24 Programmable Logic Devices (PLD) 1,181

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
PLQ20R4-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	8 ns	No	5.25 V	BICMOS				5		In-Line			Mixed	4.75 V			75 °C (167 °F)	12 Dedicated Inputs, 4 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24				No	Register Preload; Power-Up Reset		118 MHz					4
P3Q22V10-7D	NXP Semiconductors	OT PLD		Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	3.6 V	BICMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm		11 Dedicated Inputs, 10 I/O	11			Dual	R-PDSO-G24		2.65 mm	7.5 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock 5 V compatible inputs & I/O; Register preload		105 MHz				15.4 mm	10
PLQ20R8-5N	NXP Semiconductors	OT PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	6 ns	No	5.25 V	BICMOS				5		In-Line			Registered	4.75 V			75 °C (167 °F)	12 Dedicated Inputs, 0 I/O	12	0 °C (32 °F)		Dual	R-PDIP-T24				No	Register Preload; Power-Up Reset		118 MHz					0
5962-9201201MLX	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	35 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Registered	4.5 V			125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24				No			10.5 MHz					0
P5Z22V10-7DH-T	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	9 ns	Yes	5.25 V	CMOS				5		Small Outline, Thin Profile, Shrink Pitch			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		1.1 mm	4.4 mm	No			103 MHz				7.8 mm	10
5962-8850701LA	NXP Semiconductors	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	40 ns	No	5.5 V	Bipolar	MIL-STD-883			5		In-Line			Mixed	4.5 V			125 °C (257 °F)	8 Dedicated Inputs, 12 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24				No		e0	20 MHz					12
P3Z22V10-DD	NXP Semiconductors	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	3.6 V	CMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			83 MHz				15.4 mm	10
P3Z22V10IBD-T	NXP Semiconductors	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	3.6 V	CMOS				3.3		Small Outline			Macrocell	3 V		1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)		Dual	R-PDSO-G24		2.65 mm	7.5 mm	No			65 MHz				15.4 mm	10
PLD20G10C-15PC	Infineon Technologies	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	BICMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	90	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O		0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T24				No		e0	60 MHz		10
5962-01-379-9524	Infineon Technologies	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1			No		e0	100 MHz		10
5962-01-382-7225	Infineon Technologies	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1			No		e0	100 MHz		10
M38510/50802BLA	Infineon Technologies	OT PLD	Military	Through-Hole	24	DIP	Rectangular		25 ns	No	5.5 V	CMOS	MIL-M-38510 Class B			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24				No		e0	30 MHz					10
5962-01-302-9835	Infineon Technologies	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		90	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	1			No		e0	25 MHz		10
5962-01-302-9836	Infineon Technologies	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		90	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	1			No		e0	25 MHz		10
5962-01-350-4918	Infineon Technologies		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No			18.1 MHz		10
5962-01-382-3312	Infineon Technologies		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No			18.1 MHz		10
5962-01-305-5393	Infineon Technologies	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		90	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	1			No		e0	25 MHz		10
5962-01-385-4552	Infineon Technologies		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No			18.1 MHz		10
5962-01-349-2199	Infineon Technologies		Military	Through-Hole	24	DIP	Rectangular	Ceramic	40 ns	No		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		132	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)		Dual	R-XDIP-T24				No			18.1 MHz		10
5962-01-385-4477	Infineon Technologies		Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	35 ns	No		CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		132	2.54 mm	70 °C (158 °F)			0 °C (32 °F)		Dual	R-PDIP-T24				No			18.1 MHz		10
M38510/50801BLA	Infineon Technologies	OT PLD	Military	Through-Hole	24	DIP	Rectangular		30 ns	No	5.5 V	CMOS	MIL-M-38510 Class B			5		In-Line			Combinatorial	4.5 V			125 °C (257 °F)	11 Dedicated Inputs, 10 I/O	11	-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24				No		e0	25 MHz					10
5962-01-354-5490	Infineon Technologies	EE PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic		No		CMOS	38535Q/M;38534H;883B	22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		90	2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-XDIP-T24	1			No		e0	25 MHz		10
PLD20G10C-15DC	Infineon Technologies	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Ceramic	15 ns	No		BICMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell		90	2.54 mm	70 °C (158 °F)			0 °C (32 °F)	Tin/Lead	Dual	R-XDIP-T24				No		e0	60 MHz		10
PEEL22CV10AP-25	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz		10		31.75 mm	10
PEEL22CV10AP-10	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	90.9 MHz		10		31.75 mm	10
PEEL22CV10API-10	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	90.9 MHz		10		31.75 mm	10
PEEL22CV10API-10L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.5 V	CMOS				5		In-Line			Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24			7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	90.9 MHz			260 °C (500 °F)	31.75 mm	10
PA7540PI-15	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V	CMOS		22		5	5 V	In-Line	DIP24,.3	Field Programmable Gate Arrays	Macrocell	4.5 V		2.54 mm	85 °C (185 °F)	0 Dedicated Inputs, 20 I/O	0	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			7.62 mm	No		e0	71.4 MHz		22		31.75 mm	20
PEEL22CV10AT-25L	Diodes Incorporated	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS				5		Small Outline, Thin Profile, Shrink Pitch			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G24	3	1.1 mm	4.4 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	33.3 MHz	40 s		260 °C (500 °F)	7.8 mm	10
PEEL22CV10AZPI-25L	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	133	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T24			7.62 mm	No		e3	33.3 MHz		10	260 °C (500 °F)	31.75 mm	10
PEEL22CV10ASI-15	Diodes Incorporated	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.5 V	CMOS		22	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Macrocell	4.5 V	132	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G24		2.64 mm	7.5 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	62.5 MHz		10		15.4 mm	10
PEEL22CV10API-7	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.5 V	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	117 MHz		10		31.75 mm	10
PEEL22CV10AS-10L	Diodes Incorporated	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Small Outline			Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G24	3	2.64 mm	7.5 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	90.9 MHz			260 °C (500 °F)	15.4 mm	10
PEEL22CV10AT-7L	Diodes Incorporated	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	CMOS				5		Small Outline, Thin Profile, Shrink Pitch			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G24	3	1.1 mm	4.4 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	117 MHz			260 °C (500 °F)	7.8 mm	10
PEEL22LV10AZP-25	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	3.6 V	CMOS		22	PAL-TYPE	3	3/3.3 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	2.7 V	133	2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24			7.62 mm	No		e0	25 MHz		10		31.75 mm	10
PA7540S-15L	Diodes Incorporated	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS		22		5	5 V	Small Outline	SOP24,.4	Field Programmable Gate Arrays	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 20 I/O	0	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G24	3	2.64 mm	7.5 mm	No		e3	71.4 MHz		22	260 °C (500 °F)	15.4 mm	20
PA7540P-15L	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	CMOS		22		5	5 V	In-Line	DIP24,.3	Field Programmable Gate Arrays	Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	0 Dedicated Inputs, 20 I/O	0	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24			7.62 mm	No		e3	71.4 MHz		22	260 °C (500 °F)	31.75 mm	20
PEEL22CV10AT-10L	Diodes Incorporated	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS				5		Small Outline, Thin Profile, Shrink Pitch			Macrocell	4.75 V		.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G24	3	1.1 mm	4.4 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	90.9 MHz			260 °C (500 °F)	7.8 mm	10
PEEL22CV10AT-10	Diodes Incorporated	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	CMOS		22	PAL-TYPE	5	5 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices	Macrocell	4.75 V	132	.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24		1.1 mm	4.4 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	90.9 MHz		10		7.8 mm	10
PEEL22LV10AZT-25L	Diodes Incorporated	EE PLD	Commercial	Gull Wing	24	TSSOP	Rectangular	Plastic/Epoxy	25 ns	Yes	3.6 V	CMOS		22	PAL-TYPE	3	3/3.3 V	Small Outline, Thin Profile, Shrink Pitch	TSSOP24,.25	Programmable Logic Devices	Macrocell	2.7 V	133	.65 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDSO-G24	3	1.1 mm	4.4 mm	No		e3	25 MHz		10	260 °C (500 °F)	7.8 mm	10
PEEL22CV10AP-7L	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V	CMOS				5		In-Line			Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24			7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	117 MHz			260 °C (500 °F)	31.75 mm	10
PA7540S-15	Diodes Incorporated	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	CMOS		22		5	5 V	Small Outline	SOP24,.4	Field Programmable Gate Arrays	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 20 I/O	0	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24		2.64 mm	7.5 mm	No		e0	71.4 MHz		22		15.4 mm	20
PEEL22CV10AP-25L	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V	CMOS				5		In-Line			Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin	Dual	R-PDIP-T24	3		7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	33.3 MHz			260 °C (500 °F)	31.75 mm	10
PEEL22CV10AP-15L	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	CMOS				5		In-Line			Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin	Dual	R-PDIP-T24	3		7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	62.5 MHz			260 °C (500 °F)	31.75 mm	10
PEEL22CV10AZS-25	Diodes Incorporated	EE PLD	Commercial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.25 V	CMOS		22	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Macrocell	4.75 V	133	1.27 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin Lead	Dual	R-PDSO-G24		2.64 mm	7.5 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e0	33.3 MHz		10		15.4 mm	10
PEEL22CV10AZPI-25	Diodes Incorporated	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V	CMOS		22	PAL-TYPE	5	5 V	In-Line	DIP24,.3	Programmable Logic Devices	Macrocell	4.5 V	133	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T24			7.62 mm	No		e0	33.3 MHz		10		31.75 mm	10
PEEL22CV10AP-10L	Diodes Incorporated	EE PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V	CMOS				5		In-Line			Macrocell	4.75 V		2.54 mm	70 °C (158 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24			7.62 mm	No	10 Macrocells; 1 External Clock; Shared Input/Clock	e3	90.9 MHz			260 °C (500 °F)	31.75 mm	10
PEEL22CV10AZSI-25	Diodes Incorporated	EE PLD	Industrial	Gull Wing	24	SOP	Rectangular	Plastic/Epoxy	25 ns	Yes	5.5 V	CMOS		22	PAL-TYPE	5	5 V	Small Outline	SOP24,.4	Programmable Logic Devices	Macrocell	4.5 V	133	1.27 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin Lead	Dual	R-PDSO-G24		2.64 mm	7.5 mm	No		e0	33.3 MHz		10		15.4 mm	10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.