324 Programmable Logic Devices (PLD) 155

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XC2C384-10FG324I	Xilinx	Flash PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	384	CMOS		240	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 240 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0	83 MHz	30 s	240	225 °C (437 °F)	23 mm	Yes	240
XC2C384-6FG324C	Xilinx	Flash PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	384	CMOS				1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 240 I/O	0	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0		30 s		225 °C (437 °F)	23 mm	Yes	240
XC2C384-7FGG324C	Xilinx	Flash PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	384	CMOS		240	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 240 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	112 MHz	30 s	240	250 °C (482 °F)	23 mm	Yes	240
XC2C512-10FGG324C	Xilinx	Flash PLD	Commercial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns		Yes	1.9 V	512	CMOS		270	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array	BGA324,22X22,40	Programmable Logic Devices	Yes	Macrocell	1.7 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 270 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e1	91 MHz	30 s	270	250 °C (482 °F)	23 mm	Yes	270
EP20K100EFC324-3N	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.2 ns	4160	Yes	1.89 V		CMOS		238		1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz	30 s	238	260 °C (500 °F)	19 mm		246
EP20K100FC324-2	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3 ns	4160	Yes	2.625 V		CMOS		246		2.5	2.5,2.5/3.3 V	Grid Array	BGA324(UNSPEC)	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0		20 s	246	220 °C (428 °F)	19 mm		252
EPM2210GF324A3N	Altera	Flash PLD	Automotive	Ball	324	BGA	Square	Plastic/Epoxy	7 ns		Yes	1.89 V	1700	CMOS				1.8	1.5/3.3,1.8 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	125 °C (257 °F)	0 Dedicated Inputs, 272 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		2.2 mm	19 mm	No	It can also operate at 3.3 V	e1					19 mm	Yes	272
EP20K60EFC324-3X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.56 ns		Yes	1.89 V		CMOS				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz			220 °C (428 °F)	19 mm		196
EP20K100EFI324-2XN	Altera	Loadable PLD		Ball	324	BGA	Square	Plastic/Epoxy	2.02 ns		Yes	1.89 V		CMOS				1.8		Grid Array				Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 246 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1				245 °C (473 °F)	19 mm		246
5M2210ZF324C4	Altera	Flash PLD	Other	Ball	324	LBGA	Square	Plastic/Epoxy	9.1 ns		Yes	1.89 V	1700	CMOS				1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	271 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324		1.55 mm	19 mm	No		e0	247.5 MHz				19 mm	Yes	271
EPM2210GF324C3N	Altera	Flash PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	7 ns		Yes	1.89 V	1700	CMOS				1.8	1.5/3.3,1.8 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)	19 mm	Yes	272
5M2210ZF324A5N	Altera	Flash PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns		Yes		1700	CMOS	AEC-Q100				1.8,1.2/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes			1 mm	105 °C (221 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B324				No								Yes
EP20K100EBC324-2	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes							1.8		Grid Array				Macrocell			85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324				No		e1							246
EP20K100EFI324-2	Altera	Loadable PLD		Ball	324	BGA	Square	Plastic/Epoxy		4160	Yes			CMOS		238		1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell		1 mm		4 Dedicated Inputs, 246 I/O	4		Tin Lead	Bottom	S-PBGA-B324	3			No		e0			238	220 °C (428 °F)			246
EP20K100FC324-1V	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.5 ns	4160	Yes	2.625 V		CMOS		246		2.5	2.5,2.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	100 MHz		246	220 °C (428 °F)	19 mm		252
EP20K30EFC324-2X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.69 ns	1200	Yes	1.89 V		CMOS		120		1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1	160 MHz		120	220 °C (428 °F)	19 mm		128
EP20K60EFC324-1X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	1.72 ns	2560	Yes	1.89 V		CMOS		188		1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0	160 MHz	20 s	188	220 °C (428 °F)	19 mm		196
EPM2210F324I4N	Altera	Flash PLD		Ball	324	BGA	Square	Plastic/Epoxy	9.1 ns		Yes	2.625 V	1700	CMOS				2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm		0 Dedicated Inputs, 272 I/O	0		Tin Silver Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e1				245 °C (473 °F)	19 mm	Yes	272
EP20K100FC324-2X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3 ns	4160	Yes	2.625 V		CMOS		246		2.5	2.5,2.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0		20 s	246	220 °C (428 °F)	19 mm		252
EPM2210GF324C5N	Altera	Flash PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS				1.8	1.5/3.3,1.8 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No	It can also operate at 3.3 V	e1		30 s		260 °C (500 °F)	19 mm	Yes	272
EP20K100EFC324-2	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS		238		1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0	160 MHz	20 s	238	220 °C (428 °F)	19 mm		246
EP20K60EFC324	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes	1.89 V						1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 204 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		2.1 mm	19 mm	No		e1	160 MHz				19 mm		204
EP20K100BC324-2	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes	2.625 V						2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324				No		e1							252
5M1270ZF324A5N	Altera	Flash PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns		Yes		980	CMOS	AEC-Q100				1.8,1.2/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes			1 mm	105 °C (221 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B324				No								Yes
EP20K100BC324-3	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes	2.625 V						2.5		Grid Array				Macrocell	2.375 V		85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324				No		e1							252
EP20K30EFC324	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy			Yes	1.89 V						1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		2.1 mm	19 mm	No		e1	160 MHz				19 mm		128
EP20K60EFC324-1N	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	1.72 ns		Yes	1.89 V		CMOS				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz			245 °C (473 °F)	19 mm		196
EP20K100EFI324-2N	Altera	Loadable PLD		Ball	324	BGA	Square	Plastic/Epoxy	2.02 ns	4160	Yes	1.89 V		CMOS		238		1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm		4 Dedicated Inputs, 246 I/O	4		Tin/Silver/Copper	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No		e1		30 s	238	260 °C (500 °F)	19 mm		246
EP20K60EFC324-2XN	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.41 ns		Yes	1.89 V		CMOS				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz			245 °C (473 °F)	19 mm		196
EPM2210F324I4	Altera	Flash PLD		Ball	324	BGA	Square	Plastic/Epoxy	9.1 ns		Yes		1700	CMOS					1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B324	3			No		e0				220 °C (428 °F)		Yes
EP20K100EFC324-1XN	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	1.73 ns		Yes	1.89 V		CMOS				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz			245 °C (473 °F)	19 mm		246
EP20K30EFC324-3X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.98 ns		Yes	1.89 V		CMOS				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e1	160 MHz			220 °C (428 °F)	19 mm		128
EP20K100EFC324-1X	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	1.73 ns	4160	Yes	1.89 V		CMOS		238		1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0	160 MHz	20 s	238	220 °C (428 °F)	19 mm		246
EP20K100FC324-3N	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.6 ns		Yes	2.625 V		CMOS				2.5		Grid Array				Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B324		3.5 mm	19 mm	No		e1		40 s		260 °C (500 °F)	19 mm		252
EP20K100FI324-2	Altera	Loadable PLD		Ball	324	BGA	Square	Plastic/Epoxy		4160	Yes	2.625 V		CMOS		246		2.5	2.5,2.5/3.3 V	Grid Array	BGA324(UNSPEC)	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm		4 Dedicated Inputs, 246 I/O	4		Tin Lead	Bottom	S-PBGA-B324	3	2.1 mm	19 mm	No		e0			246	220 °C (428 °F)	19 mm		246
EPM2210GF324C5	Altera	Flash PLD	Commercial Extended	Ball	324	BGA	Square	Plastic/Epoxy	11.2 ns		Yes	1.89 V	1700	CMOS				1.8	1.5/3.3,1.8 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 272 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.2 mm	19 mm	No		e0		20 s		220 °C (428 °F)	19 mm	Yes	272
EP20K60EFC324-3N	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.56 ns	2560	Yes	1.89 V		CMOS		188		1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz	30 s	188	260 °C (500 °F)	19 mm		196
EPM2210GF324I4	Altera	Flash PLD		Ball	324	BGA	Square	Plastic/Epoxy	9.1 ns		Yes		1700	CMOS					1.5/3.3,1.8 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B324	3			No		e0				220 °C (428 °F)		Yes
5M1270ZF324C4	Altera	Flash PLD	Other	Ball	324	LBGA	Square	Plastic/Epoxy	9.1 ns		Yes	1.89 V	980	CMOS				1.8	1.8,1.2/3.3 V	Grid Array, Low Profile	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	1.71 V	1 mm	85 °C (185 °F)	271 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324		1.55 mm	19 mm	No		e0	247.5 MHz				19 mm	Yes	271
EP20K60EFC324-3	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.56 ns	2560	Yes	1.89 V		CMOS		188		1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0	160 MHz	20 s	188	220 °C (428 °F)	19 mm		196
EPM2210GF324A3	Altera	Flash PLD		Ball	324	BGA	Square	Plastic/Epoxy	7 ns		Yes		1700	CMOS					1.5/3.3,1.8 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B324	1			No		e0						Yes
EP20K100BI324-3	Altera	Loadable PLD		Ball	324	BGA	Square	Plastic/Epoxy			Yes	2.625 V						2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs, 252 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B324				No		e1							252
EP20K100BI324-2	Altera	Loadable PLD		Ball	324	BGA	Square	Plastic/Epoxy			Yes	2.625 V						2.5		Grid Array				Macrocell	2.375 V			4 Dedicated Inputs, 252 I/O	4		Tin Silver Copper	Bottom	S-PBGA-B324				No		e1							252
EPM2210F324A3N	Altera	Flash PLD	Automotive	Ball	324	BGA	Square	Plastic/Epoxy	7 ns		Yes	2.625 V	1700	CMOS				2.5	1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes	Macrocell	2.375 V	1 mm	125 °C (257 °F)	0 Dedicated Inputs, 272 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324		2.2 mm	19 mm	No	It can also operate at 3.3 V	e1					19 mm	Yes	272
EP20K100FC324-3	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	3.6 ns	4160	Yes	2.625 V		CMOS		246		2.5	2.5,2.5/3.3 V	Grid Array	BGA324(UNSPEC)	Field Programmable Gate Arrays		Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 252 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0		20 s	246	220 °C (428 °F)	19 mm		252
EPM2210F324A4	Altera	Flash PLD		Ball	324	BGA	Square	Plastic/Epoxy	9.1 ns		Yes		1700	CMOS					1.5/3.3,2.5/3.3 V	Grid Array	BGA324,18X18,40	Programmable Logic Devices	Yes			1 mm					Tin Lead	Bottom	S-PBGA-B324	1			No		e0						Yes
EP20K60EFC324-2	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.41 ns	2560	Yes	1.89 V		CMOS		188		1.8	1.8,1.8/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays		Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e0	160 MHz	20 s	188	220 °C (428 °F)	19 mm		196
EP20K60EFC324-2N	Altera	Loadable PLD	Other	Ball	324	BGA	Square	Plastic/Epoxy	2.41 ns		Yes	1.89 V		CMOS				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 196 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	3.5 mm	19 mm	No		e1	160 MHz			245 °C (473 °F)	19 mm		196

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.