24 Programmable Logic Devices (PLD) 1,181

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
8412904LA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V	TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Mixed	4.75 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24	5.08 mm	7.62 mm	Yes		e0	40 MHz	8	32.005 mm	No	4
TIBPAL20X4MJTB	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				40	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No			25 MHz	10
SN74LS333J	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL		12	PLS-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24			No				6
SN74LS335NP3	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No		TTL		12	PLS-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24							6
TIBPAL20L8-7CNT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	9 ns	No	5.25 V	TTL		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.75 V	64	2.54 mm	75 °C (167 °F)	14 Dedicated Inputs, 6 I/O	14	0 °C (32 °F)		Dual	R-PDIP-T24	5.08 mm	7.62 mm	No			74 MHz	8	31.64 mm		6
TIBPAL20R6-20MJT	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V	TTL		14	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24	5.08 mm	7.62 mm	No	Register Preload; Power-Up Reset		28.5 MHz	8	32.005 mm		2
TIBPAL20X8-30CJT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.25 V	TTL				5			In-Line				Mixed	4.75 V			75 °C (167 °F)	10 Dedicated Inputs, 2 I/O	10	0 °C (32 °F)		Dual	R-GDIP-T24			No	Power-Up Reset; 1 External Clock; Register Preload		22.2 MHz				2
TIBPAL20R4-15CJT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	18 ns	No	5.25 V	TTL		16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Dual	R-GDIP-T24			No	Register Preload; Power-Up Reset		37 MHz	8			4
TIBPAL20X10CNT	Texas Instruments	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No		TTL		10	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24			No			35 MHz	10
5962-8767106LA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed		No	5.5 V	Bipolar	MIL-STD-883			5			In-Line				Combinatorial	4.5 V			125 °C (257 °F)	12 Dedicated Inputs	12	-55 °C (-67 °F)		Dual	R-GDIP-T24			No
TIBPAL20L10-30CJT	Texas Instruments	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.25 V	TTL		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial	4.75 V	40	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)		Dual	R-GDIP-T24			No				10			8
SNJ54LS333J	Texas Instruments	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		TTL	38535Q/M;38534H;883B	12	PLS-TYPE	5		5 V	In-Line	DIP24,.6	Programmable Logic Devices				32	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24			No				6
GAL20V8-35QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	18.1 MHz	8
GAL39V18-15HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	67 MHz	10
GAL20V8-30HF2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	22.2 MHz	8
GAL39V18-20HF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	50 MHz	10
GAL39V18-20QD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	50 MHz	10
GAL20V8S-20QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	33.3 MHz	8
GAL39V18-30QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	33 MHz	10
GAL20V8-35QD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	18.1 MHz	8
GAL39V18-25QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	40 MHz	10
GAL39V18-35HF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	29 MHz	10
GAL20V8-25HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL20V8-20QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	33.3 MHz	8
GAL39V18-20QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	50 MHz	10
GAL39V18-30HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	33 MHz	10
GAL20V8S-20QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	33.3 MHz	8
GAL39V18-25HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	40 MHz	10
GAL20V8-20HF2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	33.3 MHz	8
GAL20V8AS-25QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL20V8S-25HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL20V8AS-20QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V	CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8			8
GAL20V8-35QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	18.1 MHz	8
GAL39V18-20HD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	50 MHz	10
GAL20V8S-25QB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	28.5 MHz	8
GAL20V8AS-10HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	58.8 MHz	8			8
GAL39V18-15QD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	67 MHz	10
GAL20V8-30HD2	STMicroelectronics	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	22.2 MHz	8
GAL20V8AS-15QB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8			8
GAL20V8AS-12HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	12 ns	No	5.25 V	CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	48.5 MHz	8			8
GAL20V8-15HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	41.6 MHz	8
GAL39V18-35HB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			No		e0	29 MHz	10
GAL20V8AS-20HB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.5 V	CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8			8
GAL39V18-35QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	29 MHz	10
GAL20V8S-20EB1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No	5.25 V	CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	33.3 MHz	8			8
GAL20V8-20QF1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	33.3 MHz	8
GAL39V18-30QD1	STMicroelectronics	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No		CMOS		20	PLS-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				75	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24			No		e0	33 MHz	10
GAL20V8AS-15EB3	STMicroelectronics	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	4.7 mm	7.62 mm	No	Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset	e0	41.6 MHz	8			8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.