Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
Flash PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
e0 |
55.5 MHz |
10 |
32 mm |
10 |
|||||||||
Texas Instruments |
OT PLD |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
30 ns |
Yes |
5.5 V |
TTL |
38535Q/M;38534H;883B |
12 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LCC20,.35SQ |
Programmable Logic Devices |
No |
Mixed |
4.5 V |
64 |
1.27 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 4 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
2.03 mm |
8.89 mm |
No |
e0 |
25 MHz |
8 |
8.89 mm |
No |
4 |
||||||||
Defense Logistics Agency |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
In-Line |
Macrocell |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
Yes |
e0 |
50 MHz |
10 |
||||||||||||||||||||||
Microchip Technology |
Flash PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
MIL-PRF-38535; MIL-STD-883 |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin/Lead - hot dipped |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
e0 |
50 MHz |
10 |
32 mm |
10 |
|||||||||||
Atmel |
UV PLD |
Military |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
e0 |
50 MHz |
10 |
32 mm |
10 |
|||||||||||
Microchip Technology |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
10 |
CMOS |
MIL-STD-883 |
5 |
Tube |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
e0 |
55 MHz |
32 mm |
No |
10 |
|||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.5 V |
TTL |
MIL-M-38510 Class B |
16 |
PAL-TYPE |
5 |
Tube |
In-Line |
No |
Combinatorial |
4.75 V |
64 |
2.54 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
6.92 mm |
No |
e0 |
40 MHz |
8 |
24.2 mm |
No |
6 |
|||||||||||
Defense Logistics Agency |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
Yes |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
e0 |
25 MHz |
31.877 mm |
10 |
|||||||||||||||||
Atmel |
UV PLD |
Military |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
38535Q/M;38534H;883B |
22 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
e0 |
50 MHz |
10 |
32 mm |
10 |
||||||||||
Defense Logistics Agency |
EE PLD |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Chip Carrier |
Macrocell |
4.5 V |
125 °C (257 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
No |
e0 |
8 |
|||||||||||||||||||||||
NXP Semiconductors |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
No |
e0 |
22 MHz |
10 |
|||||||||||||||||||||||
Defense Logistics Agency |
EE PLD |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Chip Carrier |
Macrocell |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
No |
e0 |
50 MHz |
10 |
||||||||||||||||||||||
Defense Logistics Agency |
EE PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
1 External Clock; Register Preload |
e0 |
22.2 MHz |
25.27 mm |
8 |
|||||||||||||||||
Defense Logistics Agency |
EE PLD |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
20 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
2.54 mm |
8.89 mm |
No |
1 External Clock; Register Preload |
e0 |
33.3 MHz |
8.89 mm |
8 |
|||||||||||||||||
National Semiconductor |
EE PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
Programmable Output Polarity; 8 Macrocells; Register Preload; Power-Up Reset |
e0 |
41.6 MHz |
24.257 mm |
8 |
||||||||||||||||||
Defense Logistics Agency |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
Programmable Output Polarity; 8 Macrocells; Register Preload; Power-Up Reset |
e0 |
33.3 MHz |
31.9405 mm |
8 |
||||||||||||||||||
Defense Logistics Agency |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
Programmable Output Polarity; 8 Macrocells; Register Preload; Power-Up Reset |
e0 |
41.6 MHz |
31.9405 mm |
8 |
||||||||||||||||||
Microchip Technology |
Flash PLD |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
10 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
22 |
PAL-TYPE |
5 |
Tube |
5 V |
Chip Carrier |
LCC28,.45SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
1.27 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
-55 °C (-67 °F) |
Quad |
S-CQCC-N28 |
2.54 mm |
11.4554 mm |
No |
90 MHz |
10 |
11.455 mm |
10 |
||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
TTL |
MIL-M-38510 Class B |
5 |
In-Line |
Combinatorial |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
No |
e0 |
||||||||||||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
TTL |
MIL-M-38510 Class B |
16 |
PAL-TYPE |
5 |
Tube |
In-Line |
No |
Combinatorial |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
e0 |
25 MHz |
8 |
24.2 mm |
No |
6 |
|||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
5.5 V |
TTL |
MIL-M-38510 Class B |
8 |
PAL-TYPE |
5 |
Tube |
In-Line |
No |
Registered |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 0 I/O |
8 |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
e0 |
25 MHz |
8 |
24.2 mm |
No |
0 |
|||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
TTL |
38535Q/M;38534H;883B |
16 |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
No |
Combinatorial |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
e0 |
25 MHz |
8 |
24.195 mm |
No |
6 |
||||||||
Texas Instruments |
OT PLD |
Military |
Flat |
20 |
DFP |
Rectangular |
Ceramic, Glass-Sealed |
40 ns |
Yes |
5.5 V |
TTL |
MIL-STD-883 |
12 |
PAL-TYPE |
5 |
Tube |
5 V |
Flatpack |
FL20,.3 |
Programmable Logic Devices |
No |
Mixed |
4.5 V |
64 |
1.27 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 4 I/O |
8 |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDFP-F20 |
2.54 mm |
6.92 mm |
Yes |
e0 |
25 MHz |
8 |
13.09 mm |
No |
4 |
||||||||
Altera |
UV PLD |
Military |
J Bend |
28 |
WQCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
Yes |
CMOS |
24 |
PAL-TYPE |
5 |
5 V |
Chip Carrier, Window |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
320 |
1.27 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-J28 |
4.57 mm |
11.43 mm |
No |
Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
50 MHz |
16 |
220 °C (428 °F) |
11.43 mm |
16 |
||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.25 V |
TTL |
MIL-M-38510 Class B |
12 |
PAL-TYPE |
5 |
Tube |
In-Line |
No |
Mixed |
4.75 V |
64 |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 4 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
6.92 mm |
No |
e0 |
40 MHz |
8 |
24.2 mm |
No |
4 |
|||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
5.25 V |
Bipolar |
MIL-M-38510 Class B |
16 |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
No |
Mixed |
4.75 V |
64 |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 4 I/O |
12 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
6.92 mm |
Yes |
e0 |
40 MHz |
8 |
32 mm |
No |
4 |
|||||||||
NXP Semiconductors |
OT PLD |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
80 ns |
No |
5.5 V |
TTL |
5 |
In-Line |
Combinatorial |
4.5 V |
125 °C (257 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T28 |
No |
0 |
||||||||||||||||||||||||||
Qp Semiconductor |
OT PLD |
Military |
Through-Hole |
28 |
Rectangular |
Ceramic, Metal-Sealed Cofired |
80 ns |
No |
5.5 V |
Bipolar |
5 |
In-Line |
Combinatorial |
4.5 V |
125 °C (257 °F) |
16 Dedicated Inputs, 0 I/O |
16 |
-55 °C (-67 °F) |
Dual |
R-CDIP-T28 |
No |
0 |
|||||||||||||||||||||||||||
Texas Instruments |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.5 V |
TTL |
38535Q/M;38534H;883B |
16 |
PAL-TYPE |
5 |
Tube |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
No |
Combinatorial |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
6.92 mm |
Yes |
e0 |
40 MHz |
8 |
24.2 mm |
No |
6 |
||||||||
Cypress Semiconductor |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
CMOS |
38535Q/M;38534H;883B |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
e0 |
25 MHz |
10 |
31.877 mm |
10 |
||||||||||
Lattice Semiconductor |
EE PLD |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
No |
5.5 V |
128 |
CMOS |
MIL-STD-883 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
5.588 mm |
29.464 mm |
No |
In-System Programmable; 4 External Clocks |
38 MHz |
30 s |
225 °C (437 °F) |
29.464 mm |
No |
64 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Military |
Pin/Peg |
133 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
26 ns |
No |
5.5 V |
192 |
CMOS |
MIL-STD-883 |
5 |
5 V |
Grid Array |
PGA132,14X14 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 96 I/O |
8 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P133 |
5.588 mm |
37.084 mm |
No |
In-System Programmable; 4 External Clocks |
34.5 MHz |
30 s |
225 °C (437 °F) |
37.084 mm |
No |
96 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Military |
J Bend |
68 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
96 |
CMOS |
MIL-STD-883 |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
2 Dedicated Inputs, 48 I/O |
2 |
-55 °C (-67 °F) |
Quad |
S-PQCC-J68 |
4.826 mm |
24.13 mm |
No |
In-System Programmable; 4 External Clocks |
38 MHz |
30 s |
225 °C (437 °F) |
24.13 mm |
No |
48 |
|||||||||||
Defense Logistics Agency |
EE PLD |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
10 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N28 |
1.9812 mm |
11.43 mm |
Yes |
e0 |
76.9 MHz |
11.43 mm |
10 |
||||||||||||||||||
Atmel |
UV PLD |
Military |
Through-Hole |
24 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
5.5 V |
10 |
CMOS |
MIL-STD-883 Class B |
5 |
5 V |
In-Line, Window |
DIP24,.3 |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
12 Dedicated Inputs, 10 I/O |
12 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells; Variable Product Terms |
e0 |
45 MHz |
30 s |
240 °C (464 °F) |
32 mm |
No |
10 |
|||||||||
Cypress Semiconductor |
OT PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
CMOS |
38535Q/M;38534H;883B |
16 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Mixed |
4.5 V |
64 |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 4 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
1 External Clock |
e0 |
22 MHz |
4 |
24.13 mm |
4 |
||||||||||
Defense Logistics Agency |
UV PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
e0 |
31.2 MHz |
32 mm |
10 |
||||||||||||||||||
Defense Logistics Agency |
EE PLD |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
In-Line |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
Yes |
1 External Clock; Register Preload |
e0 |
58.8 MHz |
25.27 mm |
8 |
|||||||||||||||||
Defense Logistics Agency |
UV PLD |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
CMOS |
5 |
In-Line |
Macrocell |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
Yes |
e0 |
||||||||||||||||||||||||||||||
Cypress Semiconductor |
UV PLD |
Military |
Through-Hole |
28 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
5.5 V |
CMOS |
38535Q/M;38534H;883B |
24 |
PAL-TYPE |
5 |
5 V |
In-Line, Window |
DIP28,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
320 |
2.54 mm |
125 °C (257 °F) |
7 Dedicated Inputs, 16 I/O |
7 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
5.08 mm |
7.62 mm |
No |
Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
33.3 MHz |
16 |
37.0205 mm |
16 |
||||||||||
Altera |
OT PLD |
Military |
Pin/Peg |
68 |
PGA |
Square |
Ceramic |
50 ns |
No |
48 |
CMOS |
38535Q/M;38534H;883B |
5 |
5 V |
Grid Array |
PGA68,11X11 |
Programmable Logic Devices |
No |
2.54 mm |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Perpendicular |
S-XPGA-P68 |
No |
e0 |
220 °C (428 °F) |
No |
|||||||||||||||||||||
Cypress Semiconductor |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
25 ns |
No |
5.5 V |
CMOS |
38535Q/M;38534H;883B |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
No |
10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms |
e0 |
30.3 MHz |
10 |
31.877 mm |
10 |
||||||||||
Defense Logistics Agency |
OT PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
15 ns |
No |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
In-Line |
Macrocell |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Dual |
R-GDIP-T24 |
Yes |
50 MHz |
10 |
||||||||||||||||||||||||
Defense Logistics Agency |
UV PLD |
Military |
Through-Hole |
20 |
WDIP |
Rectangular |
Ceramic, Glass-Sealed |
30 ns |
No |
5.5 V |
CMOS |
5 |
In-Line, Window |
Combinatorial |
4.5 V |
2.54 mm |
125 °C (257 °F) |
10 Dedicated Inputs, 6 I/O |
10 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
5.08 mm |
7.62 mm |
No |
e0 |
24.13 mm |
6 |
||||||||||||||||||||
Defense Logistics Agency |
EE PLD |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
2.54 mm |
8.89 mm |
No |
1 External Clock; Register Preload |
e0 |
41.6 MHz |
8.89 mm |
8 |
|||||||||||||||||
NXP Semiconductors |
EE PLD |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
20 ns |
No |
5.5 V |
CMOS |
5 |
In-Line |
Macrocell |
4.5 V |
125 °C (257 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T24 |
No |
e0 |
31.2 MHz |
10 |
|||||||||||||||||||||||
Microchip Technology |
UV PLD |
Military |
J Bend |
44 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
20 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
13 Dedicated Inputs, 24 I/O |
13 |
-55 °C (-67 °F) |
Quad |
S-CQCC-J44 |
4.57 mm |
16.5862 mm |
No |
40 MHz |
16.5862 mm |
24 |
||||||||||||||||||||
Defense Logistics Agency |
EE PLD |
Military |
J Bend |
QCCJ |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
Chip Carrier |
Macrocell |
4.5 V |
1.27 mm |
125 °C (257 °F) |
1 Dedicated Inputs, 48 I/O |
1 |
-55 °C (-67 °F) |
Gold |
Quad |
4.826 mm |
24.13 mm |
No |
In-System Programmable; 4 External Clocks |
e4 |
38 MHz |
24.13 mm |
48 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.