Other Programmable Logic Devices (PLD) 1,448

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPM570T144C4N	Intel	Flash PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	440	CMOS	116		2.5		1.5/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.375 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 116 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	It can also operate at 3.3 V	e3			116		20 mm	Yes	116
ATF22LV10C-10XU	Microchip Technology	Flash PLD	Other	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns		Yes	5.5 V		CMOS	22	PAL-TYPE	3.3	Tube	3.3/5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	3 V	132	.65 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G24	2	1.2 mm	4.4 mm	No	10 Macrocells	e3	71.4 MHz		10		7.8 mm		10
TIEPAL10016ET6CFN	Texas Instruments	OT PLD	Other	J Bend	28	QCCJ	Square	Plastic/Epoxy	6 ns		Yes	5.5 V		ECL100K	10	PAL-TYPE	5		5,-5.2 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Latched	4.5 V	48	1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 0 I/O	10	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No					6		11.5062 mm		0
TIEPAL10016P8-6CJT	Texas Instruments	OT PLD	Other	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	6 ns		No			ECL	16	PAL-TYPE			-4.5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Dual	R-GDIP-T24				No					8				4
TIEPAL10016ET6CJT	Texas Instruments	OT PLD	Other	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	6 ns		No	5.5 V		ECL100K	10	PAL-TYPE	5		5,-5.2 V	In-Line	DIP24,.3	Programmable Logic Devices		Latched	4.5 V	48	2.54 mm	85 °C (185 °F)	10 Dedicated Inputs, 0 I/O	10	0 °C (32 °F)		Dual	R-GDIP-T24				No					6				0
TIEPAL10016TE6CJT	Texas Instruments	OT PLD	Other	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	6 ns		No	5.25 V		ECL100K	10	PAL-TYPE	5		5,-5.2 V	In-Line	DIP24,.3	Programmable Logic Devices		Latched	4.75 V	48	2.54 mm	85 °C (185 °F)	10 Dedicated Inputs, 0 I/O	10	0 °C (32 °F)		Dual	R-GDIP-T24				No					6				0
TIEPAL10016P8-6CFK	Texas Instruments	OT PLD	Other	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	6 ns		Yes			ECL	16	PAL-TYPE			-4.5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial		64	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Quad	S-CQCC-N28		2.03 mm	11.43 mm	No					8		11.43 mm		4
TIEPAL10016P8-3CJT	Texas Instruments	OT PLD	Other	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	3 ns		No			ECL	16	PAL-TYPE			-4.5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Dual	R-GDIP-T24				No					8				4
TIEPAL10016P8-3CFK	Texas Instruments	OT PLD	Other	No Lead	28	QCCN	Square	Ceramic, Metal-Sealed Cofired	3 ns		Yes			ECL	16	PAL-TYPE			-4.5 V	Chip Carrier	LCC28,.45SQ	Programmable Logic Devices		Combinatorial		64	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Quad	S-CQCC-N28		2.03 mm	11.43 mm	No					8		11.43 mm		4
TIEPAL10016TE6CFN	Texas Instruments	OT PLD	Other	J Bend	28	QCCJ	Square	Plastic/Epoxy	6 ns		Yes	5.25 V		ECL100K	10	PAL-TYPE	5		5,-5.2 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Latched	4.75 V	48	1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 0 I/O	10	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No					6		11.5062 mm		0
10020EV8-4F	NXP Semiconductors	OT PLD	Other	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	4.7 ns		No			ECL	20	PAL-TYPE			-4.5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		90	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 8 I/O	11	0 °C (32 °F)		Dual	R-GDIP-T24	1	5.08 mm	7.62 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		204 MHz		8		31.955 mm		8
10020EV8-4A	NXP Semiconductors	OT PLD	Other	J Bend	28	QCCJ	Square	Plastic/Epoxy	4.5 ns		Yes			ECL	20	PAL-TYPE			-4.5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell		90	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 8 I/O	11	0 °C (32 °F)		Quad	S-PQCC-J28	1	4.57 mm	11.505 mm	No	8 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset		204 MHz		8		11.505 mm		8
EP20K100QC240-1	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.5 ns	4160	Yes	2.625 V		CMOS	183		2.5		2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	2.375 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 189 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		20 s	183	220 °C (428 °F)	32 mm		189
5M240ZM100C4N	Altera	Flash PLD	Other	Ball	100	TFBGA	Square	Plastic/Epoxy	7.9 ns		Yes	1.89 V	192	CMOS			1.8		1.8,1.2/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA100,11X11,20	Programmable Logic Devices	Yes	Macrocell	1.71 V		.5 mm	85 °C (185 °F)	79 I/O		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100		1.2 mm	6 mm	No		e1	184.1 MHz				6 mm	Yes	79
EP20K400EBC652-3N	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.07 ns	16640	Yes	1.89 V		CMOS	480		1.8		1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e1		30 s	480	245 °C (473 °F)	45 mm		488
EP20K100QC208-2	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	3 ns	4160	Yes	2.625 V		CMOS	153		2.5		2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	2.375 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 159 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0		20 s	153	220 °C (428 °F)	28 mm		159
EP20K1500EFC33-3	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	2.32 ns	51840	Yes	1.89 V		CMOS	800		1.8		1.8,1.8/3.3 V	Grid Array	BGA1020,32X32,40	Field Programmable Gate Arrays		Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 808 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	5A	3.5 mm	33 mm	No		e0		20 s	800	220 °C (428 °F)	33 mm		808
EP20K400PC655	Altera	Loadable PLD	Other	Pin/Peg	655	IPGA	Square	Ceramic, Metal-Sealed Cofired			No	2.625 V					2.5			Grid Array, Interstitial Pitch				Macrocell	2.375 V		2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)		Perpendicular	S-CPGA-P655		4.08 mm	62.484 mm	No						220 °C (428 °F)	62.484 mm		502
EP20K300EFC672-1	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.68 ns	11520	Yes	1.89 V		CMOS	400		1.8		1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	400	220 °C (428 °F)	27 mm		408
EPF6024ATC144-3N	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy			Yes	3.6 V					3.3			Flatpack, Low Profile, Fine Pitch				Macrocell	3 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 117 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Can Also Be Used 24000 Logic Gates	e3	133 MHz				20 mm		117
EP20K600EFC672-1N	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.57 ns	24320	Yes	1.89 V		CMOS	500		1.8		1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	4	3.5 mm	27 mm	No		e1	160 MHz	30 s	500	245 °C (473 °F)	27 mm		508
EP20K60ETC144-3	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	3.56 ns	2560	Yes	1.89 V		CMOS	84		1.8		1.8,1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 92 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	160 MHz	20 s	84	220 °C (428 °F)	20 mm		92
EP20K100EFC324-2N	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS	238		1.8		1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz	30 s	238	260 °C (500 °F)	19 mm		246
EP20K100FC400-2	Altera	Loadable PLD	Other	Ball	400	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5			Grid Array				Macrocell	2.375 V			85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3			No		e1				220 °C (428 °F)
EP20K60EQC240-2X	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2.41 ns	2560	Yes	1.89 V		CMOS	143		1.8		1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 151 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	160 MHz	20 s	143	220 °C (428 °F)	32 mm		151
EPF6016AQC208-2N	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		1320	Yes	3.6 V		CMOS	171		3.3		2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	3 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 171 I/O	4	0 °C (32 °F)	Matte Tin/Copper	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can Also Be Used 16000 Logic Gates	e2	153 MHz	40 s	171	245 °C (473 °F)	28 mm		171
EP20K100FC324-2N	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3 ns	4160	Yes	2.625 V		CMOS	246		2.5		2.5,2.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	2.375 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1		30 s	246	260 °C (500 °F)	19 mm		252
EP20K200EFC672XES	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8			Grid Array				Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672		2.1 mm	27 mm	No		e1					27 mm		376
EP20K160EFC484-3X	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	2.29 ns		Yes	1.89 V		CMOS			1.8			Grid Array				Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 316 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e1	160 MHz			220 °C (428 °F)	23 mm		316
EP20K100EFC144-2XN	Altera	Loadable PLD	Other	Ball	144	LBGA	Square	Plastic/Epoxy	2.02 ns		Yes	1.89 V		CMOS			1.8			Grid Array, Low Profile				Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 93 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144		1.7 mm	13 mm	No		e1	160 MHz				13 mm		93
EP20K400EBC652-2	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.83 ns	16640	Yes	1.89 V		CMOS	480		1.8		1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 488 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0		20 s	480	220 °C (428 °F)	45 mm		488
EP20K1000EFC672-2X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.13 ns	38400	Yes	1.89 V		CMOS	500		1.8		1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	500	220 °C (428 °F)	27 mm		508
EP20K200ERC240	Altera	Loadable PLD	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy			Yes						1.8			Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell			.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 166 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm		166
EP20K200RC240-2X	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	3 ns	8320	Yes	2.625 V		CMOS	168		2.5		2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	2.375 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			168	220 °C (428 °F)	32 mm		174
EP20K200RC240-3V	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	3.6 ns	8320	Yes	2.625 V		CMOS	168		2.5		2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	2.375 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			168	220 °C (428 °F)	32 mm		174
EP20K160EFC784	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes						1.8			Grid Array				Macrocell				85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EP20K200ERC240-1X	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		8320	Yes	2.625 V		CMOS	160		2.5		1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays		Macrocell	2.375 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 168 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e3			160	220 °C (428 °F)	32 mm		168
EP20K200QC240	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	2.625 V					2.5			Flatpack, Fine Pitch				Macrocell	2.375 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3				220 °C (428 °F)	32 mm		174
EP20K100FC784-1	Altera	Loadable PLD	Other	Ball	784	BGA	Square	Plastic/Epoxy			Yes	2.625 V					2.5			Grid Array				Macrocell	2.375 V			85 °C (185 °F)	4 Dedicated Inputs	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	3			No		e1				220 °C (428 °F)
EP20K100ERC208-3	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		4160	Yes	2.625 V		CMOS	143		2.5		1.8,1.8/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	2.375 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 151 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3			143	220 °C (428 °F)	28 mm		151
EP20K300EBC652-3	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	3.06 ns	11520	Yes	1.89 V		CMOS	400		1.8		1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays		Macrocell	1.71 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0	160 MHz		400	220 °C (428 °F)	45 mm		408
EP20K30ERC208-2X	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		1200	Yes	2.625 V		CMOS	117		2.5		1.8,1.8/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	2.375 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 125 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3	160 MHz		117	220 °C (428 °F)	28 mm		125
EPF6016QC240-2N	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy			Yes	5.25 V					5			Flatpack, Fine Pitch				Macrocell	4.75 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 199 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can Also Be Used 16000 Logic Gates	e3	153 MHz				32 mm		199
EP20K200EBC356-2XN	Altera	Loadable PLD	Other	Ball	356	LBGA	Square	Plastic/Epoxy	1.97 ns		Yes	1.89 V		CMOS			1.8			Grid Array, Low Profile				Macrocell	1.71 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 271 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B356		1.63 mm	35 mm	No		e1					35 mm		271
EP20K30ERC208-3X	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy			Yes	2.625 V		CMOS			2.5			Flatpack, Heat Sink/Slug, Fine Pitch				Macrocell	2.375 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 125 I/O	4	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e3	160 MHz			220 °C (428 °F)	28 mm		125
EP20K300EFC672-2X	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	2.29 ns	11520	Yes	1.89 V		CMOS	400		1.8		1.8,1.8/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 408 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e0	160 MHz	20 s	400	220 °C (428 °F)	27 mm		408
EP20K400FC672-3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	3.6 ns	16640	Yes	2.625 V		CMOS	496		2.5		2.5,2.5/3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays		Macrocell	2.375 V		1 mm	85 °C (185 °F)	502 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No		e0		20 s	496	220 °C (428 °F)	27 mm		502
EP20K30EFC484	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V					1.8			Grid Array				Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.1 mm	23 mm	No		e1	160 MHz				23 mm		128

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.