24 Programmable Logic Devices (PLD) 1,181

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
8412908LX	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No	5.5 V		TTL				5			In-Line				Mixed	4.5 V		2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-PDIP-T24	4.064 mm	7.62 mm				15.4 MHz		30.378 mm		6
PAL20L8-5NC	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	5.5 ns	No	5.25 V		TTL				5			In-Line				Combinatorial	4.75 V		2.54 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)		Dual	R-PDIP-T24	5.08 mm	7.62 mm				111 MHz		31.915 mm		6
TICPAL22V10Z-30INT	Texas Instruments	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No	5.5 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDIP-T24	5.08 mm	7.62 mm	No	PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock		23.8 MHz	10	31.64 mm		10
5962-8605303LA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		TTL	MIL-STD-883	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24	5.08 mm	7.62 mm	No	PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock		25 MHz	10	32.005 mm		10
TIBPAL20R8-7CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V		TTL		12	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDIP-T24	5.08 mm	7.62 mm	No	Register Preload; Power-Up Reset	e4	74 MHz	8	31.64 mm		0
TIEPAL10H16ET6CJT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed		No	5.25 V		ECL10K		10	PAL-TYPE	5		5,-5.2 V	In-Line	DIP24,.3	Programmable Logic Devices		Latched	4.75 V	48	2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 0 I/O	10	0 °C (32 °F)		Dual	R-GDIP-T24			No				6			0
5962-8767103LX	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		TTL	MIL-STD-883			5			In-Line				Mixed	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24			No			28.5 MHz				2
TIBPAL22VP10-25MWB	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	25 ns	Yes	5.5 V		TTL	MIL-STD-883	22	PAL-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices		Macrocell	4.5 V	120	1.27 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDFP-F24	2.29 mm	9.085 mm	No	PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock		25 MHz	10	14.355 mm		10
TIBPAL22V10-35CNT	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	40 ns	No			TTL		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24			No			18 MHz	10
5962-8767103LA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		TTL	MIL-STD-883	14	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24	5.08 mm	7.62 mm	No			28.5 MHz	8	32.005 mm		2
TIBPAL20L8-7MJTB	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	7 ns	No			TTL	38535Q/M;38534H;883B	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No				8
EP610DC-30	Texas Instruments	UV PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic, Metal-Sealed Cofired	32 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Dual	R-CDIP-T24			No	Zero Standby Function; 16 Macrocells With Configurable I/O		33.3 MHz	16			16
TIBPAL20L8-25CJT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		TTL		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.75 V	64	2.54 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)		Dual	R-GDIP-T24			No				8			6
PAL22V10Z-25CJTL	Texas Instruments	UV PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V	10	CMOS		22	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T24	5.08 mm	7.62 mm	No	PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock	e0	31.2 MHz	10	32.005 mm	No	10
TIEPAL10016ET6CJT	Texas Instruments	OT PLD	Other	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	6 ns	No	5.5 V		ECL100K		10	PAL-TYPE	5		5,-5.2 V	In-Line	DIP24,.3	Programmable Logic Devices		Latched	4.5 V	48	2.54 mm	85 °C (185 °F)	10 Dedicated Inputs, 0 I/O	10	0 °C (32 °F)		Dual	R-GDIP-T24			No				6			0
TIBPAL20R4-10MJT	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	12 ns	No	5.5 V		TTL		16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24			No	Register Preload; Power-Up Reset		50 MHz	8			4
5962-01-357-3163	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			TTL		12	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24			No			30 MHz	8
5962-8767119LX	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V		TTL	MIL-STD-883			5			In-Line				Registered	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24			No			74 MHz				0
TIBPAL22V10AM30JT	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No			TTL		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No			22 MHz	10
TIBPAL20X10MJTB	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL	38535Q/M;38534H;883B	10	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				40	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No			25 MHz	10
PAL20R4A-2MJW	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL		16	PAL-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No			18 MHz	8
TIBPAL20R8-25CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		TTL		12	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDIP-T24	5.08 mm	7.62 mm	No	Register Preload; Power-Up Reset	e4	25 MHz	8	31.64 mm		0
TIBPAL20L8-15CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	18 ns	No	5.25 V		TTL		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.75 V	64	2.54 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDIP-T24	5.08 mm	7.62 mm	No		e4	37 MHz	8	31.64 mm		6
SNC54LS336W	Texas Instruments	EE PLD	Military	Flat	24	DFP	Rectangular	Ceramic		Yes			TTL	MIL-STD-883 Class B (Modified)	12	PLA-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices				32	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F24			No				6
TIBPAL22V10-10MJT	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	11 ns	No	5.5 V		Bipolar				5			In-Line				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24			No	PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock		71 MHz				10
SN54LS333W	Texas Instruments	EE PLD	Military	Flat	24	DFP	Rectangular	Ceramic		Yes			TTL		12	PLS-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices				32	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F24			No				6
5962-8767101KA	Texas Instruments	OT PLD	Military	Flat	24	DFP	Rectangular	Ceramic, Glass-Sealed	25 ns	Yes	5.25 V		TTL	MIL-STD-883	20	PAL-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices		Combinatorial	4.75 V	64	1.27 mm	125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)		Dual	R-GDFP-F24	2.29 mm	9.085 mm	No			28.5 MHz	8	14.355 mm		6
5962-8767118LX	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V		TTL	MIL-STD-883			5			In-Line				Mixed	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24			No			50 MHz				4
TIBPAL20L8-5CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7 ns	No	5.25 V		TTL		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.75 V	64	2.54 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)	Nickel Palladium Gold	Dual	R-PDIP-T24	5.08 mm	7.62 mm	No	Register Preload; Power-Up Reset	e4	111 MHz	8	31.64 mm		6
TIBPAL20L10-30CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No	5.25 V		TTL		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.75 V	40	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24			No				10			8
SN74LS336J	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL		12	PLA-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24			No				6
SN74LS334J4	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL		12	PLA-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24							6
5962-8605304LX	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		TTL	MIL-STD-883			5			In-Line				Macrocell	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)		Dual	R-GDIP-T24			No			33.3 MHz				10
M38510/50501BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.25 V		Bipolar	MIL-M-38510 Class B	20	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Combinatorial	4.75 V	64	2.54 mm	125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24	5.08 mm	6.92 mm	Yes		e0	40 MHz	8	32 mm	No	6
SN74LS335J	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL		12	PLS-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24			No				6
TIBPAL20X8-25MWB	Texas Instruments	EE PLD	Military	Flat	24	DFP	Rectangular	Ceramic		Yes			TTL	38535Q/M;38534H;883B	12	PAL-TYPE	5		5 V	Flatpack	FL24,.4	Programmable Logic Devices				40	1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDFP-F24			No			25 MHz	10
5962-01-279-5563	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL	38535Q/M;38534H;883B	12	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				40	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No			25 MHz	10
TIBPALR19R8MJWB	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL	38535Q/M;38534H;883B	19	PAL-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No				8
TIBPAL20X4-25MJT	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		TTL		16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.5 V	40	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)		Dual	R-GDIP-T24			No	Power-Up Reset; 1 External Clock; Register Preload		25 MHz	10			6
SN74LS335N3	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			TTL		12	PLS-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24							6
SN74LS334J	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL		12	PLA-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24			No				6
TIBPALR19R4CJW	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		TTL		19	PAL-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	70 °C (158 °F)	0 Dedicated Inputs, 4 I/O	0	0 °C (32 °F)		Dual	R-GDIP-T24			No	1 External Clock; Register Preload		30 MHz	8			4
SNC54LS333J	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL	MIL-STD-883 Class B (Modified)	12	PLS-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No				6
EP630-15CNT	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	17 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Dual	R-PDIP-T24			No	16 Macrocells; 2 External Clocks; Asynchronous Clocks		47.6 MHz	16			16
SNJ54LS336J	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No			TTL	38535Q/M;38534H;883B	12	PLA-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No				6
TIBPAL20SP8-20CJT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V		TTL		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.75 V	64	2.54 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)		Dual	R-GDIP-T24			No				8			6
5962-01-284-1531	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No			TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No			28.5 MHz	8
TIBPAL20R4-20MJTB	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Mixed	4.75 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24	5.08 mm	7.62 mm	No		e0	40 MHz	8	32.005 mm	No	4

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.