24 Programmable Logic Devices (PLD) 1,181

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

P3Z22V10IBDH

NXP Semiconductors

EE PLD

Industrial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

15 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Thin Profile, Shrink Pitch

Macrocell

3 V

.65 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Dual

R-PDSO-G24

1.1 mm

4.4 mm

No

65 MHz

7.8 mm

10

P3Z22V10-BDH

NXP Semiconductors

EE PLD

Commercial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

15 ns

Yes

3.6 V

CMOS

3.3

Small Outline, Thin Profile, Shrink Pitch

Macrocell

3 V

.65 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

1.1 mm

4.4 mm

No

69 MHz

7.8 mm

10

PLS167AN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

14 Dedicated Inputs, 0 I/O

14

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

12.5 MHz

31.7 mm

0

P3Z22V10IBD

NXP Semiconductors

EE PLD

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

15 ns

Yes

3.6 V

CMOS

3.3

Small Outline

Macrocell

3 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

65 MHz

15.4 mm

10

LVT22V10-BD-T

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

15 ns

Yes

3.6 V

BICMOS

3.3

Small Outline

Macrocell

3 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

50 MHz

15.4 mm

10

PL22V10I15N

NXP Semiconductors

EE PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

50 MHz

31.7 mm

10

PLHS473/BLA

NXP Semiconductors

OT PLD

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

20 ns

No

Bipolar

In-Line

11 Dedicated Inputs, 9 I/O

11

Dual

R-CDIP-T24

No

9

5962-9176007MLA

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.25 V

BICMOS

MIL-STD-883 Class B

5

In-Line

Macrocell

4.75 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

55 MHz

10

PLQ20L8-5N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8 ns

No

5.25 V

BICMOS

5

In-Line

Combinatorial

4.75 V

75 °C (167 °F)

14 Dedicated Inputs, 6 I/O

14

0 °C (32 °F)

Dual

R-PDIP-T24

No

6

PLC42VA12IFA

NXP Semiconductors

UV PLD

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

55 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

85 °C (185 °F)

8 Dedicated Inputs, 12 I/O

8

-40 °C (-40 °F)

Dual

R-GDIP-T24

No

Programmable Multi-Function Pld; Register Preload; Shared Input/Clock

14.9 MHz

12

PLS168N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 0 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

9.8 MHz

31.7 mm

0

PL22V10I15D

NXP Semiconductors

EE PLD

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.5 V

CMOS

5

Small Outline

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

50 MHz

15.4 mm

10

PLS167N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

30 ns

No

5.25 V

TTL

5

In-Line

Registered

4.75 V

2.54 mm

75 °C (167 °F)

14 Dedicated Inputs, 0 I/O

14

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

9.8 MHz

31.7 mm

0

PLUS173-10N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Combinatorial

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 10 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Output Polarity

31.7 mm

10

PLC42VA12N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

55 ns

No

5.25 V

CMOS

42

PLS-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

105

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 12 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T24

1

4.7 mm

7.62 mm

No

Programmable Multi-Function Pld; 1 External Clock; Shared Input/Clock; Register Preload

14.9 MHz

12

31.7 mm

12

P3Q22V10-7N

NXP Semiconductors

OT PLD

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

3.6 V

BICMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

11 Dedicated Inputs, 10 I/O

11

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock 5 V compatible inputs & I/O; Register preload

105 MHz

31.7 mm

10

PLC42VA12IN

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

55 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

85 °C (185 °F)

8 Dedicated Inputs, 12 I/O

8

-40 °C (-40 °F)

Dual

R-PDIP-T24

No

Programmable Multi-Function Pld; Register Preload; Shared Input/Clock

14.9 MHz

12

LVT22V10-DD-T

NXP Semiconductors

OT PLD

Commercial Extended

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

12 ns

Yes

3.6 V

BICMOS

3.3

Small Outline

Macrocell

3 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock

74 MHz

15.4 mm

10

LVT20V8-7N

NXP Semiconductors

OT PLD

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

3.6 V

BICMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

12 Dedicated Inputs, 8 I/O

12

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock

110 MHz

31.7 mm

8

P3Q20V8-7N

NXP Semiconductors

OT PLD

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

3.6 V

BICMOS

3.3

In-Line

Macrocell

3 V

2.54 mm

12 Dedicated Inputs, 9 I/O

12

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

8 Macrocells; 1 External Clock; 5 V compatile Inputs & I/O; Register Preload; Power-up reset

105 MHz

31.7 mm

9

PLUS20L8-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Combinatorial

4.75 V

2.54 mm

75 °C (167 °F)

14 Dedicated Inputs, 6 I/O

14

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

31.7 mm

6

5962-9176007MLX

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

BICMOS

MIL-STD-883

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

55 MHz

10

5962-8850402LA

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

40 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 10 I/O

12

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

No

e0

10

5962-8984102LX

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

31.2 MHz

10

5962-9176011NXX

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

BICMOS

MIL-PRF-38535

5

In-Line

Macrocell

4.75 V

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

55 MHz

10

P5Z22V10-7D

NXP Semiconductors

EE PLD

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

9 ns

Yes

5.25 V

CMOS

5

Small Outline

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

103 MHz

15.4 mm

10

P5Z22V10-DDH

NXP Semiconductors

EE PLD

Commercial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Small Outline, Thin Profile, Shrink Pitch

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

1.1 mm

4.4 mm

No

83 MHz

7.8 mm

10

PLUS20R6DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 2 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Power-Up Reset

60.6 MHz

31.7 mm

2

PLQ22V10-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

9 ns

No

5.25 V

BICMOS

5

In-Line

Macrocell

4.75 V

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDIP-T24

No

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

87 MHz

10

5962-8984105LX

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

50 MHz

10

PL22V10-10N

NXP Semiconductors

EE PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

CMOS

5

In-Line

Macrocell

4.75 V

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

66.6 MHz

31.7 mm

10

5962-8984101LX

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

22 MHz

10

PL22V10-10D

NXP Semiconductors

EE PLD

Commercial Extended

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.25 V

CMOS

5

Small Outline

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

66.6 MHz

15.4 mm

10

10H20EV8-4F

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

4.7 ns

No

ECL

20

PAL-TYPE

-5.2 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

90

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 8 I/O

11

0 °C (32 °F)

Dual

R-GDIP-T24

1

5.08 mm

7.62 mm

No

8 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

204 MHz

8

31.955 mm

8

ABT22V10-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

5.25 V

BICMOS

5

In-Line

Macrocell

4.75 V

2.54 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock

87 MHz

31.7 mm

10

22V10-15/BLA

NXP Semiconductors

EE PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

CMOS

5

In-Line

Macrocell

4.5 V

2.54 mm

125 °C (257 °F)

11 Dedicated Inputs, 10 I/O

11

-55 °C (-67 °F)

Dual

R-GDIP-T24

5.08 mm

7.62 mm

No

50 MHz

10

PLUS20R4-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 4 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Power-Up Reset

74 MHz

31.7 mm

4

5962-9176012NXX

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

BICMOS

MIL-PRF-38535

5

In-Line

Macrocell

4.75 V

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

55 MHz

10

PL22V10-15D

NXP Semiconductors

EE PLD

Commercial Extended

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

5

Small Outline

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

50 MHz

15.4 mm

10

PLUS173DN

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

12 ns

No

5.25 V

TTL

22

PLA-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Combinatorial

4.75 V

42

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 10 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Output Polarity

10

31.7 mm

10

PLUS20R6-7N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

12 Dedicated Inputs, 2 I/O

12

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Power-Up Reset

74 MHz

31.7 mm

2

5962-9176014NXA

NXP Semiconductors

OT PLD

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

5.25 V

BICMOS

MIL-PRF-38535

5

In-Line

Macrocell

4.75 V

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

No

e0

71 MHz

10

PLS179N

NXP Semiconductors

OT PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

35 ns

No

5.25 V

TTL

5

In-Line

Mixed

4.75 V

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 12 I/O

8

0 °C (32 °F)

Dual

R-PDIP-T24

4.7 mm

7.62 mm

No

Programmable Logic Sequencer; 1 External Clock

18.2 MHz

31.7 mm

12

P3Z22V10-DD-T

NXP Semiconductors

EE PLD

Commercial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

3.3

Small Outline

Macrocell

3 V

1.27 mm

70 °C (158 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

83 MHz

15.4 mm

10

PL22V10-12D

NXP Semiconductors

EE PLD

Commercial Extended

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

12 ns

Yes

5.25 V

CMOS

5

Small Outline

Macrocell

4.75 V

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Dual

R-PDSO-G24

2.65 mm

7.5 mm

No

10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset

58.8 MHz

15.4 mm

10

PLC42VA12FA

NXP Semiconductors

UV PLD

Commercial Extended

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

55 ns

No

5.25 V

CMOS

42

PLS-TYPE

5

5 V

In-Line

DIP24,.3

Programmable Logic Devices

Macrocell

4.75 V

105

2.54 mm

75 °C (167 °F)

8 Dedicated Inputs, 12 I/O

8

0 °C (32 °F)

Dual

R-GDIP-T24

1

No

Programmable Multi-Function Pld; 1 External Clock; Shared Input/Clock; Register Preload

14.9 MHz

12

12

P5Z22V10IDDH-T

NXP Semiconductors

EE PLD

Industrial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

11 ns

Yes

5.5 V

CMOS

5

Small Outline, Thin Profile, Shrink Pitch

Macrocell

4.5 V

.65 mm

85 °C (185 °F)

11 Dedicated Inputs, 10 I/O

11

-40 °C (-40 °F)

Dual

R-PDSO-G24

1.1 mm

4.4 mm

No

74 MHz

7.8 mm

10

5962-8850402LX

NXP Semiconductors

OT PLD

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

40 ns

No

5.5 V

Bipolar

MIL-STD-883

5

In-Line

Combinatorial

4.5 V

125 °C (257 °F)

12 Dedicated Inputs, 10 I/O

12

-55 °C (-67 °F)

Dual

R-GDIP-T24

No

10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.