24 Programmable Logic Devices (PLD) 1,181

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

TIBPALR19L8CNT

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

TTL

19

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.75 V

64

2.54 mm

70 °C (158 °F)

2 Dedicated Inputs, 6 I/O

2

0 °C (32 °F)

Dual

R-PDIP-T24

No

8

6

TIBPAL20R4-20MJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.25 V

TTL

16

PAL-TYPE

5

Tube

5 V

In-Line

DIP24,.3

Programmable Logic Devices

No

Mixed

4.75 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 4 I/O

12

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

Register Preload; Power-Up Reset

e0

40 MHz

8

32.005 mm

No

4

TIBPAL20R4-10CJT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.25 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 4 I/O

12

0 °C (32 °F)

Dual

R-GDIP-T24

No

Register Preload; Power-Up Reset

55.5 MHz

8

4

SNC54LS335J

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

MIL-STD-883 Class B (Modified)

12

PLS-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

M38510/50801BLX

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

30 ns

No

5.5 V

CMOS

MIL-M-38510 Class B

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

25 MHz

10

TIBPSG507ACJT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.25 V

TTL

13

PLS-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

80

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

F_Max for 6-bit couner CNT_/HLD0 application = 33 MHz; Programmable sequence generator

45 MHz

8

32.005 mm

0

PAL20R8AMJWB

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

20 MHz

8

TIBPAL20R6-7CNT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

9 ns

No

5.25 V

TTL

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 2 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

5.08 mm

7.62 mm

No

Register Preload; Power-Up Reset

74 MHz

8

31.64 mm

2

TIBPAL20SP8-30MJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

14 Dedicated Inputs, 6 I/O

14

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

8

6

EP630-25MJTB

Texas Instruments

UV PLD

Military

Through-Hole

24

WDIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

38535Q/M;38534H;883B

20

PAL-TYPE

5

5 V

In-Line, Window

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

160

2.54 mm

125 °C (257 °F)

4 Dedicated Inputs, 16 I/O

4

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

40 MHz

16

32.005 mm

16

EP630-20CJT

Texas Instruments

UV PLD

Commercial

Through-Hole

24

WDIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.25 V

CMOS

20

PAL-TYPE

5

5 V

In-Line, Window

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

160

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 16 I/O

4

0 °C (32 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

50 MHz

16

32.005 mm

16

TIBPAL22V10-20MJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

33.3 MHz

10

10

5962-8767117KA

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

Ceramic, Glass-Sealed

10 ns

Yes

5.5 V

TTL

MIL-STD-883

20

PAL-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Dual

R-GDFP-F24

2.29 mm

9.085 mm

No

50 MHz

6

14.355 mm

2

TIBPAL20R8-25CNT3

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

25 MHz

8

82S167AMJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

14

PLS-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

48

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

6

EP630-25INT

Texas Instruments

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

27 ns

No

5.5 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

160

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 16 I/O

4

-40 °C (-40 °F)

Dual

R-PDIP-T24

No

16 Macrocells; 2 External Clocks; Asynchronous Clocks

28.6 MHz

16

16

TIBPAL20L10-25MJTB

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

25 ns

No

TTL

38535Q/M;38534H;883B

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

10

TIBPAL20R4-30MJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 4 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

25 MHz

8

4

EP610PI-40

Texas Instruments

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

40 ns

No

5.5 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

160

2.54 mm

85 °C (185 °F)

4 Dedicated Inputs, 16 I/O

4

-40 °C (-40 °F)

Dual

R-PDIP-T24

No

Zero Standby Function; 16 Macrocells With Configurable I/O

16

16

PAL20R4A-2CJW

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

No

18 MHz

8

TIBPAL20R8-15CNT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

4.75 V

64

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDIP-T24

5.08 mm

7.62 mm

No

Register Preload; Power-Up Reset

e4

37 MHz

8

31.64 mm

0

TIBPAL20X10-25MJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

10

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

4.5 V

40

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 0 I/O

10

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

Power-Up Reset; 1 External Clock; Register Preload

25 MHz

10

0

M38510/50804BKX

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

15 ns

Yes

5.5 V

CMOS

MIL-M-38510 Class B

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

50 MHz

10

TIBPAL20L10-25MJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.5 V

40

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 8 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

10

8

EP610DC-25

Texas Instruments

UV PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

27 ns

No

5.25 V

CMOS

20

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

160

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 16 I/O

4

0 °C (32 °F)

Dual

R-CDIP-T24

No

Zero Standby Function; 16 Macrocells With Configurable I/O

40 MHz

16

16

TIBPAL20L10-25MWB

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

25 ns

Yes

TTL

38535Q/M;38534H;883B

20

PAL-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

Combinatorial

40

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

10

5962-8767117LA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

TTL

MIL-STD-883

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

12 Dedicated Inputs, 2 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

50 MHz

8

32.005 mm

2

TIBPAL20R6-7CJT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

9 ns

No

5.25 V

TTL

14

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Mixed

4.75 V

64

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 2 I/O

12

0 °C (32 °F)

Dual

R-GDIP-T24

No

Register Preload; Power-Up Reset

74 MHz

8

2

TIBPAL22V10-20MJTB

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

MIL-PRF-38535

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

33.3 MHz

10

32.005 mm

10

TIBPAL20R8-30MJTB

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

25 MHz

8

SN74LS334NP3

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

6

TIBPAL20R8-10CJT

Texas Instruments

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.25 V

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

4.75 V

64

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Dual

R-GDIP-T24

No

Register Preload; Power-Up Reset

55.5 MHz

8

0

TIBPAL20R4-25CNT3

Texas Instruments

OT PLD

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

25 ns

No

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Registered

64

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

25 MHz

8

5962-8605303LX

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

MIL-STD-883

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

25 MHz

10

TIBPALT19R4MJW

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

19

PAL-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

0 Dedicated Inputs, 4 I/O

0

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

1 External Clock; Register Preload

20 MHz

8

4

PAL20R8A-2MJW

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PAL-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

Registered

64

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

18 MHz

8

TICPAL22V10Z-35NT

Texas Instruments

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

45 ns

No

CMOS

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

132

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T24

No

20 MHz

10

5962-8605304LA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

MIL-STD-883

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

33.3 MHz

10

32.005 mm

10

5962-8605304KA

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

Ceramic, Glass-Sealed

20 ns

Yes

5.5 V

TTL

MIL-STD-883

22

PAL-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

Macrocell

4.5 V

132

1.27 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDFP-F24

2.29 mm

9.085 mm

Yes

33.3 MHz

10

14.355 mm

10

SNC54LS334W

Texas Instruments

EE PLD

Military

Flat

24

DFP

Rectangular

Ceramic

Yes

TTL

MIL-STD-883 Class B (Modified)

12

PLA-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

32

1.27 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

6

8412908LA

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

35 ns

No

5.5 V

TTL

5

In-Line

Mixed

4.5 V

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Dual

R-PDIP-T24

4.064 mm

7.62 mm

15.4 MHz

30.378 mm

6

F20X4-25MJT

Texas Instruments

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

16

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

40

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

No

25 MHz

10

5962-8767102KA

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

Ceramic, Glass-Sealed

20 ns

Yes

5.25 V

TTL

MIL-STD-883

12

PAL-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

Registered

4.75 V

64

1.27 mm

125 °C (257 °F)

12 Dedicated Inputs, 0 I/O

12

-55 °C (-67 °F)

Dual

R-GDFP-F24

2.29 mm

9.085 mm

No

28.5 MHz

8

14.355 mm

0

TIBPALR19R6MJW

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

19

PAL-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

0 Dedicated Inputs, 2 I/O

0

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

1 External Clock; Register Preload

20 MHz

8

2

TIBPAL22V10AMJT

Texas Instruments

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

22

PAL-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.5 V

132

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

22 MHz

10

32.005 mm

10

SN74LS334JP4

Texas Instruments

EE PLD

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic

No

TTL

12

PLA-TYPE

5

5 V

In-Line

DIP24,.6

Programmable Logic Devices

32

2.54 mm

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T24

6

M38510/50801BKX

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

30 ns

Yes

5.5 V

CMOS

MIL-M-38510 Class B

5

Flatpack

Combinatorial

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-XDFP-F24

No

25 MHz

10

5962-8605303KA

Texas Instruments

OT PLD

Military

Flat

24

DFP

Rectangular

Ceramic, Glass-Sealed

25 ns

Yes

5.5 V

TTL

MIL-STD-883

22

PAL-TYPE

5

5 V

Flatpack

FL24,.4

Programmable Logic Devices

Macrocell

4.5 V

132

1.27 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDFP-F24

2.29 mm

9.085 mm

Yes

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

25 MHz

10

14.355 mm

10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.