Other Programmable Logic Devices (PLD) 1,448

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPM570T144C4N

Intel

Flash PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

440

CMOS

116

2.5

1.5/3.3,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 116 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

It can also operate at 3.3 V

e3

116

20 mm

Yes

116

ATF22LV10C-10XU

Microchip Technology

Flash PLD

Other

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.5 V

CMOS

22

PAL-TYPE

3.3

Tube

3.3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP24,.25

Programmable Logic Devices

Macrocell

3 V

132

.65 mm

85 °C (185 °F)

10 Dedicated Inputs, 10 I/O

10

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G24

2

1.2 mm

4.4 mm

No

10 Macrocells

e3

71.4 MHz

10

7.8 mm

10

TIEPAL10016ET6CFN

Texas Instruments

OT PLD

Other

J Bend

28

QCCJ

Square

Plastic/Epoxy

6 ns

Yes

5.5 V

ECL100K

10

PAL-TYPE

5

5,-5.2 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Latched

4.5 V

48

1.27 mm

85 °C (185 °F)

10 Dedicated Inputs, 0 I/O

10

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

6

11.5062 mm

0

TIEPAL10016P8-6CJT

Texas Instruments

OT PLD

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

6 ns

No

ECL

16

PAL-TYPE

-4.5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

85 °C (185 °F)

12 Dedicated Inputs, 4 I/O

12

0 °C (32 °F)

Dual

R-GDIP-T24

No

8

4

TIEPAL10016ET6CJT

Texas Instruments

OT PLD

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

6 ns

No

5.5 V

ECL100K

10

PAL-TYPE

5

5,-5.2 V

In-Line

DIP24,.3

Programmable Logic Devices

Latched

4.5 V

48

2.54 mm

85 °C (185 °F)

10 Dedicated Inputs, 0 I/O

10

0 °C (32 °F)

Dual

R-GDIP-T24

No

6

0

TIEPAL10016P8-3CJT

Texas Instruments

OT PLD

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

3 ns

No

ECL

16

PAL-TYPE

-4.5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

64

2.54 mm

85 °C (185 °F)

12 Dedicated Inputs, 4 I/O

12

0 °C (32 °F)

Dual

R-GDIP-T24

No

8

4

TIEPAL10016P8-3CFK

Texas Instruments

OT PLD

Other

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

3 ns

Yes

ECL

16

PAL-TYPE

-4.5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Combinatorial

64

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 4 I/O

12

0 °C (32 °F)

Quad

S-CQCC-N28

2.03 mm

11.43 mm

No

8

11.43 mm

4

TIEPAL10016TE6CFN

Texas Instruments

OT PLD

Other

J Bend

28

QCCJ

Square

Plastic/Epoxy

6 ns

Yes

5.25 V

ECL100K

10

PAL-TYPE

5

5,-5.2 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Latched

4.75 V

48

1.27 mm

85 °C (185 °F)

10 Dedicated Inputs, 0 I/O

10

0 °C (32 °F)

Quad

S-PQCC-J28

4.57 mm

11.5062 mm

No

6

11.5062 mm

0

TIEPAL10016TE6CJT

Texas Instruments

OT PLD

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

6 ns

No

5.25 V

ECL100K

10

PAL-TYPE

5

5,-5.2 V

In-Line

DIP24,.3

Programmable Logic Devices

Latched

4.75 V

48

2.54 mm

85 °C (185 °F)

10 Dedicated Inputs, 0 I/O

10

0 °C (32 °F)

Dual

R-GDIP-T24

No

6

0

TIEPAL10016P8-6CFK

Texas Instruments

OT PLD

Other

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

6 ns

Yes

ECL

16

PAL-TYPE

-4.5 V

Chip Carrier

LCC28,.45SQ

Programmable Logic Devices

Combinatorial

64

1.27 mm

85 °C (185 °F)

12 Dedicated Inputs, 4 I/O

12

0 °C (32 °F)

Quad

S-CQCC-N28

2.03 mm

11.43 mm

No

8

11.43 mm

4

10020EV8-4F

NXP Semiconductors

OT PLD

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

4.7 ns

No

ECL

20

PAL-TYPE

-4.5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

90

2.54 mm

85 °C (185 °F)

11 Dedicated Inputs, 8 I/O

11

0 °C (32 °F)

Dual

R-GDIP-T24

1

5.08 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

204 MHz

8

31.955 mm

8

10020EV8-4A

NXP Semiconductors

OT PLD

Other

J Bend

28

QCCJ

Square

Plastic/Epoxy

4.5 ns

Yes

ECL

20

PAL-TYPE

-4.5 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

90

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 8 I/O

11

0 °C (32 °F)

Quad

S-PQCC-J28

1

4.57 mm

11.505 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

204 MHz

8

11.505 mm

8

EP20K200RC240-2XN

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

3 ns

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 174 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

32 mm

174

EP20K100EFC324-3N

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

2.2 ns

4160

Yes

1.89 V

CMOS

238

1.8

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e1

160 MHz

30 s

238

260 °C (500 °F)

19 mm

246

EP20K100EBC672-3

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.8

Grid Array

Macrocell

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

No

e1

246

EPM1270GF256C4N

Altera

Flash PLD

Other

Ball

256

BGA

Square

Plastic/Epoxy

8.1 ns

Yes

1.89 V

980

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.2 mm

17 mm

No

It can also operate at 3.3 V

e1

30 s

260 °C (500 °F)

17 mm

Yes

212

EP20K200EBC652-3N

Altera

Loadable PLD

Other

Ball

652

BGA

Square

Plastic/Epoxy

2.33 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B652

3.5 mm

45 mm

No

e1

45 mm

376

EP20K100TC144

Altera

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Flatpack, Low Profile, Fine Pitch

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 101 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

220 °C (428 °F)

20 mm

101

5M160ZM68C4N

Altera

Flash PLD

Other

Ball

68

TFBGA

Square

Plastic/Epoxy

7.9 ns

Yes

1.89 V

128

CMOS

1.8

1.2/3.3,1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA68,9X9,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

52 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B68

1.2 mm

5 mm

No

e1

184.1 MHz

5 mm

Yes

52

EP1M120F484C7N

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

CMOS

1.8

Grid Array

Mixed

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 303 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

245 °C (473 °F)

23 mm

303

EP20K1000EFC672

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

160 MHz

27 mm

508

EP20K200FC784-3

Altera

Loadable PLD

Other

Ball

784

BGA

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

85 °C (185 °F)

4 Dedicated Inputs

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B784

3

No

e1

220 °C (428 °F)

EP20K100EFC144-1X

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

1.73 ns

4160

Yes

1.89 V

CMOS

85

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA144,12X12,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 93 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.7 mm

13 mm

No

e0

160 MHz

20 s

85

235 °C (455 °F)

13 mm

93

EP20K200EFC672-3X

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

2.33 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

160 MHz

220 °C (428 °F)

27 mm

376

EP20K200QC240-3X

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

Yes

2.625 V

CMOS

2.5

Flatpack, Fine Pitch

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 174 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

220 °C (428 °F)

32 mm

174

EP20K200CQC208-9

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Flatpack, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

136 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

136

EP20K600EFC672-1

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.57 ns

24320

Yes

1.89 V

CMOS

500

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e0

160 MHz

20 s

500

220 °C (428 °F)

27 mm

508

EP20K200FC484-2V

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

0.4 ns

8320

Yes

2.625 V

CMOS

376

2.5

2.5,2.5/3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

34 MHz

376

220 °C (428 °F)

23 mm

382

EP20K160EQC208-3N

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

2.29 ns

6400

Yes

1.89 V

CMOS

135

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 143 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

160 MHz

30 s

135

245 °C (473 °F)

28 mm

143

EP20K300EQC240

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

Yes

1.8

Flatpack, Fine Pitch

Macrocell

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 150 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

220 °C (428 °F)

32 mm

150

EP20K100FC324-2

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

3 ns

4160

Yes

2.625 V

CMOS

246

2.5

2.5,2.5/3.3 V

Grid Array

BGA324(UNSPEC)

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e0

20 s

246

220 °C (428 °F)

19 mm

252

EP20K200RC240-1X

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

2.5 ns

8320

Yes

2.625 V

CMOS

168

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 174 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

168

220 °C (428 °F)

32 mm

174

EP20K200QC208V

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

Yes

2.625 V

2.5

Flatpack, Fine Pitch

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 144 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

28 mm

144

EP20K160EFC484-2XN

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

1.93 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 316 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

160 MHz

40 s

260 °C (500 °F)

23 mm

316

EP20K100QC208-1V

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.3 ns

4160

Yes

2.625 V

CMOS

153

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 159 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e3

100 MHz

153

220 °C (428 °F)

28 mm

159

5M240ZT144C4N

Altera

Flash PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

9.5 ns

Yes

1.89 V

192

CMOS

1.8

1.8,1.2/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

114 I/O

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

1.6 mm

20 mm

No

e3

184.1 MHz

20 mm

Yes

114

EP20K200RC208-2V

Altera

Loadable PLD

Other

Gull Wing

208

HFQFP

Square

Plastic/Epoxy

0.4 ns

8320

Yes

2.625 V

CMOS

138

2.5

2.5,2.5/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 144 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G208

4.1 mm

28 mm

No

e3

34 MHz

138

220 °C (428 °F)

28 mm

144

EP20K60ETC144-1X-1

Altera

Loadable PLD

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Flatpack, Low Profile, Fine Pitch

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 92 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

1.6 mm

20 mm

No

e3

20 mm

92

EP20K100RC240-1V

Altera

Loadable PLD

Other

Gull Wing

240

HFQFP

Square

Plastic/Epoxy

0.3 ns

4160

Yes

2.625 V

CMOS

183

2.5

2.5,2.5/3.3 V

Flatpack, Heat Sink/Slug, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 189 I/O

4

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

4.1 mm

32 mm

No

e3

100 MHz

183

220 °C (428 °F)

32 mm

189

EP20K60EFC324-3X

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

3.56 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 196 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e1

160 MHz

220 °C (428 °F)

19 mm

196

EP20K400EFC672-2XN

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.83 ns

Yes

1.89 V

CMOS

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 488 I/O

4

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B672

3

3.5 mm

27 mm

No

e1

160 MHz

40 s

245 °C (473 °F)

27 mm

488

EP2A70B724C7N

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

2.17 ns

Yes

1.575 V

CMOS

1.5

Grid Array

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

536 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e1

35 mm

536

EP20K200CQ208C7

Altera

Loadable PLD

Other

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1.48 ns

8320

Yes

1.89 V

CMOS

128

1.8

1.8,1.8/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

1.71 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 136 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

128

220 °C (428 °F)

28 mm

136

EP20K30EFC672-2

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 128 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

2.1 mm

27 mm

No

e1

160 MHz

27 mm

128

EP20K400GC655-2

Altera

Loadable PLD

Other

Pin/Peg

655

PGA

Square

Ceramic, Metal-Sealed Cofired

3.1 ns

16640

No

2.625 V

CMOS

496

2.5

2.5,2.5/3.3 V

Grid Array

SPGA655,47X47

Field Programmable Gate Arrays

Macrocell

2.375 V

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 502 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P655

1

4.08 mm

62.484 mm

No

e0

496

220 °C (428 °F)

62.484 mm

502

EP20K600EFC672-1XN

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.57 ns

24320

Yes

1.89 V

CMOS

500

1.8

1.8,1.8/3.3 V

Grid Array

BGA672,26X26,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B672

4

3.5 mm

27 mm

No

e1

160 MHz

30 s

500

245 °C (473 °F)

27 mm

508

EP20K60EFC144-1X

Altera

Loadable PLD

Other

Ball

144

LBGA

Square

Plastic/Epoxy

1.72 ns

2560

Yes

1.89 V

CMOS

85

1.8

1.8,1.8/3.3 V

Grid Array, Low Profile

BGA144,12X12,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 93 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.7 mm

13 mm

No

e0

160 MHz

20 s

85

235 °C (455 °F)

13 mm

93

EP20K200QC240-2

Altera

Loadable PLD

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

8320

Yes

2.625 V

CMOS

168

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Macrocell

2.375 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 174 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

168

220 °C (428 °F)

32 mm

174

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.