24 Programmable Logic Devices (PLD) 1,181

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
CPL20L8-25DC	Samsung		Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes		CMOS		12	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Combinatorial		72	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24	3			No		e0		8
CPL20R6L35DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes		CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			16.5 MHz	8
CPL20R8L35WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Registered			2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24				No			18 MHz	8
CPL20L10L-20NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial		40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0		10
CPL20L8-35DC	Samsung		Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	35 ns	Yes		CMOS		12	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Combinatorial		72	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24	3			No		e0		8
CPL20L8-35WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	40 ns	No		CMOS		12	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial		72	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		8
CPL20R8L35WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	40 ns	No		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Registered			2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			16.5 MHz	8
CPL20L10L-25NI	Samsung		Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial		40	2.54 mm	105 °C (221 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0		10
CPL20R8L35DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes		CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			16.5 MHz	8
CPL20L10L-15NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial		40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0		10
CPL20L10-25WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial		40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		10
CPL20R4-35DC	Samsung		Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy		Yes		CMOS		16	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Registered		60	1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24	3			No		e0	18 MHz	8
CPL20R8L25DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	30 ns	Yes		CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			22 MHz	8
CPL20L8L25DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	30 ns	Yes		CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Combinatorial			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			22 MHz	8
CPL20L10L35DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	40 ns	Yes		CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Combinatorial			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			16.5 MHz	10
CPL20L8-25WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	25 ns	No		CMOS		12	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial		72	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		8
CPL20V8-20NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0	33.3 MHz	8
CPL20R4-35WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		CMOS		16	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Registered		60	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0	16.5 MHz	8
CPL20R8L35DC	Samsung		Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	35 ns	Yes		CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Registered			1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDSO-G24				No			18 MHz	8
CPL20R8L25DC	Samsung		Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes		CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Registered			1.27 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDSO-G24				No			28.5 MHz	8
CPL20V8L-25WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0	28.5 MHz	8
CPL20R6L35WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Registered			2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-XDIP-T24				No			18 MHz	8
CPL20L10L-30NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	30 ns	No		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Combinatorial		40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0		10
EP600IPC-55	Altera	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V					5		In-Line			Macrocell	4.75 V		2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		3.81 mm	7.62 mm		Seated HGT-NOM	e0	23.3 MHz		220 °C (428 °F)	26.162 mm
EP610ADC-12	Altera		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	12 ns	No		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		160	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24				No		e0	83.3 MHz	16	220 °C (428 °F)
EP610ASI-10	Altera	OT PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	CMOS				5		Small Outline			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks		100 MHz			15.4 mm	16
EP610SI-20T	Altera	OT PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	22 ns	Yes	5.5 V	CMOS				5		Small Outline			Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			55.6 MHz			15.4 mm	16
EP610ASC24-15	Altera	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	16 ns	Yes	5.25 V	CMOS				5		Small Outline			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	16 Macrocells; 2 External Clocks		71.4 MHz			15.4 mm	16
EP610SI-20	Altera	OT PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	22 ns	Yes	5.5 V	CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Macrocell	4.5 V	160	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G24				No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks	e0	55.6 MHz	16	220 °C (428 °F)		16
EP610SC-20	Altera	OT PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	22 ns	Yes	5.25 V	CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Macrocell	4.75 V	160	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24				No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks	e0	55.6 MHz	16	220 °C (428 °F)		16
EP600PI-3	Altera	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	45 ns	No	5.5 V	CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	160	2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			7.62 mm	No	16 Macrocells	e0	26.3 MHz	16	220 °C (428 °F)	26.162 mm	16
5962-8753905LA	Altera	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V	CMOS	MIL-STD-883 Class B			5		In-Line, Window			Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms	e0	50 MHz			32 mm	10
EP610ASC-10	Altera	OT PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Macrocell	4.75 V	160	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks	e0	100 MHz	16	220 °C (428 °F)	15.4 mm	16
EP600PC-3	Altera	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	45 ns	No	5.25 V	CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			7.62 mm	No	16 Macrocells	e0	26.3 MHz	16	220 °C (428 °F)	26.162 mm	16
EP610SC-15T	Altera	OT PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	17 ns	Yes	5.25 V	CMOS		20	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Macrocell	4.75 V	160	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks	e0	71.4 MHz	16	220 °C (428 °F)	15.4 mm	16
EP22V10EDC-15	Altera	UV PLD	Commercial	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.25 V	CMOS		22	PAL-TYPE	5	5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock	e0	64.5 MHz	10	220 °C (428 °F)	32 mm	10
EP610APC-12	Altera	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	12 ns	No	5.25 V	CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.318 mm	7.62 mm	No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks	e0	83.3 MHz	16	220 °C (428 °F)	31.6865 mm	16
EP610PI24-20	Altera	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	22 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)		Dual	R-PDIP-T24		4.318 mm	7.62 mm	No	16 Macrocells; 2 External Clocks		62.5 MHz			31.6865 mm	16
EP630PC-20	Altera	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	22 ns	No	5.25 V	CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.318 mm	7.62 mm	No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks	e0	55.5 MHz	16	220 °C (428 °F)	31.6865 mm	16
EP610DC24-30	Altera	UV PLD	Commercial	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	32 ns	No	5.25 V	CMOS		20	PAL-TYPE	5	5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	16 Macrocells; 2 External Clocks	e0	41.7 MHz	16	220 °C (428 °F)	32 mm	16
EP610IDC24-10	Altera	UV PLD	Commercial	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.25 V	CMOS		20	PAL-TYPE	5	5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	16 Macrocells; 2 External Clocks	e0	125 MHz	16	220 °C (428 °F)	32 mm	16
EP224PC-10A	Altera	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	72	2.54 mm	70 °C (158 °F)	13 Dedicated Inputs, 8 I/O	13	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.318 mm	7.62 mm	No	8 Macrocells	e0	111 MHz	8	220 °C (428 °F)	31.6865 mm	8
EP610PM24-35	Altera	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	37 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	4 Dedicated Inputs, 16 I/O	4	-55 °C (-67 °F)		Dual	R-PDIP-T24		4.318 mm	7.62 mm	No	16 Macrocells; 2 External Clocks		28.6 MHz			31.6865 mm	16
EP610PI24-35	Altera	OT PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	37 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	4 Dedicated Inputs, 16 I/O	4	-40 °C (-40 °F)		Dual	R-PDIP-T24		4.318 mm	7.62 mm	No	16 Macrocells; 2 External Clocks		37 MHz			31.6865 mm	16
EP600IPI-55	Altera		Industrial	Through-Hole	24	DIP	Rectangular	Plastic	55 ns	No		CMOS		20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		160	2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24				No		e0	18.2 MHz	16	220 °C (428 °F)
EP610DM883B	Altera		Military	Through-Hole	24	DIP	Rectangular	Ceramic	37 ns	No		CMOS	38535Q/M;38534H;883B	20	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		160	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24				No		e0	28.6 MHz	16	220 °C (428 °F)
EP610DM883B-35	Altera	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	37 ns	No	5.5 V	CMOS			PAL-TYPE	5		In-Line, Window			Macrocell	4.5 V		2.54 mm	125 °C (257 °F)	4 Dedicated Inputs, 16 I/O	4	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks	e0	28.5 MHz			32 mm	16
EP600DC-3	Altera	UV PLD	Commercial	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	45 ns	No	5.25 V	CMOS		20	PAL-TYPE	5	5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	160	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 16 I/O	4	0 °C (32 °F)	Tin Lead	Dual	R-GDIP-T24		4.826 mm	7.62 mm	No	16 Macrocells	e0	26.3 MHz	16	220 °C (428 °F)	31.9405 mm	16

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.