera |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic |
25 ns |
Yes |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
160 |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
No |
e0 |
40 MHz |
16 |
220 °C (428 °F) |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
208 |
HFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G208 |
4.1 mm |
28 mm |
No |
1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
28 mm |
|||||||||||||||||||||
|
Altera |
OT PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
18 ns |
Yes |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
No |
e0 |
66 MHz |
16 |
220 °C (428 °F) |
16 |
||||||||||||||
|
|
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
64 |
CMOS |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
1.27 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
No |
No |
|||||||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
FQFP |
Square |
Plastic/Epoxy |
11 ns |
Yes |
3.6 V |
CMOS |
3.3 |
Flatpack, Fine Pitch |
Registered |
3 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 189 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
189 |
||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Pin/Peg |
160 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
1.7 ns |
No |
3.6 V |
CMOS |
3.3 |
Grid Array |
Registered |
3 V |
2.54 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 120 I/O |
4 |
-40 °C (-40 °F) |
Perpendicular |
S-CPGA-P160 |
5.34 mm |
39.624 mm |
No |
Can also operate at 5 V supply |
39.624 mm |
120 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
12.5 ns |
576 |
Yes |
2.625 V |
CMOS |
66 |
2.5 |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
Registered |
2.375 V |
.5 mm |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
e0 |
66 |
220 °C (428 °F) |
14 mm |
|||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
12.5 ns |
576 |
Yes |
2.625 V |
CMOS |
136 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Registered |
2.375 V |
1 mm |
85 °C (185 °F) |
6 Dedicated Inputs, 130 I/O |
6 |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
136 |
220 °C (428 °F) |
17 mm |
130 |
||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
240 |
HFQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
2.7 V |
CMOS |
2.5 |
Flatpack, Heat Sink/Slug, Fine Pitch |
Mixed |
2.3 V |
.5 mm |
85 °C (185 °F) |
186 I/O |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G240 |
4.1 mm |
32 mm |
No |
e3 |
32 mm |
186 |
|||||||||||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
13.5 ns |
2880 |
Yes |
2.7 V |
CMOS |
191 |
2.5 |
2.5,2.5/3.3 V |
Grid Array |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1 mm |
85 °C (185 °F) |
191 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
No |
e0 |
191 |
220 °C (428 °F) |
17 mm |
191 |
|||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 100 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
62.5 MHz |
220 °C (428 °F) |
28 mm |
No |
100 |
||||||||||
|
Altera |
Loadable PLD |
Industrial |
Gull Wing |
304 |
FQFP |
Square |
Plastic/Epoxy |
23.8 ns |
Yes |
5.5 V |
CMOS |
5 |
Flatpack, Fine Pitch |
Registered |
4.5 V |
.5 mm |
85 °C (185 °F) |
4 Dedicated Inputs |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G304 |
4.5 mm |
40 mm |
No |
3744 Logic elements; Built-in JTAG boundry-scan test circuitry |
e3 |
60.6 MHz |
40 mm |
|||||||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
4.5 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 36 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
e0 |
227.3 MHz |
220 °C (428 °F) |
10 mm |
Yes |
36 |
|||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.8 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 34 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
e0 |
103.1 MHz |
20 s |
235 °C (455 °F) |
10 mm |
Yes |
34 |
||||||||||
|
Altera |
OT PLD |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
32 ns |
Yes |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Small Outline |
SOP24,.4 |
Programmable Logic Devices |
Macrocell |
4.5 V |
160 |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 16 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
No |
Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks |
e0 |
33.3 MHz |
16 |
220 °C (428 °F) |
16 |
|||||||||||||
|
Altera |
Loadable PLD |
Industrial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
9 ns |
6656 |
Yes |
2.7 V |
CMOS |
274 |
2.5 |
2.5,2.5/3.3 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Field Programmable Gate Arrays |
Mixed |
2.3 V |
1.27 mm |
85 °C (185 °F) |
274 I/O |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
e0 |
274 |
220 °C (428 °F) |
35 mm |
274 |
||||||||||||||
|
Altera |
EE PLD |
Industrial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
TQFP100,.63SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
.5 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 84 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
No |
128 Macrocells |
e0 |
116.3 MHz |
220 °C (428 °F) |
14 mm |
Yes |
84 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.