Military Programmable Logic Devices (PLD) 1,614

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

ATF22V10B-15GM/883

Microchip Technology

Flash PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

MIL-STD-883

22

PAL-TYPE

5

Tube

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

e0

55.5 MHz

10

32 mm

10

PAL16R4AMFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

25 MHz

8

8.89 mm

No

4

5962-8867005LA

Defense Logistics Agency

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

Yes

e0

50 MHz

10

5962-8984103LA

Microchip Technology

Flash PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

MIL-PRF-38535; MIL-STD-883

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin/Lead - hot dipped

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

e0

50 MHz

10

32 mm

10

AT22V10-15DM

Atmel

UV PLD

Military

Through-Hole

24

WDIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

22

PAL-TYPE

5

5 V

In-Line, Window

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

e0

50 MHz

10

32 mm

10

ATF750C-15GM/883

Microchip Technology

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

10

CMOS

MIL-STD-883

5

Tube

5 V

In-Line

DIP24,.3

Programmable Logic Devices

No

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

e0

55 MHz

32 mm

No

10

JM38510/50601BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

MIL-M-38510 Class B

16

PAL-TYPE

5

Tube

In-Line

No

Combinatorial

4.75 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

6.92 mm

No

e0

40 MHz

8

24.2 mm

No

6

5962-8867002LA

Defense Logistics Agency

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

Yes

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

e0

25 MHz

31.877 mm

10

AT22V10-15DM/883

Atmel

UV PLD

Military

Through-Hole

24

WDIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

38535Q/M;38534H;883B

22

PAL-TYPE

5

5 V

In-Line, Window

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

e0

50 MHz

10

32 mm

10

5962-89839142A

Defense Logistics Agency

EE PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 ns

Yes

5.5 V

CMOS

MIL-STD-883

5

Chip Carrier

Macrocell

4.5 V

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

No

e0

8

5962-8984101LA

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

22 MHz

10

5962-89841113A

Defense Logistics Agency

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 ns

Yes

5.5 V

CMOS

MIL-STD-883

5

Chip Carrier

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

No

e0

50 MHz

10

5962-8983901RA

Defense Logistics Agency

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

1 External Clock; Register Preload

e0

22.2 MHz

25.27 mm

8

5962-89839022A

Defense Logistics Agency

EE PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

20 ns

Yes

5.5 V

CMOS

MIL-STD-883

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.54 mm

8.89 mm

No

1 External Clock; Register Preload

e0

33.3 MHz

8.89 mm

8

5962-8983903RA

National Semiconductor

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

Programmable Output Polarity; 8 Macrocells; Register Preload; Power-Up Reset

e0

41.6 MHz

24.257 mm

8

5962-8984002LA

Defense Logistics Agency

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 8 I/O

12

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

Programmable Output Polarity; 8 Macrocells; Register Preload; Power-Up Reset

e0

33.3 MHz

31.9405 mm

8

5962-8984003LA

Defense Logistics Agency

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 8 I/O

12

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

Programmable Output Polarity; 8 Macrocells; Register Preload; Power-Up Reset

e0

41.6 MHz

31.9405 mm

8

ATF22V10C-10NM/883

Microchip Technology

Flash PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

CMOS

MIL-STD-883

22

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Macrocell

4.5 V

132

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 10 I/O

10

-55 °C (-67 °F)

Quad

S-CQCC-N28

2.54 mm

11.4554 mm

No

90 MHz

10

11.455 mm

10

JM38510/50401BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

TTL

MIL-M-38510 Class B

5

In-Line

Combinatorial

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

No

e0

JM38510/50605BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

MIL-M-38510 Class B

16

PAL-TYPE

5

Tube

In-Line

No

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.2 mm

No

6

JM38510/50606BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

MIL-M-38510 Class B

8

PAL-TYPE

5

Tube

In-Line

No

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.2 mm

No

0

PAL16L8AMJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.195 mm

No

6

8103610SA

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

40 ns

Yes

5.5 V

TTL

MIL-STD-883

12

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDFP-F20

2.54 mm

6.92 mm

Yes

e0

25 MHz

8

13.09 mm

No

4

EPM5032JM-25

Altera

UV PLD

Military

J Bend

28

WQCCJ

Square

Ceramic, Metal-Sealed Cofired

25 ns

Yes

CMOS

24

PAL-TYPE

5

5 V

Chip Carrier, Window

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

320

1.27 mm

125 °C (257 °F)

7 Dedicated Inputs, 16 I/O

7

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-J28

4.57 mm

11.43 mm

No

Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock

e0

50 MHz

16

220 °C (428 °F)

11.43 mm

16

JM38510/50604BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.25 V

TTL

MIL-M-38510 Class B

12

PAL-TYPE

5

Tube

In-Line

No

Mixed

4.75 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

6.92 mm

No

e0

40 MHz

8

24.2 mm

No

4

M38510/50504BLA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

5.25 V

Bipolar

MIL-M-38510 Class B

16

PAL-TYPE

5

Tube

5 V

In-Line

DIP24,.3

Programmable Logic Devices

No

Mixed

4.75 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 4 I/O

12

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

6.92 mm

Yes

e0

40 MHz

8

32 mm

No

4

82S100/BXA

NXP Semiconductors

OT PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

80 ns

No

5.5 V

TTL

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-GDIP-T28

No

0

82S100BXA

Qp Semiconductor

OT PLD

Military

Through-Hole

28

Rectangular

Ceramic, Metal-Sealed Cofired

80 ns

No

5.5 V

Bipolar

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

16 Dedicated Inputs, 0 I/O

16

-55 °C (-67 °F)

Dual

R-CDIP-T28

No

0

M38510/50601BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

6.92 mm

Yes

e0

40 MHz

8

24.2 mm

No

6

PALC22V10-30DMB

Cypress Semiconductor

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

38535Q/M;38534H;883B

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

e0

25 MHz

10

31.877 mm

10

ISPLSI1032-60LG/883

Lattice Semiconductor

EE PLD

Military

Pin/Peg

84

PGA

Square

Ceramic, Metal-Sealed Cofired

25 ns

No

5.5 V

128

CMOS

MIL-STD-883

5

5 V

Grid Array

PGA84M,11X11

Programmable Logic Devices

Yes

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

4 Dedicated Inputs, 64 I/O

4

-55 °C (-67 °F)

Perpendicular

S-CPGA-P84

5.588 mm

29.464 mm

No

In-System Programmable; 4 External Clocks

38 MHz

30 s

225 °C (437 °F)

29.464 mm

No

64

ISPLSI1048C-50LG/883

Lattice Semiconductor

EE PLD

Military

Pin/Peg

133

PGA

Square

Ceramic, Metal-Sealed Cofired

26 ns

No

5.5 V

192

CMOS

MIL-STD-883

5

5 V

Grid Array

PGA132,14X14

Programmable Logic Devices

Yes

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 96 I/O

8

-55 °C (-67 °F)

Perpendicular

S-CPGA-P133

5.588 mm

37.084 mm

No

In-System Programmable; 4 External Clocks

34.5 MHz

30 s

225 °C (437 °F)

37.084 mm

No

96

ISPLSI1024-60LH/883

Lattice Semiconductor

EE PLD

Military

J Bend

68

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.5 V

96

CMOS

MIL-STD-883

5

5 V

Chip Carrier

LDCC68,1.0SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

1.27 mm

125 °C (257 °F)

2 Dedicated Inputs, 48 I/O

2

-55 °C (-67 °F)

Quad

S-PQCC-J68

4.826 mm

24.13 mm

No

In-System Programmable; 4 External Clocks

38 MHz

30 s

225 °C (437 °F)

24.13 mm

No

48

5962-89841063A

Defense Logistics Agency

EE PLD

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

CMOS

MIL-STD-883

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

1.9812 mm

11.43 mm

Yes

e0

76.9 MHz

11.43 mm

10

ATV750-25DM/883

Atmel

UV PLD

Military

Through-Hole

24

WDIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

10

CMOS

MIL-STD-883 Class B

5

5 V

In-Line, Window

DIP24,.3

Programmable Logic Devices

No

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 10 I/O

12

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

10 Macrocells; Variable Product Terms

e0

45 MHz

30 s

240 °C (464 °F)

32 mm

No

10

PALC16R4-30DMB

Cypress Semiconductor

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

38535Q/M;38534H;883B

16

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

1 External Clock

e0

22 MHz

4

24.13 mm

4

5962-8872404LA

Defense Logistics Agency

UV PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

CMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

e0

31.2 MHz

32 mm

10

5962-8983904RA

Defense Logistics Agency

EE PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

CMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

Yes

1 External Clock; Register Preload

e0

58.8 MHz

25.27 mm

8

5962-9061102XA

Defense Logistics Agency

UV PLD

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

CMOS

5

In-Line

Macrocell

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

Yes

e0

CY7C344-25WMB

Cypress Semiconductor

UV PLD

Military

Through-Hole

28

WDIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

CMOS

38535Q/M;38534H;883B

24

PAL-TYPE

5

5 V

In-Line, Window

DIP28,.3

Programmable Logic Devices

Macrocell

4.5 V

320

2.54 mm

125 °C (257 °F)

7 Dedicated Inputs, 16 I/O

7

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

5.08 mm

7.62 mm

No

Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock

e0

33.3 MHz

16

37.0205 mm

16

EP1810GM883B

Altera

OT PLD

Military

Pin/Peg

68

PGA

Square

Ceramic

50 ns

No

48

CMOS

38535Q/M;38534H;883B

5

5 V

Grid Array

PGA68,11X11

Programmable Logic Devices

No

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-XPGA-P68

No

e0

220 °C (428 °F)

No

PALC22V10-25DMB

Cypress Semiconductor

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

CMOS

38535Q/M;38534H;883B

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms

e0

30.3 MHz

10

31.877 mm

10

5962-8867005LX

Defense Logistics Agency

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

Yes

50 MHz

10

5962-8867805RA

Defense Logistics Agency

UV PLD

Military

Through-Hole

20

WDIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

5

In-Line, Window

Combinatorial

4.5 V

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

24.13 mm

6

5962-89839032A

Defense Logistics Agency

EE PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 ns

Yes

5.5 V

CMOS

MIL-STD-883

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 8 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.54 mm

8.89 mm

No

1 External Clock; Register Preload

e0

41.6 MHz

8.89 mm

8

5962-8984102LA

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

31.2 MHz

10

5962-9154505MYX

Microchip Technology

UV PLD

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

20 ns

Yes

5.5 V

CMOS

MIL-STD-883

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

125 °C (257 °F)

13 Dedicated Inputs, 24 I/O

13

-55 °C (-67 °F)

Quad

S-CQCC-J44

4.57 mm

16.5862 mm

No

40 MHz

16.5862 mm

24

5962-9476101MXC

Defense Logistics Agency

EE PLD

Military

J Bend

QCCJ

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

MIL-STD-883

5

Chip Carrier

Macrocell

4.5 V

1.27 mm

125 °C (257 °F)

1 Dedicated Inputs, 48 I/O

1

-55 °C (-67 °F)

Gold

Quad

4.826 mm

24.13 mm

No

In-System Programmable; 4 External Clocks

e4

38 MHz

24.13 mm

48

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.