Other Programmable Logic Devices (PLD) 1,448

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
5M570ZF256C4N	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS		1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	159 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e1	184.1 MHz				17 mm	Yes	159
5M570ZM100C5N	Intel	Flash PLD	Other	Ball	100	TFBGA	Square	Plastic/Epoxy	17.7 ns		Yes	1.89 V	440	CMOS		1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	74 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	118.3 MHz				6 mm	Yes	74
5M570ZT100C4	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	9.5 ns		Yes	1.89 V				1.8		Flatpack, Thin Profile, Fine Pitch				Macrocell	1.71 V	.5 mm	85 °C (185 °F)	74 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e0	184.1 MHz				14 mm		74
EP20K100EQC240-2N	Intel	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS	175	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 183 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3			175		32 mm		183
EPF6016TC144-2N	Intel	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		1320	Yes	5.25 V		CMOS	117	5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Macrocell	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 117 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Can Also Be Used 16000 Logic Gates	e3	153 MHz		117		20 mm		117
EPF6024AQC240-2N	Intel	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1960	Yes	3.6 V		CMOS	199	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 199 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can Also Be Used 24000 Logic Gates	e3	153 MHz		199		32 mm		199
EPM240M100C4N	Intel	Flash PLD	Other	Ball	100	BGA	Square	Plastic/Epoxy	6.1 ns		Yes	2.625 V	192	CMOS	80	2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B100	3		6 mm	No	It can also operate at 3.3 V	e1		30 s	80	260 °C (500 °F)	6 mm	Yes	80
5M570ZT100C5	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	17.7 ns		Yes	1.89 V				1.8		Flatpack, Thin Profile, Fine Pitch				Macrocell	1.71 V	.5 mm	85 °C (185 °F)	74 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e0	118.3 MHz				14 mm		74
5M80ZE64C4	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V				1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V	.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	184.1 MHz				7 mm		54
EP20K30EFC324-3	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.98 ns	1200	Yes	1.89 V		CMOS	120	1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1	160 MHz		120	220 °C (428 °F)	19 mm		128
EPF6010ATC144-3N	Intel	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy			Yes	3.6 V				3.3		Flatpack, Low Profile, Fine Pitch				Macrocell	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 102 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Can Also Be Used 10000 Logic Gates	e3	133 MHz				20 mm		102
EPM2210GF256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS	204	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			204		17 mm	Yes	204
EPM240ZM68C6N	Intel	Flash PLD	Other	Ball	68	BGA	Rectangular	Plastic/Epoxy	7.9 ns		Yes	1.89 V	192	CMOS	54	1.8	1.5/3.3,1.8 V	Grid Array	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B68	3		5 mm	No	It can also operate at 3.3 V	e1			54		5 mm	Yes	54
EPM240ZM68C7N	Intel	Flash PLD	Other	Ball	68	BGA	Rectangular	Plastic/Epoxy	12 ns		Yes	1.89 V	192	CMOS	54	1.8	1.5/3.3,1.8 V	Grid Array	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B68	3		5 mm	No	It can also operate at 3.3 V	e1			54		5 mm	Yes	54
EPXA1F484C2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 186 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0				220 °C (428 °F)	23 mm		186
5M2210ZF256C5	Intel	Flash PLD	Other	Ball	256	LBGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS	203	1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	203 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256		1.55 mm	17 mm	No		e0	201.1 MHz		203		17 mm	Yes	203
5M80ZE64C5	Intel	Flash PLD	Other	Gull Wing	64	HTFQFP	Square	Plastic/Epoxy	14 ns		Yes	1.89 V				1.8		Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch				Macrocell	1.71 V	.4 mm	85 °C (185 °F)	54 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G64		1.2 mm	7 mm	No		e0	118.3 MHz				7 mm		54
EPF6024AQC208-3N	Intel	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	3.6 V				3.3		Flatpack, Fine Pitch				Macrocell	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can Also Be Used 24000 Logic Gates	e3	133 MHz				28 mm		171
EPF6024AQC240-3N	Intel	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1960	Yes	3.6 V		CMOS	199	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 199 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can Also Be Used 24000 Logic Gates	e3	133 MHz		199		32 mm		199
5M160ZM68C5N	Intel	Flash PLD	Other	Ball	68	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	128	CMOS		1.8	1.2/3.3,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	52 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e1	118.3 MHz				5 mm	Yes	52
EP20K400FC672-1X	Intel	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.5 ns	16640	Yes	2.625 V		CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	502 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0			496		27 mm		502
EP20K200EQC208-2X	Intel	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.97 ns	8320	Yes	1.89 V		CMOS	128	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 136 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			128		28 mm		136
EPM570GF256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	8.7 ns		Yes	1.89 V	440	CMOS	160	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 160 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			160		17 mm	Yes	160
5M570ZM100C4N	Intel	Flash PLD	Other	Ball	100	TFBGA	Square	Plastic/Epoxy	9.5 ns		Yes	1.89 V	440	CMOS		1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	74 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	184.1 MHz				6 mm	Yes	74
EP20K100EBC356-2X	Intel	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0			238		35 mm		246
EP20K100EBC356-3	Intel	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.2 ns	4160	Yes	1.89 V		CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e0			238		35 mm		246
EP20K100EBC356-3N	Intel	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	2.2 ns	4160	Yes	1.89 V		CMOS	238	1.8	1.8,1.8/3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays		Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356	3	1.63 mm	35 mm	No		e1			238		35 mm		246
EP20K100EQC240-2X	Intel	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS	175	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 183 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			175		32 mm		183
EPM1270F256C3N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	6.2 ns		Yes	2.625 V	980	CMOS	212	2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	212	260 °C (500 °F)	17 mm	Yes	212
5M240ZM68C5N	Intel	Flash PLD	Other	Ball	68	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	192	CMOS	52	1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA68,9X9,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	52 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B68		1.2 mm	5 mm	No		e1	118.3 MHz		52		5 mm	Yes	52
5M40ZM64C4	Intel	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V				1.8		Grid Array, Thin Profile, Fine Pitch				Macrocell	1.71 V	.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e0	184.1 MHz				4.5 mm		30
5M80ZM64C5N	Intel	Flash PLD	Other	Ball	64	TFBGA	Square	Plastic/Epoxy	14 ns		Yes	1.89 V	64	CMOS		1.8	1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA64,8X8,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	30 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B64		1.2 mm	4.5 mm	No		e1	118.3 MHz				4.5 mm	Yes	30
5M80ZT100C4N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V	64	CMOS		1.8	1.8,1.2/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	79 I/O		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100		1.2 mm	14 mm	No		e3	184.1 MHz				14 mm	Yes	79
EP20K100EQC208-1X	Intel	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.73 ns	4160	Yes	1.89 V		CMOS	143	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 151 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			143		28 mm		151
EP20K100FC324-1	Intel	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.5 ns	4160	Yes	2.625 V		CMOS	246	2.5	2.5,2.5/3.3 V	Grid Array	BGA324(UNSPEC)	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0			246		19 mm		252
EP20K1500EFC33-1X	Intel	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.84 ns	51840	Yes	1.89 V		CMOS	800	1.8	1.8,1.8/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 808 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	5A	3.5 mm	33 mm	No		e0			800		33 mm		808
EP20K160EQC208-2X	Intel	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.93 ns	6400	Yes	1.89 V		CMOS	135	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 143 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	160 MHz		135		28 mm		143
EP20K400BC652-1	Intel	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.5 ns	16640	Yes	2.625 V		CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0			496		45 mm		502
EPF6016AFC100-2	Intel	Loadable PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy		1320	Yes	3.6 V		CMOS	81	3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA100,10X10,40	Field Programmable Gate Arrays		Macrocell	3 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 81 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No		e0	153 MHz		81		11 mm		81
EPF6016QC208-2N	Intel	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy			Yes	5.25 V				5		Flatpack, Fine Pitch				Macrocell	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can Also Be Used 16000 Logic Gates	e3	153 MHz				28 mm		171
EPF6016QC208-3N	Intel	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		1320	Yes	5.25 V		CMOS	171	5	3.3/5,5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can Also Be Used 16000 Logic Gates	e3	133 MHz		171		28 mm		171
EPF6016TC144-2	Intel	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		1320	Yes	5.25 V		CMOS	117	5	3.3/5,5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.63SQ,20	Field Programmable Gate Arrays		Macrocell	4.75 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 117 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Can Also Be Used 16000 Logic Gates	e0	153 MHz		117		20 mm		117
EPM1270GM256C5N	Intel	Flash PLD	Other	Ball	256	BGA	Rectangular	Plastic/Epoxy	10 ns		Yes	1.89 V	980	CMOS	212	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,20X20,20	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3		11 mm	No	It can also operate at 3.3 V	e1			212		11 mm	Yes	212
EPM2210F256C3N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	1700	CMOS	204	2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1			204		17 mm	Yes	204
EPM2210GF256C3N	Intel	Flash PLD	Other	Ball	256	BGA	Square	Plastic/Epoxy	7 ns		Yes	1.89 V	1700	CMOS	204	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 204 I/O	0	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No	It can also operate at 3.3 V	e1		30 s	204	260 °C (500 °F)	17 mm	Yes	204
EPM240GF100C5N	Intel	Flash PLD	Other	Ball	100	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.89 V	192	CMOS	80	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA100,10X10,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.7 mm	11 mm	No	It can also operate at 3.3 V	e1			80		11 mm	Yes	80
EPM240GT100C4N	Intel	Flash PLD	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6.1 ns		Yes	1.89 V	192	CMOS	80	1.8	1.5/3.3,1.8 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	1.71 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 80 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	It can also operate at 3.3 V	e3			80		14 mm	Yes	80
EPM570T144C3N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5.4 ns		Yes	2.625 V	440	CMOS	116	2.5	1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Matte Tin - annealed	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3		30 s	116	260 °C (500 °F)	20 mm	Yes	116

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.