Military Programmable Logic Devices (PLD) 1,614

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
5962-9952501QZC	Defense Logistics Agency	EE PLD	Military	Gull Wing	208	FQFP	Square		15 ns	Yes	5.5 V	512	CMOS	MIL-PRF-38535 Class Q	165	PLA-TYPE	5			Flatpack, Fine Pitch	QFP208,1.2SQ,20		Yes	Macrocell	4.5 V		.5 mm	125 °C (257 °F)	1 Dedicated Inputs, 160 I/O	1	-55 °C (-67 °F)	Gold	Quad	S-XQFP-G208		2.94 mm	28 mm	Yes		e4	62.5 MHz	160	28 mm	Yes	160
ATF16V8B-15GM	Atmel	Flash PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock	e0	45 MHz	8	24.35 mm		8
ATV750-20GM/883	Atmel	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V	10	CMOS	MIL-STD-883			5		5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 10 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; Variable Product Terms	e0	55 MHz		32 mm	No	10
CY37128VP84-83YMB	Cypress Semiconductor	EE PLD	Military	J Bend	84	QCCJ	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	3.6 V	128	CMOS	38535Q/M;38534H;883B			3.3		3.3 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	Yes	Macrocell	3 V		1.27 mm	125 °C (257 °F)	1 Dedicated Inputs, 69 I/O	1	-55 °C (-67 °F)	Tin Lead	Quad	S-CQCC-J84		4.826 mm	29.21 mm	No	128 Macrocells	e0	62.5 MHz		29.21 mm	Yes	69
CY37512P208-83UMB	Cypress Semiconductor	EE PLD	Military	Gull Wing	208	FQFP	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.5 V	512	CMOS	38535Q/M;38534H;883B	165	PLA-TYPE	5		3.3/5,5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	125 °C (257 °F)	1 Dedicated Inputs, 160 I/O	1	-55 °C (-67 °F)	Tin Lead	Quad	S-CQFP-G208	1	3.94 mm	28 mm	No	512 Macrocells; Configurable I/O Operation with 3.3 V or 5 V	e0	62.5 MHz	160	28 mm	Yes	160
CY7C330-40WMB	Cypress Semiconductor	UV PLD	Military	Through-Hole	28	WDIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	23	PAL-TYPE	5		5 V	In-Line, Window	DIP28,.3	Programmable Logic Devices		Macrocell	4.5 V	256	2.54 mm	125 °C (257 °F)	9 Dedicated Inputs, 12 I/O	9	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T28		5.08 mm	7.62 mm	No	Synchronous State Machine; 12 I/O Macrocells; 3 External Clocks; Shared Input/Clock	e0	40 MHz	12	37.0205 mm		12
GAL16V8D-15LD/883	Lattice Semiconductor	EE PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	MIL-STD-883	18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20	1	5.08 mm	7.62 mm	No		e0	41.6 MHz	8	25.27 mm		8
GAL20V8B-15LD/883	Lattice Semiconductor	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		CMOS	MIL-STD-883	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 8 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24	1	5.08 mm	7.62 mm	No	1 External Clock; Register Preload		41.6 MHz	8	31.875 mm		8
GAL22V10D-10LD/883	Lattice Semiconductor	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24	1	5.08 mm	7.62 mm	No		e0	76.9 MHz	10	31.75 mm		10
PALC16L8-30DMB	Cypress Semiconductor	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0		8	24.13 mm		6
PALC22V10-40WMB	Cypress Semiconductor	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5		5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	18.1 MHz	10	31.877 mm		10
PALC22V10D-15KMB	Cypress Semiconductor	Flash PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	15 ns	Yes	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDFP-F24				No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	50 MHz	10			10
PALCE16V8-10DMB	Cypress Semiconductor	Flash PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V		CMOS	38535Q/M;38534H;883B	18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 8 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset	e0	58 MHz	8	24.13 mm		8
PALCE22V10-15KMB	Cypress Semiconductor	Flash PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	15 ns	Yes	5.5 V		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices		Macrocell	4.5 V	132	1.27 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDFP-F24		2.286 mm	9.652 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	50 MHz	10	15.367 mm		10
ATF22V10B-10GM/883	Microchip Technology	Flash PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V		CMOS	MIL-STD-883	22	PAL-TYPE	5	Tube		In-Line	DIP24,.3			Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm		10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms		90 MHz	10	32 mm	No	10
PAL16L8A-2MJ	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V		TTL		16	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0	16 MHz	8	24.195 mm	No	6
PAL16R8AMJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		TTL	38535Q/M;38534H;883B	8	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0	25 MHz	8	24.195 mm	No	0
TIBPAL16L8-15MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		TTL	MIL-PRF-38535	16	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No			50 MHz	8	24.195 mm		6
JM38510/50503BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		TTL	MIL-M-38510 Class B			5			In-Line				Mixed	4.75 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm	No			28.5 MHz		32.005 mm		2
TIBPAL16R4-30MWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	30 ns	Yes	5.5 V		TTL	MIL-STD-883	12	PAL-TYPE	5	Tube	5 V	Flatpack	FL20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDFP-F20		2.54 mm	6.92 mm	No		e0	25 MHz	8	13.09 mm	No	4
SNJ54LS336W	Texas Instruments	EE PLD	Military	Flat	24	DFP	Rectangular	Ceramic		Yes			TTL	38535Q/M;38534H;883B	12	PLA-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices				32	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F24				No				6
5962-8515515SX	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	14 ns	Yes	5.5 V		TTL	MIL-STD-883			5			Flatpack				Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20				No			48 MHz				2
5962-8767103KX	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	20 ns	Yes	5.5 V		TTL	MIL-STD-883			5			Flatpack				Mixed	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDFP-F24				No			28.5 MHz				2
TIBPAL20R6-10MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	12 ns	Yes	5.5 V		TTL		14	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28		2.03 mm	11.43 mm	No	Register Preload; Power-Up Reset		50 MHz	8	11.43 mm		2
5962-8605303KX	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	25 ns	Yes	5.5 V		TTL	MIL-STD-883			5			Flatpack				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDFP-F24				Yes			25 MHz				10
TIBPAL16R8-7MFK	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		TTL		8	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		2.03 mm	8.89 mm	No	Power-Up Reset; Register Preload		74 MHz	8	8.89 mm		0
TIBPALR19L8MFK	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V		TTL		19	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	2 Dedicated Inputs, 6 I/O	2	-55 °C (-67 °F)		Quad	S-CQCC-N28		2.03 mm	11.43 mm	No				8	11.43 mm		6
8103610RX	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		TTL	MIL-STD-883 Class B			5			In-Line				Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20				Yes			25 MHz				4
8103614RX	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V		TTL				5			In-Line				Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20				Yes			16 MHz				4
TIBPAL20L8-7MJT	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V		TTL		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)		Dual	R-GDIP-T24				No				8			6
5962-85155222A	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		TTL	MIL-STD-883	12	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		2.03 mm	8.89 mm	No			74 MHz	8	8.89 mm		4
TIBPAL20L10-25MFKB	Texas Instruments	EE PLD	Military	No Lead	28	QCCN	Square	Ceramic	25 ns	Yes			TTL	38535Q/M;38534H;883B	20	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial		40	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28				No				10
TIBPALT19R6MFKB	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic		Yes			TTL	38535Q/M;38534H;883B	19	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Registered		64	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Quad	S-XQCC-N28				No				8
TIBPAL16R8-20MFK	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.5 V		TTL		8	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		2.03 mm	8.89 mm	No	Power-Up Reset		41.6 MHz	8	8.89 mm		0
5962-87671193X	Texas Instruments	OT PLD	Military	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		TTL	MIL-STD-883			5			Chip Carrier				Registered	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-N28				No			74 MHz				0
5962-8515518RX	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V		TTL	MIL-STD-883	16	PAL-TYPE	5			In-Line			No	Registered	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20				Yes			52.5 MHz	8		No	0
TIBPAL16R6-10MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	12 ns	No	5.5 V		TTL	MIL-PRF-38535	10	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No			52.5 MHz	6	24.195 mm		2
SN54LS336W	Texas Instruments	EE PLD	Military	Flat	24	DFP	Rectangular	Ceramic		Yes			TTL		12	PLA-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices				32	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F24				No				6
TIBPAL16L8-15MFKB	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	15 ns	Yes	5.5 V		TTL	MIL-PRF-38535	16	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Quad	S-CQCC-N20		2.03 mm	8.89 mm	No			50 MHz	8	8.89 mm		6
TIBPAL16L8-30MJ	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		TTL	MIL-STD-883	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		e0	25 MHz	8	24.195 mm	No	6
PAL20R6AMFH	Texas Instruments	OT PLD	Military	J Bend	28	QCCJ	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V		TTL		14	PAL-TYPE	5		5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Quad	S-CQCC-J28		2.54 mm	11.43 mm	No	1 External Clock; Register Preload		20 MHz	8	11.43 mm		2
82S105AMJDB	Texas Instruments	OT PLD	Military	Through-Hole	28	DIP	Rectangular	Ceramic		No			TTL	38535Q/M;38534H;883B	16	PLS-TYPE	5		5 V	In-Line	DIP28,.6	Programmable Logic Devices				48	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T28				No				8
TIBPAL16R6-10MWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	12 ns	Yes	5.5 V		TTL	MIL-PRF-38535	8	PAL-TYPE	5		5 V	Flatpack	FL20,.3	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20		2.45 mm	6.92 mm	No			52.5 MHz	8			2
5962-8515504RX	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		TTL	MIL-STD-883	16	PAL-TYPE	5			In-Line			No	Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20				Yes			41.6 MHz	4		No	4
5962-85155082X	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	30 ns	Yes	5.5 V		TTL	MIL-STD-883	16	PAL-TYPE	5			Chip Carrier			No	Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20				Yes			25 MHz	4		No	4
TIBPAL20R4-30MJTB	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			25 MHz	8
5962-85155212A	Texas Instruments	OT PLD	Military	No Lead	20	QCCN	Square	Ceramic, Metal-Sealed Cofired	10 ns	Yes	5.5 V		TTL	MIL-STD-883	8	PAL-TYPE	5		5 V	Chip Carrier	LCC20,.35SQ	Programmable Logic Devices		Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)		Quad	S-CQCC-N20		2.03 mm	8.89 mm	No			74 MHz	8	8.89 mm		0
SN54LS334J	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL		12	PLA-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No				6

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.