24 Programmable Logic Devices (PLD) 1,181

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length	JTAG Boundary Scan Test	No. of I/O Lines
PEEL22CV10AT-25	Diodes Incorporated	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V		CMOS	22	PAL-TYPE	5		5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	4.75 V	132	.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24		1.1 mm	4.4 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz	10	7.8 mm		10
XCR22LV10-15VO24C	Xilinx	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS	22	PAL-TYPE	3.3		3.3 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	3 V	132	.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24	1	1.2 mm	4.4 mm	No		e0	95 MHz	10	7.8 mm		10
XCR22LV10-15SO24I	Xilinx	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS			3.3			Small Outline				Macrocell	3 V		1.27 mm	85 °C (185 °F)	10 Dedicated Inputs, 10 I/O	10	-40 °C (-40 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			167 MHz		15.4 mm		10
XCR22LV10-15VO24I	Xilinx	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS	22	PAL-TYPE	3.3		3.3 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	3 V	132	.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24	1	1.2 mm	4.4 mm	No			65 MHz	10	7.8 mm		10
XCR22LV10-10VO24C	Xilinx	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	3.6 V		CMOS	22	PAL-TYPE	3.3		3.3 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices		Macrocell	3 V	132	.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24	1	1.2 mm	4.4 mm	No		e0	125 MHz	10	7.8 mm		10
XCR22V10-10VO24C	Xilinx	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS			5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.2 mm	4.4 mm	No			83 MHz		7.8 mm		10
XCR22LV10-10SO24C	Xilinx	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	3.6 V		CMOS			3.3			Small Outline				Macrocell	3 V		1.27 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			125 MHz		15.4 mm		10
XCR22LV10-15SO24C	Xilinx	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V		CMOS			3.3			Small Outline				Macrocell	3 V		1.27 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			95 MHz		15.4 mm		10
XCR22V10-7VO24C	Xilinx	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS			5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.2 mm	4.4 mm	No			103 MHz		7.8 mm		10
XCR22V10-10SO24I	Xilinx	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS			5			Small Outline				Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			74 MHz		15.4 mm		10
XCR22V10-10VO24I	Xilinx	EE PLD	Industrial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V		CMOS			5			Small Outline, Thin Profile, Shrink Pitch				Macrocell	4.5 V		.65 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		1.2 mm	4.4 mm	No			74 MHz		7.8 mm		10
XCR22V10-10SO24C	Xilinx	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V		CMOS			5			Small Outline				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			83 MHz		15.4 mm		10
XCR22V10-7SO24C	Xilinx	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V		CMOS			5			Small Outline				Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			103 MHz		15.4 mm		10
TC9804P	Toshiba	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V	16	CMOS	22	PLA-TYPE	5			In-Line				Macrocell	2 V		2.54 mm	85 °C (185 °F)	2 Dedicated Inputs, 16 I/O	2	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		4.45 mm	7.62 mm	No	16 Macrocells; 4 External Clocks; Shared Input/Clock; Set/Reset In Asynchronous Enable	e0	12 MHz	16	29.8 mm		16
TC9805P	Toshiba	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	55 ns	No	5.25 V	16	CMOS	22	PLA-TYPE	5			In-Line				Macrocell	4.75 V		2.54 mm	85 °C (185 °F)	2 Dedicated Inputs, 16 I/O	2	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24		4.45 mm	7.62 mm	No	16 Macrocells; 4 External Clocks; Shared Input/Clock; Set/Reset In Asynchronous Enable	e0	12 MHz	16	29.8 mm		16
SLG47004VTR	Renesas Electronics	OT PLD		No Lead	24	VQCCN	Square			Yes	5.5 V	20		8	PLA-TYPE	2.5	Box, Tape and Reel, 13 in		Chip Carrier, Very Thin Profile	LCC24,.12SQ,16		Yes	Macrocell	2.4 V		.4 mm	85 °C (185 °F)	1 Dedicated Inputs, 7 I/O	1	-40 °C (-40 °F)		Quad	S-XQCC-N24	1	.6 mm	3 mm					7	3 mm	No	7
PLX464I-45	Broadcom		Industrial	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				88	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin/Lead	Dual	R-XDIP-T24				No		e0	15 MHz	8			8
PLX448P-45	Broadcom	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	45 ns	No	5.25 V	8	CMOS	26	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	88	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.699 mm	7.62 mm	No	PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock	e0	16.7 MHz	8	31.75 mm		8
PLX448I-55	Broadcom		Industrial	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				88	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin/Lead	Dual	R-XDIP-T24				No		e0		8			8
PLX464-45	Broadcom		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				88	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin/Lead	Dual	R-XDIP-T24				No		e0	15 MHz	8			8
PLX464M-55	Broadcom		Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				88	2.54 mm	125 °C (257 °F)	9 Dedicated Inputs, 8 I/O	9	-55 °C (-67 °F)	Tin/Lead	Dual	R-XDIP-T24			7.98 mm	No		e0		8	31.14 mm		8
PLX464-25	Broadcom		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				88	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin/Lead	Dual	R-XDIP-T24				No		e0	28.5 MHz	8			8
PLX464I-55	Broadcom		Industrial	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				88	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin/Lead	Dual	R-XDIP-T24				No		e0		8			8
PLX448M-65	Broadcom	UV PLD	Military	Through-Hole	24	WDIP	Rectangular	Ceramic, Glass-Sealed	65 ns	No	5.5 V	8	CMOS	26	PAL-TYPE	5		5 V	In-Line, Window	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	88	2.54 mm	125 °C (257 °F)	9 Dedicated Inputs, 8 I/O	9	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.3 mm	7.62 mm	No	PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock	e0	11.1 MHz	8	32.2 mm		8
PLX464P-45	Broadcom	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	45 ns	No	5.25 V	8	CMOS	26	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	88	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.699 mm	7.62 mm	No	PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock	e0	16.7 MHz	8	31.75 mm		8
PLX448I-45	Broadcom		Industrial	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				88	2.54 mm	85 °C (185 °F)	9 Dedicated Inputs, 8 I/O	9	-40 °C (-40 °F)	Tin/Lead	Dual	R-XDIP-T24				No		e0	15 MHz	8			8
PLX464-35	Broadcom		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No		8	CMOS	26	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices				88	2.54 mm	70 °C (158 °F)	9 Dedicated Inputs, 8 I/O	9	0 °C (32 °F)	Tin/Lead	Dual	R-XDIP-T24				No		e0	18 MHz	8			8
CPL20R6L35WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	40 ns	No			CMOS	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered			2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			16.5 MHz	8
CPL20L8-15NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No			CMOS	12	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		72	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0		8
CPL20R4L-20NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			CMOS	16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		60	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0	33.3 MHz	8
CPL20R6L-15NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No			CMOS	14	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0		8
CPL20L8-25WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No			CMOS	12	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		72	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		8
CPL20R4-25NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			CMOS	16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		60	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0	28.5 MHz	8
CPL20L10-20NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns	No			CMOS	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0		10
CPL20R6-15NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No			CMOS	14	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0		8
CPL20R6L-20WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No			CMOS	14	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		8
CPL20R8-15NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			CMOS	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		72	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0	41.6 MHz	8
CPL20R6L-15WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No			CMOS	14	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		8
CPL22V10-35NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			CMOS	22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0	18 MHz	10
CPL20L10-35WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	35 ns	No			CMOS	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		10
CPL20R4L-20WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No			CMOS	16	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		60	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0	33.3 MHz	8
CPL20V8L-30NC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy		No			CMOS	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell		64	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0	22.2 MHz	8
CPL20R6L25DM	Samsung		Military	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	30 ns	Yes			CMOS	20	PAL-TYPE	5		5 V	Small Outline	SOP24,.4	Programmable Logic Devices		Registered			1.27 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-PDSO-G24				No			22 MHz	8
CPL20R6L-25NI	Samsung		Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No			CMOS	14	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		64	2.54 mm	105 °C (221 °F)			-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24	3			No		e0		8
CPL20R8L25WM	Samsung		Military	Through-Hole	24	DIP	Rectangular	Ceramic	30 ns	No			CMOS	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered			2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			22 MHz	8
CPL20R8L-20WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic		No			CMOS	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Registered		72	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0	33.3 MHz	8
CPL20L10L-15WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No			CMOS	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		10
CPL20L10L-20WC	Samsung		Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	20 ns	No			CMOS	20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Combinatorial		40	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-XDIP-T24	3			No		e0		10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.