324 Programmable Logic Devices (PLD) 155

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  2. Programmable Logic Devices (PLD)
Manufacturers
    • Altera
    • Analog Devices
    • Atmel
    • Broadcom
    • Cypress Semiconductor
    • Defense Logistics Agency
    • Diodes Incorporated
    • Infineon Technologies
    • Intel
    • Lattice Semiconductor
    • Microchip Technology
    • NXP Semiconductors
    • National Semiconductor
    • Qp Semiconductor
    • Renesas Electronics
    • Rochester Electronics
    • STMicroelectronics
    • Samsung
    • Texas Instruments
    • Toshiba
    • Xilinx
Programmable IC Type
    • EE PLD
    • Flash PLD
    • Loadable PLD
    • Mask PLD
    • OT PLD
    • UV PLD
Grading Of Temperature
    • Automotive
    • Commercial
    • Commercial Extended
    • Industrial
    • Military
    • Other
Form Of Terminal
    • Ball
    • Flat
    • Gull Wing
    • J Bend
    • No Lead
    • Pin/Peg
    • Through-Hole
No. of Terminals (1)
    • 324
    • 100
    • 1020
    • 12
    • 120
    • 128
    • 132
    • 133
    • 14
    • 144
    • 1508
    • 16
    • 160
    • 169
    • 176
    • 184
    • 192
    • 196
    • 20
    • 208
    • 22
    • 225
    • 232
    • 24
    • 240
    • 256
    • 28
    • 280
    • 304
    • 32
    • 352
    • 356
    • 388
    • 40
    • 400
    • 403
    • 432
    • 44
    • 48
    • 484
    • 49
    • 492
    • 503
    • 504
    • 52
    • 56
    • 560
    • 599
    • 600
    • 64
    • 652
    • 655
    • 672
    • 68
    • 724
    • 780
    • 784
    • 8
    • 84
    • 984
Package Code
    • BGA
    • BQFP
    • DFP
    • DIP
    • FBGA
    • FQFP
    • HBGA
    • HFQFP
    • HIPGA
    • HLBGA
    • HLFQFP
    • HQCCN
    • HQFP
    • HTFQFP
    • HVQCCN
    • HVSON
    • IPGA
    • LBGA
    • LFBGA
    • LFQFP
    • LQFP
    • PGA
    • QCCJ
    • QCCN
    • QFF
    • QFP
    • SON
    • SOP
    • SSOP
    • TBGA
    • TFBGA
    • TFQFP
    • TQFP
    • TSSOP
    • VQCCN
    • VSON
    • WBGA
    • WDIP
    • WPGA
    • WQCCJ
    • WQFP
Package Shape
    • Rectangular
    • Square
Package Body Material
    • Ceramic
    • Ceramic, Glass-Sealed
    • Ceramic, Metal-Sealed Cofired
    • Metal
    • Plastic
    • Plastic/Epoxy
Propagation Delay
    • 0.26 ns
    • 0.3 ns
    • 0.4 ns
    • 0.5 ns
    • 0.6 ns
    • 0.7 ns
    • 0.8 ns
    • 0.9 ns
    • 1.3 ns
    • 1.4 ns
    • 1.48 ns
    • 1.49 ns
    • 1.5 ns
    • 1.55 ns
    • 1.57 ns
    • 1.58 ns
    • 1.6 ns
    • 1.68 ns
    • 1.69 ns
    • 1.7 ns
    • 1.72 ns
    • 1.73 ns
    • 1.78 ns
    • 1.79 ns
    • 1.8 ns
    • 1.83 ns
    • 1.84 ns
    • 1.9 ns
    • 1.91 ns
    • 1.93 ns
    • 1.94 ns
    • 1.97 ns
    • 10 ns
    • 10.5 ns
    • 10.8 ns
    • 11 ns
    • 11.2 ns
    • 11.4 ns
    • 11.5 ns
    • 12 ns
    • 12.4 ns
    • 12.5 ns
    • 12.6 ns
    • 12.8 ns
    • 125 ns
    • 13 ns
    • 13.2 ns
    • 13.4 ns
    • 13.5 ns
    • 14 ns
    • 14.5 ns
    • 15 ns
    • 15.1 ns
    • 15.5 ns
    • 16 ns
    • 16.1 ns
    • 16.2 ns
    • 16.4 ns
    • 16.5 ns
    • 16.6 ns
    • 17 ns
    • 17.2 ns
    • 17.5 ns
    • 17.7 ns
    • 18 ns
    • 18.5 ns
    • 19 ns
    • 19.1 ns
    • 2 ns
    • 2.02 ns
    • 2.05 ns
    • 2.07 ns
    • 2.13 ns
    • 2.17 ns
    • 2.2 ns
    • 2.23 ns
    • 2.25 ns
    • 2.29 ns
    • 2.32 ns
    • 2.33 ns
    • 2.41 ns
    • 2.49 ns
    • 2.5 ns
    • 2.69 ns
    • 2.7 ns
    • 2.87 ns
    • 2.92 ns
    • 20 ns
    • 21 ns
    • 21.1 ns
    • 22 ns
    • 23 ns
    • 23.2 ns
    • 23.4 ns
    • 23.6 ns
    • 23.8 ns
    • 24 ns
    • 24.2 ns
    • 25 ns
    • 26 ns
    • 27 ns
    • 28 ns
    • 29 ns
    • 3 ns
    • 3.06 ns
    • 3.1 ns
    • 3.5 ns
    • 3.56 ns
    • 3.6 ns
    • 3.98 ns
    • 30 ns
    • 32 ns
    • 33 ns
    • 34 ns
    • 35 ns
    • 36 ns
    • 37 ns
    • 38 ns
    • 4 ns
    • 4.5 ns
    • 4.7 ns
    • 4.9 ns
    • 40 ns
    • 42 ns
    • 43 ns
    • 45 ns
    • 48 ns
    • 5 ns
    • 5.1 ns
    • 5.4 ns
    • 5.5 ns
    • 5.8 ns
    • 50 ns
    • 51 ns
    • 55 ns
    • 59 ns
    • 6 ns
    • 6.1 ns
    • 6.2 ns
    • 6.5 ns
    • 60 ns
    • 65 ns
    • 7 ns
    • 7.24 ns
    • 7.36 ns
    • 7.5 ns
    • 7.9 ns
    • 70 ns
    • 75 ns
    • 8 ns
    • 8.1 ns
    • 8.2 ns
    • 8.5 ns
    • 8.7 ns
    • 80 ns
    • 85 ns
    • 9 ns
    • 9.1 ns
    • 9.5 ns
    • 90 ns
No. of Logic Cells
    • 1008
    • 1152
    • 11520
    • 1200
    • 12160
    • 1296
    • 1320
    • 14400
    • 160
    • 16640
    • 1728
    • 1960
    • 208
    • 2280
    • 2304
    • 24320
    • 256
    • 2560
    • 2880
    • 336
    • 3744
    • 38400
    • 40
    • 4032
    • 4160
    • 4800
    • 4992
    • 504
    • 51840
    • 576
    • 640
    • 6400
    • 6656
    • 672
    • 67200
    • 80
    • 832
    • 8320
    • 880
    • 9984
Surface Mount
    • No
    • Yes
Maximum Supply Voltage
    • 1.575 V
    • 1.89 V
    • 1.9 V
    • 1.95 V
    • 2.6 V
    • 2.62 V
    • 2.625 V
    • 2.7 V
    • 3.3 V
    • 3.462 V
    • 3.465 V
    • 3.6 V
    • 3.63 V
    • 5 V
    • 5.25 V
    • 5.5 V
    • 6 V
No. of Macro Cells
    • 1
    • 10
    • 108
    • 12
    • 128
    • 144
    • 15
    • 1536
    • 16
    • 160
    • 17
    • 1700
    • 18
    • 19
    • 192
    • 2
    • 20
    • 216
    • 23
    • 24
    • 256
    • 26
    • 288
    • 3072
    • 32
    • 320
    • 36
    • 384
    • 400
    • 440
    • 48
    • 480
    • 512
    • 54
    • 560
    • 64
    • 7
    • 72
    • 8
    • 9
    • 96
    • 960
    • 980
Technology Used
    • BICMOS
    • Bipolar
    • CMOS
    • ECL
    • ECL100K
    • ECL10K
    • TTL
Screening Level
    • 38535Q/M;38534H;883B
    • AEC-Q100
    • AEC-Q100; TS 16949
    • MIL-M-38510 Class B
    • MIL-PRF-38535
    • MIL-PRF-38535 Class Q
    • MIL-PRF-38535; MIL-STD-883
    • MIL-STD-883
    • MIL-STD-883 Class B
    • MIL-STD-883 Class B (Modified)
    • MIL-STD-883 Class C
    • MIL-STD-883 Class S
No. of Inputs
    • 10
    • 100
    • 102
    • 104
    • 1048
    • 106
    • 11
    • 110
    • 112
    • 113
    • 114
    • 116
    • 117
    • 118
    • 12
    • 120
    • 124
    • 128
    • 13
    • 132
    • 133
    • 134
    • 135
    • 136
    • 138
    • 14
    • 140
    • 143
    • 144
    • 147
    • 148
    • 150
    • 152
    • 153
    • 16
    • 160
    • 164
    • 165
    • 167
    • 168
    • 17
    • 171
    • 172
    • 173
    • 175
    • 176
    • 18
    • 181
    • 182
    • 183
    • 184
    • 186
    • 188
    • 189
    • 19
    • 191
    • 192
    • 199
    • 20
    • 203
    • 204
    • 208
    • 212
    • 218
    • 219
    • 22
    • 220
    • 23
    • 238
    • 24
    • 240
    • 246
    • 249
    • 25
    • 254
    • 26
    • 263
    • 270
    • 271
    • 272
    • 274
    • 30
    • 303
    • 308
    • 310
    • 32
    • 33
    • 333
    • 338
    • 34
    • 35
    • 358
    • 36
    • 360
    • 368
    • 369
    • 37
    • 376
    • 38
    • 400
    • 406
    • 413
    • 42
    • 424
    • 45
    • 470
    • 480
    • 486
    • 496
    • 500
    • 52
    • 524
    • 54
    • 55
    • 580
    • 588
    • 59
    • 6
    • 60
    • 62
    • 64
    • 66
    • 68
    • 7
    • 700
    • 708
    • 71
    • 72
    • 723
    • 73
    • 74
    • 76
    • 78
    • 79
    • 8
    • 80
    • 800
    • 808
    • 81
    • 84
    • 85
    • 9
    • 92
    • 95
    • 96
Architecture
    • PAD-TYPE
    • PAL-TYPE
    • PLA-TYPE
    • PLE-TYPE
    • PLS-TYPE
Nominal Supply Voltage (V)
    • 1.5
    • 1.8
    • 2.5
    • 3
    • 3.3
    • 5
Packing Method
    • Box, Tape and Reel, 13 in
    • Box, Tape and Reel, 7 in
    • Tape and Reel
    • Tape and Reel, 13 in
    • Tape and Reel, 7 in
    • Tray
    • Tube
Power Supplies (V)
    • -4.5 V
    • -5.2 V
    • 1.2/3.3,1.8 V
    • 1.5,1.5/3.3 V
    • 1.5/3.3,1.8 V
    • 1.5/3.3,2.5/3.3 V
    • 1.8 V
    • 1.8,1.2/3.3 V
    • 1.8,1.8/3 V
    • 1.8,1.8/3.3 V
    • 1.8,2.5,3.3 V
    • 1.8/2.5/3.3 V
    • 1.8/3.3 V
    • 1.8/3.3,2.5 V
    • 2.5 V
    • 2.5,2.5/3.3 V
    • 2.5/3.3 V
    • 2.5/3.3,3.3 V
    • 3 V
    • 3.3 V
    • 3.3,3.3/5 V
    • 3.3,3.3/5,5 V
    • 3.3,5 V
    • 3.3/5 V
    • 3.3/5,5 V
    • 3/3.3 V
    • 3/5 V
    • 5 V
    • 5,-5.2 V
Package Style (Meter)
    • Chip Carrier
    • Chip Carrier, Heat Sink/Slug
    • Chip Carrier, Heat Sink/Slug, Very Thin Profile
    • Chip Carrier, Very Thin Profile
    • Chip Carrier, Window
    • Flatpack
    • Flatpack, Bumper
    • Flatpack, Fine Pitch
    • Flatpack, Heat Sink/Slug
    • Flatpack, Heat Sink/Slug, Fine Pitch
    • Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch
    • Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch
    • Flatpack, Low Profile
    • Flatpack, Low Profile, Fine Pitch
    • Flatpack, Thin Profile
    • Flatpack, Thin Profile, Fine Pitch
    • Flatpack, Window
    • Grid Array
    • Grid Array, Fine Pitch
    • Grid Array, Heat Sink/Slug
    • Grid Array, Heat Sink/Slug, Interstitial Pitch
    • Grid Array, Heat Sink/Slug, Low Profile
    • Grid Array, Interstitial Pitch
    • Grid Array, Low Profile
    • Grid Array, Low Profile, Fine Pitch
    • Grid Array, Thin Profile
    • Grid Array, Thin Profile, Fine Pitch
    • Grid Array, Window
    • In-Line
    • In-Line, Window
    • Small Outline
    • Small Outline, Heat Sink/Slug, Very Thin Profile
    • Small Outline, Shrink Pitch
    • Small Outline, Thin Profile, Shrink Pitch
    • Small Outline, Very Thin Profile
Package Equivalence Code
    • BGA100,10X10
    • BGA100,10X10,40
    • BGA100,11X11,20
    • BGA100,14X14,20
    • BGA1020,32X32,40
    • BGA132,14X14,20
    • BGA144,12X12,20
    • BGA144,12X12,40
    • BGA144,13X13,20
    • BGA144,13X13,32
    • BGA1508,39X39,40
    • BGA169,13X13
    • BGA169,13X13,32
    • BGA225,15X15
    • BGA256(UNSPEC)
    • BGA256,16X16,40
    • BGA256,16X16,50
    • BGA256,20X20,20
    • BGA256,20X20,50
    • BGA280,19X19,32
    • BGA324(UNSPEC)
    • BGA324,18X18,40
    • BGA324,20X20,40
    • BGA324,22X22,40
    • BGA352,26X26,50
    • BGA356,26X26,50
    • BGA388,26X26,50
    • BGA48,6X8,32
    • BGA48,7X7,32
    • BGA484,22X22,40
    • BGA484,22X22,50
    • BGA49,7X7,32
    • BGA492,26X26,50
    • BGA56,10X10,20
    • BGA600,35X35,50
    • BGA64,8X8,20
    • BGA652,35X35,50
    • BGA672,26X26,40
    • BGA68,9X9,20
    • BGA724,27X27,50
    • BGA780,28X28,40
    • DIP20,.3
    • DIP24(UNSPEC)
    • DIP24,.3
    • DIP24,.6
    • DIP28,.3
    • DIP28,.6
    • DIP40,.6
    • FL(UNSPEC)
    • FL20,.3
    • FL24,.35
    • FL24,.4
    • FL28,.4
    • HQFP208,1.2SQ,20
    • HQFP240,1.37SQ,20
    • HQFP304,1.7SQ,20
    • LCC(UNSPEC)
    • LCC12,.06SQ,16
    • LCC12,.08SQ,20
    • LCC14,.06X..1,16
    • LCC14,.06X.08,16
    • LCC14,.08X.09,16
    • LCC14,.12SQ,25
    • LCC16,.06X.08,16
    • LCC20,.08X.12,16
    • LCC20,.35SQ
    • LCC22,.08X.09,16
    • LCC24,.12SQ,16
    • LCC28,.08X.12,16
    • LCC28,.45SQ
    • LCC32(UNSPEC)
    • LCC32,.16SQ,16
    • LCC32,.2SQ,20
    • LCC48,.27SQ,20
    • LCC8,.039X.047,16
    • LDCC20,.4SQ
    • LDCC28,.5SQ
    • LDCC44,.7SQ
    • LDCC52,.8SQ
    • LDCC68,1.0SQ
    • LDCC84,1.2SQ
    • PGA100M,13X13
    • PGA132,14X14
    • PGA144,15X15
    • PGA160M,15X15
    • PGA192,17X17
    • PGA192M,17X17
    • PGA232,17X17
    • PGA232M,17X17
    • PGA280,19X19
    • PGA560,43X43,50
    • PGA68,11X11
    • PGA84M,11X11
    • QFP100,.63SQ,20
    • QFP100,.7X.9
    • QFP100,.7X1.0
    • QFP120,1.2SQ,32
    • QFP128,.63X.87,20
    • QFP128,.64SQ,16
    • QFP128,1.2SQ,32
    • QFP144,.63SQ,20
    • QFP144,.87SQ,20
    • QFP160,1.0SQ,20
    • QFP160,1.2SQ
    • QFP176,1.0SQ,20
    • QFP208(UNSPEC)
    • QFP208,1.2SQ
    • QFP208,1.2SQ,20
    • QFP240,1.3SQ,20
    • QFP304,1.7SQ,20
    • QFP44,.47SQ,32
    • QFP44,.5SQ,20
    • QFP44,.5SQ,32
    • QFP48(UNSPEC)
    • QFP48,.35SQ,20
    • SOLCC12,.1,16
    • SOLCC8,.08,20
    • SOP20,.4
    • SOP24,.4
    • SOP28,.4
    • SOP28,.5
    • SPGA403M,37X37
    • SPGA503,43X43
    • SPGA599,47X47
    • SPGA655,47X47
    • SPQFP132,1.1SQ
    • SSOP20,.3
    • TQFP100,.63SQ
    • TQFP44,.47SQ,32
    • TQFP48,.35SQ
    • TQFP64,.35SQ,16
    • TQFP64,.47SQ
    • TSSOP20,.25
    • TSSOP24,.25
Sub-Category
    • Field Programmable Gate Arrays
    • Programmable Logic Devices
In-System Programmable
    • No
    • Yes
Output Function
    • Combinatorial
    • Latched
    • Macrocell
    • Mixed
    • Registered
Minimum Supply Voltage
    • 1.425 V
    • 1.65 V
    • 1.7 V
    • 1.71 V
    • 1.8 V
    • 2 V
    • 2.3 V
    • 2.37 V
    • 2.375 V
    • 2.4 V
    • 2.7 V
    • 2.97 V
    • 3 V
    • 4.5 V
    • 4.75 V
No. of Product Terms
    • 1024
    • 105
    • 113
    • 120
    • 122
    • 124
    • 132
    • 133
    • 136
    • 16
    • 160
    • 192
    • 200
    • 2048
    • 236
    • 240
    • 256
    • 32
    • 320
    • 394
    • 40
    • 42
    • 45
    • 450
    • 48
    • 50
    • 60
    • 64
    • 72
    • 74
    • 75
    • 8
    • 80
    • 83
    • 87
    • 88
    • 9
    • 90
    • 96
    • 97
Pitch Of Terminal
    • .4 mm
    • .5 mm
    • .635 mm
    • .65 mm
    • .8 mm
    • 1 mm
    • 1.27 mm
    • 1.5 mm
    • 2.54 mm
Maximum Operating Temperature
    • 100 °C (212 °F)
    • 105 °C (221 °F)
    • 124 °C (255.2 °F)
    • 125 °C (257 °F)
    • 130 °C (266 °F)
    • 70 °C (158 °F)
    • 75 °C (167 °F)
    • 85 °C (185 °F)
    • 90 °C (194 °F)
Organization
    • 0 Dedicated Inputs
    • 0 Dedicated Inputs, 0 I/O
    • 0 Dedicated Inputs, 10 I/O
    • 0 Dedicated Inputs, 100 I/O
    • 0 Dedicated Inputs, 104 I/O
    • 0 Dedicated Inputs, 106 I/O
    • 0 Dedicated Inputs, 108 I/O
    • 0 Dedicated Inputs, 112 I/O
    • 0 Dedicated Inputs, 113 I/O
    • 0 Dedicated Inputs, 116 I/O
    • 0 Dedicated Inputs, 117 I/O
    • 0 Dedicated Inputs, 118 I/O
    • 0 Dedicated Inputs, 120 I/O
    • 0 Dedicated Inputs, 124 I/O
    • 0 Dedicated Inputs, 128 I/O
    • 0 Dedicated Inputs, 13 I/O
    • 0 Dedicated Inputs, 132 I/O
    • 0 Dedicated Inputs, 133 I/O
    • 0 Dedicated Inputs, 136 I/O
    • 0 Dedicated Inputs, 139 I/O
    • 0 Dedicated Inputs, 141 I/O
    • 0 Dedicated Inputs, 144 I/O
    • 0 Dedicated Inputs, 146 I/O
    • 0 Dedicated Inputs, 149 I/O
    • 0 Dedicated Inputs, 153 I/O
    • 0 Dedicated Inputs, 158 I/O
    • 0 Dedicated Inputs, 159 I/O
    • 0 Dedicated Inputs, 16 I/O
    • 0 Dedicated Inputs, 160 I/O
    • 0 Dedicated Inputs, 161 I/O
    • 0 Dedicated Inputs, 164 I/O
    • 0 Dedicated Inputs, 166 I/O
    • 0 Dedicated Inputs, 167 I/O
    • 0 Dedicated Inputs, 168 I/O
    • 0 Dedicated Inputs, 172 I/O
    • 0 Dedicated Inputs, 173 I/O
    • 0 Dedicated Inputs, 175 I/O
    • 0 Dedicated Inputs, 176 I/O
    • 0 Dedicated Inputs, 180 I/O
    • 0 Dedicated Inputs, 184 I/O
    • 0 Dedicated Inputs, 186 I/O
    • 0 Dedicated Inputs, 187 I/O
    • 0 Dedicated Inputs, 191 I/O
    • 0 Dedicated Inputs, 192 I/O
    • 0 Dedicated Inputs, 196 I/O
    • 0 Dedicated Inputs, 2 I/O
    • 0 Dedicated Inputs, 20 I/O
    • 0 Dedicated Inputs, 200 I/O
    • 0 Dedicated Inputs, 204 I/O
    • 0 Dedicated Inputs, 208 I/O
    • 0 Dedicated Inputs, 211 I/O
    • 0 Dedicated Inputs, 212 I/O
    • 0 Dedicated Inputs, 216 I/O
    • 0 Dedicated Inputs, 220 I/O
    • 0 Dedicated Inputs, 232 I/O
    • 0 Dedicated Inputs, 240 I/O
    • 0 Dedicated Inputs, 246 I/O
    • 0 Dedicated Inputs, 260 I/O
    • 0 Dedicated Inputs, 270 I/O
    • 0 Dedicated Inputs, 272 I/O
    • 0 Dedicated Inputs, 294 I/O
    • 0 Dedicated Inputs, 30 I/O
    • 0 Dedicated Inputs, 303 I/O
    • 0 Dedicated Inputs, 32 I/O
    • 0 Dedicated Inputs, 33 I/O
    • 0 Dedicated Inputs, 34 I/O
    • 0 Dedicated Inputs, 36 I/O
    • 0 Dedicated Inputs, 360 I/O
    • 0 Dedicated Inputs, 37 I/O
    • 0 Dedicated Inputs, 38 I/O
    • 0 Dedicated Inputs, 4 I/O
    • 0 Dedicated Inputs, 40 I/O
    • 0 Dedicated Inputs, 41 I/O
    • 0 Dedicated Inputs, 42 I/O
    • 0 Dedicated Inputs, 426 I/O
    • 0 Dedicated Inputs, 45 I/O
    • 0 Dedicated Inputs, 48 I/O
    • 0 Dedicated Inputs, 486 I/O
    • 0 Dedicated Inputs, 488 I/O
    • 0 Dedicated Inputs, 52 I/O
    • 0 Dedicated Inputs, 55 I/O
    • 0 Dedicated Inputs, 59 I/O
    • 0 Dedicated Inputs, 60 I/O
    • 0 Dedicated Inputs, 64 I/O
    • 0 Dedicated Inputs, 66 I/O
    • 0 Dedicated Inputs, 68 I/O
    • 0 Dedicated Inputs, 69 I/O
    • 0 Dedicated Inputs, 711 I/O
    • 0 Dedicated Inputs, 72 I/O
    • 0 Dedicated Inputs, 76 I/O
    • 0 Dedicated Inputs, 79 I/O
    • 0 Dedicated Inputs, 80 I/O
    • 0 Dedicated Inputs, 81 I/O
    • 0 Dedicated Inputs, 84 I/O
    • 0 Dedicated Inputs, 96 I/O
    • 0 Dedicated Inputs, 98 I/O
    • 1 Dedicated Inputs, 10 I/O
    • 1 Dedicated Inputs, 11 I/O
    • 1 Dedicated Inputs, 133 I/O
    • 1 Dedicated Inputs, 16 I/O
    • 1 Dedicated Inputs, 160 I/O
    • 1 Dedicated Inputs, 17 I/O
    • 1 Dedicated Inputs, 197 I/O
    • 1 Dedicated Inputs, 32 I/O
    • 1 Dedicated Inputs, 33 I/O
    • 1 Dedicated Inputs, 37 I/O
    • 1 Dedicated Inputs, 384 I/O
    • 1 Dedicated Inputs, 48 I/O
    • 1 Dedicated Inputs, 5 I/O
    • 1 Dedicated Inputs, 6 I/O
    • 1 Dedicated Inputs, 64 I/O
    • 1 Dedicated Inputs, 69 I/O
    • 1 Dedicated Inputs, 7 I/O
    • 1 Dedicated Inputs, 8 I/O
    • 1 Dedicated Inputs, 9 I/O
    • 10 Dedicated Inputs, 0 I/O
    • 10 Dedicated Inputs, 10 I/O
    • 10 Dedicated Inputs, 11 I/O
    • 10 Dedicated Inputs, 2 I/O
    • 10 Dedicated Inputs, 25 I/O
    • 10 Dedicated Inputs, 40 I/O
    • 10 Dedicated Inputs, 6 I/O
    • 10 Dedicated Inputs, 64 I/O
    • 10 Dedicated Inputs, 8 I/O
    • 101 I/O
    • 102 I/O
    • 104 I/O
    • 1060 I/O
    • 11 Dedicated Inputs, 10 I/O
    • 11 Dedicated Inputs, 48 I/O
    • 11 Dedicated Inputs, 8 I/O
    • 11 Dedicated Inputs, 9 I/O
    • 114 I/O
    • 116 I/O
    • 12 Dedicated Inputs
    • 12 Dedicated Inputs, 0 I/O
    • 12 Dedicated Inputs, 10 I/O
    • 12 Dedicated Inputs, 110 I/O
    • 12 Dedicated Inputs, 12 I/O
    • 12 Dedicated Inputs, 120 I/O
    • 12 Dedicated Inputs, 2 I/O
    • 12 Dedicated Inputs, 24 I/O
    • 12 Dedicated Inputs, 3 I/O
    • 12 Dedicated Inputs, 37 I/O
    • 12 Dedicated Inputs, 4 I/O
    • 12 Dedicated Inputs, 42 I/O
    • 12 Dedicated Inputs, 47 I/O
    • 12 Dedicated Inputs, 48 I/O
    • 12 Dedicated Inputs, 78 I/O
    • 12 Dedicated Inputs, 8 I/O
    • 12 Dedicated Inputs, 9 I/O
    • 120 I/O
    • 13 Dedicated Inputs, 12 I/O
    • 13 Dedicated Inputs, 24 I/O
    • 13 Dedicated Inputs, 8 I/O
    • 1320 Clbs, 8000 Gates
    • 136 I/O
    • 14 Dedicated Inputs, 0 I/O
    • 14 Dedicated Inputs, 128 I/O
    • 14 Dedicated Inputs, 6 I/O
    • 14 Dedicated Inputs, 96 I/O
    • 144 I/O
    • 147 I/O
    • 15 Dedicated Inputs, 0 I/O
    • 15 Dedicated Inputs, 45 I/O
    • 15 Dedicated Inputs, 8 I/O
    • 159 I/O
    • 16 Dedicated Inputs
    • 16 Dedicated Inputs, 0 I/O
    • 16 Dedicated Inputs, 17 I/O
    • 16 Dedicated Inputs, 96 I/O
    • 160 I/O
    • 168 I/O
    • 171 I/O
    • 176 I/O
    • 182 I/O
    • 186 I/O
    • 189 I/O
    • 19 Dedicated Inputs, 36 I/O
    • 19 Dedicated Inputs, 48 I/O
    • 19 Dedicated Inputs, 63 I/O
    • 19 Dedicated Inputs, 64 I/O
    • 191 I/O
    • 192 I/O
    • 2 Dedicated Inputs, 12 I/O
    • 2 Dedicated Inputs, 16 I/O
    • 2 Dedicated Inputs, 30 I/O
    • 2 Dedicated Inputs, 32 I/O
    • 2 Dedicated Inputs, 33 I/O
    • 2 Dedicated Inputs, 44 I/O
    • 2 Dedicated Inputs, 48 I/O
    • 2 Dedicated Inputs, 6 I/O
    • 2 Dedicated Inputs, 64 I/O
    • 2 Dedicated Inputs, 80 I/O
    • 2 Dedicated Inputs, 95 I/O
    • 2 Dedicated Inputs, 96 I/O
    • 2 Dedicated Inputs, 97 I/O
    • 20 Dedicated Inputs, 48 I/O
    • 20 Dedicated Inputs, 64 I/O
    • 203 I/O
    • 21 I/O
    • 211 I/O
    • 216 I/O
    • 22 Dedicated Inputs, 80 I/O
    • 220 I/O
    • 232 I/O
    • 24 Dedicated Inputs, 8 I/O
    • 249 I/O
    • 254 I/O
    • 271 I/O
    • 274 I/O
    • 277 I/O
    • 29 Dedicated Inputs, 24 I/O
    • 3 Dedicated Inputs, 32 I/O
    • 3 Dedicated Inputs, 96 I/O
    • 30 I/O
    • 303 I/O
    • 32 I/O
    • 33 I/O
    • 333 I/O
    • 338 I/O
    • 34 I/O
    • 36 Dedicated Inputs, 12 I/O
    • 369 I/O
    • 376 I/O
    • 384 I/O
    • 4 Dedicated Inputs
    • 4 Dedicated Inputs, 100 I/O
    • 4 Dedicated Inputs, 101 I/O
    • 4 Dedicated Inputs, 102 I/O
    • 4 Dedicated Inputs, 108 I/O
    • 4 Dedicated Inputs, 112 I/O
    • 4 Dedicated Inputs, 114 I/O
    • 4 Dedicated Inputs, 116 I/O
    • 4 Dedicated Inputs, 117 I/O
    • 4 Dedicated Inputs, 118 I/O
    • 4 Dedicated Inputs, 12 I/O
    • 4 Dedicated Inputs, 120 I/O
    • 4 Dedicated Inputs, 125 I/O
    • 4 Dedicated Inputs, 128 I/O
    • 4 Dedicated Inputs, 130 I/O
    • 4 Dedicated Inputs, 132 I/O
    • 4 Dedicated Inputs, 134 I/O
    • 4 Dedicated Inputs, 135 I/O
    • 4 Dedicated Inputs, 136 I/O
    • 4 Dedicated Inputs, 141 I/O
    • 4 Dedicated Inputs, 142 I/O
    • 4 Dedicated Inputs, 143 I/O
    • 4 Dedicated Inputs, 144 I/O
    • 4 Dedicated Inputs, 147 I/O
    • 4 Dedicated Inputs, 148 I/O
    • 4 Dedicated Inputs, 149 I/O
    • 4 Dedicated Inputs, 150 I/O
    • 4 Dedicated Inputs, 151 I/O
    • 4 Dedicated Inputs, 152 I/O
    • 4 Dedicated Inputs, 155 I/O
    • 4 Dedicated Inputs, 159 I/O
    • 4 Dedicated Inputs, 16 I/O
    • 4 Dedicated Inputs, 160 I/O
    • 4 Dedicated Inputs, 164 I/O
    • 4 Dedicated Inputs, 166 I/O
    • 4 Dedicated Inputs, 168 I/O
    • 4 Dedicated Inputs, 171 I/O
    • 4 Dedicated Inputs, 173 I/O
    • 4 Dedicated Inputs, 174 I/O
    • 4 Dedicated Inputs, 175 I/O
    • 4 Dedicated Inputs, 176 I/O
    • 4 Dedicated Inputs, 180 I/O
    • 4 Dedicated Inputs, 181 I/O
    • 4 Dedicated Inputs, 183 I/O
    • 4 Dedicated Inputs, 184 I/O
    • 4 Dedicated Inputs, 186 I/O
    • 4 Dedicated Inputs, 187 I/O
    • 4 Dedicated Inputs, 189 I/O
    • 4 Dedicated Inputs, 191 I/O
    • 4 Dedicated Inputs, 196 I/O
    • 4 Dedicated Inputs, 199 I/O
    • 4 Dedicated Inputs, 20 I/O
    • 4 Dedicated Inputs, 204 I/O
    • 4 Dedicated Inputs, 208 I/O
    • 4 Dedicated Inputs, 212 I/O
    • 4 Dedicated Inputs, 218 I/O
    • 4 Dedicated Inputs, 219 I/O
    • 4 Dedicated Inputs, 220 I/O
    • 4 Dedicated Inputs, 246 I/O
    • 4 Dedicated Inputs, 248 I/O
    • 4 Dedicated Inputs, 249 I/O
    • 4 Dedicated Inputs, 252 I/O
    • 4 Dedicated Inputs, 254 I/O
    • 4 Dedicated Inputs, 271 I/O
    • 4 Dedicated Inputs, 273 I/O
    • 4 Dedicated Inputs, 274 I/O
    • 4 Dedicated Inputs, 277 I/O
    • 4 Dedicated Inputs, 279 I/O
    • 4 Dedicated Inputs, 291 I/O
    • 4 Dedicated Inputs, 310 I/O
    • 4 Dedicated Inputs, 316 I/O
    • 4 Dedicated Inputs, 32 I/O
    • 4 Dedicated Inputs, 324 I/O
    • 4 Dedicated Inputs, 338 I/O
    • 4 Dedicated Inputs, 358 I/O
    • 4 Dedicated Inputs, 36 I/O
    • 4 Dedicated Inputs, 369 I/O
    • 4 Dedicated Inputs, 376 I/O
    • 4 Dedicated Inputs, 382 I/O
    • 4 Dedicated Inputs, 406 I/O
    • 4 Dedicated Inputs, 408 I/O
    • 4 Dedicated Inputs, 413 I/O
    • 4 Dedicated Inputs, 470 I/O
    • 4 Dedicated Inputs, 48 I/O
    • 4 Dedicated Inputs, 488 I/O
    • 4 Dedicated Inputs, 502 I/O
    • 4 Dedicated Inputs, 508 I/O
    • 4 Dedicated Inputs, 56 I/O
    • 4 Dedicated Inputs, 588 I/O
    • 4 Dedicated Inputs, 59 I/O
    • 4 Dedicated Inputs, 64 I/O
    • 4 Dedicated Inputs, 66 I/O
    • 4 Dedicated Inputs, 68 I/O
    • 4 Dedicated Inputs, 708 I/O
    • 4 Dedicated Inputs, 71 I/O
    • 4 Dedicated Inputs, 716 I/O
    • 4 Dedicated Inputs, 74 I/O
    • 4 Dedicated Inputs, 78 I/O
    • 4 Dedicated Inputs, 808 I/O
    • 4 Dedicated Inputs, 81 I/O
    • 4 Dedicated Inputs, 84 I/O
    • 4 Dedicated Inputs, 858 I/O
    • 4 Dedicated Inputs, 88 I/O
    • 4 Dedicated Inputs, 92 I/O
    • 4 Dedicated Inputs, 93 I/O
    • 4 Dedicated Inputs, 96 I/O
    • 413 I/O
    • 424 I/O
    • 44 I/O
    • 470 I/O
    • 48 Dedicated Inputs, 120 I/O
    • 488 I/O
    • 492 I/O
    • 5 Dedicated Inputs, 32 I/O
    • 502 I/O
    • 52 I/O
    • 536 I/O
    • 54 I/O
    • 6 Dedicated Inputs, 10 I/O
    • 6 Dedicated Inputs, 102 I/O
    • 6 Dedicated Inputs, 130 I/O
    • 6 Dedicated Inputs, 147 I/O
    • 6 Dedicated Inputs, 171 I/O
    • 6 Dedicated Inputs, 186 I/O
    • 6 Dedicated Inputs, 249 I/O
    • 6 Dedicated Inputs, 333 I/O
    • 6 Dedicated Inputs, 48 I/O
    • 612 I/O
    • 64 I/O
    • 66 I/O
    • 7 Dedicated Inputs, 10 I/O
    • 7 Dedicated Inputs, 113 I/O
    • 7 Dedicated Inputs, 16 I/O
    • 7 Dedicated Inputs, 28 I/O
    • 7 Dedicated Inputs, 52 I/O
    • 7 Dedicated Inputs, 64 I/O
    • 7 Dedicated Inputs, 73 I/O
    • 7 Dedicated Inputs, 74 I/O
    • 7 Dedicated Inputs, 78 I/O
    • 7 Dedicated Inputs, 8 I/O
    • 72 I/O
    • 735 I/O
    • 74 I/O
    • 79 I/O
    • 8 Dedicated Inputs, 0 I/O
    • 8 Dedicated Inputs, 10 I/O
    • 8 Dedicated Inputs, 12 I/O
    • 8 Dedicated Inputs, 2 I/O
    • 8 Dedicated Inputs, 24 I/O
    • 8 Dedicated Inputs, 25 I/O
    • 8 Dedicated Inputs, 38 I/O
    • 8 Dedicated Inputs, 4 I/O
    • 8 Dedicated Inputs, 42 I/O
    • 8 Dedicated Inputs, 8 I/O
    • 8 Dedicated Inputs, 9 I/O
    • 8 Dedicated Inputs, 96 I/O
    • 80 I/O
    • 808 I/O
    • 9 Dedicated Inputs, 12 I/O
    • 9 Dedicated Inputs, 24 I/O
    • 9 Dedicated Inputs, 8 I/O
    • 92 I/O
No. of Dedicated Inputs
    • 0
    • 1
    • 10
    • 11
    • 12
    • 13
    • 14
    • 15
    • 16
    • 19
    • 2
    • 20
    • 22
    • 24
    • 29
    • 3
    • 36
    • 4
    • 48
    • 5
    • 6
    • 7
    • 8
    • 9
Minimum Operating Temperature
    • -40 °C (-40 °F)
    • -55 °C (-67 °F)
    • 0 °C (32 °F)
Finishing Of Terminal Used
    • Gold
    • Matte Tin
    • Matte Tin - annealed
    • Matte Tin/Copper
    • Nickel Palladium Gold
    • Nickel/Palladium/Gold
    • Tin
    • Tin Copper/Tin Silver
    • Tin Lead
    • Tin Silver Copper
    • Tin/Lead
    • Tin/Lead (Sn63Pb37)
    • Tin/Lead (Sn85Pb15)
    • Tin/Lead - hot dipped
    • Tin/Silver/Copper
    • Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
    • Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Position Of Terminal
    • Bottom
    • Dual
    • Perpendicular
    • Quad
JESD-30 Code
    • R-CDFP-F20
    • R-CDFP-F24
    • R-CDFP-F28
    • R-CDIP-T20
    • R-CDIP-T24
    • R-CDIP-T28
    • R-CDIP-T40
    • R-CQFP-G100
    • R-GDFP-F20
    • R-GDFP-F24
    • R-GDFP-F28
    • R-GDIP-T20
    • R-GDIP-T24
    • R-GDIP-T28
    • R-GDIP-T40
    • R-PBGA-B144
    • R-PBGA-B256
    • R-PBGA-B48
    • R-PBGA-B68
    • R-PDFP-F20
    • R-PDIP-T20
    • R-PDIP-T24
    • R-PDIP-T28
    • R-PDIP-T40
    • R-PDSO-G20
    • R-PDSO-G24
    • R-PDSO-G28
    • R-PQFP-G100
    • R-PQFP-G128
    • R-PQFP-G160
    • R-XDFP-F20
    • R-XDFP-F24
    • R-XDFP-F28
    • R-XDIP-T20
    • R-XDIP-T24
    • R-XDIP-T28
    • R-XDIP-T40
    • R-XQCC-N14
    • R-XQCC-N16
    • R-XQCC-N20
    • R-XQCC-N22
    • R-XQCC-N28
    • R-XQCC-N8
    • R-XQFP-G100
    • S-CBGA-B225
    • S-CPGA-P100
    • S-CPGA-P133
    • S-CPGA-P144
    • S-CPGA-P160
    • S-CPGA-P184
    • S-CPGA-P192
    • S-CPGA-P232
    • S-CPGA-P280
    • S-CPGA-P403
    • S-CPGA-P503
    • S-CPGA-P504
    • S-CPGA-P560
    • S-CPGA-P599
    • S-CPGA-P655
    • S-CPGA-P68
    • S-CPGA-P84
    • S-CPGA-P984
    • S-CQCC-J28
    • S-CQCC-J44
    • S-CQCC-J68
    • S-CQCC-J84
    • S-CQCC-N20
    • S-CQCC-N28
    • S-CQFP-G208
    • S-GQCC-J44
    • S-MQFP-G208
    • S-PBGA-B100
    • S-PBGA-B1020
    • S-PBGA-B132
    • S-PBGA-B144
    • S-PBGA-B1508
    • S-PBGA-B169
    • S-PBGA-B196
    • S-PBGA-B225
    • S-PBGA-B256
    • S-PBGA-B280
    • S-PBGA-B324
    • S-PBGA-B352
    • S-PBGA-B356
    • S-PBGA-B388
    • S-PBGA-B400
    • S-PBGA-B432
    • S-PBGA-B48
    • S-PBGA-B484
    • S-PBGA-B49
    • S-PBGA-B492
    • S-PBGA-B56
    • S-PBGA-B560
    • S-PBGA-B600
    • S-PBGA-B64
    • S-PBGA-B652
    • S-PBGA-B672
    • S-PBGA-B68
    • S-PBGA-B724
    • S-PBGA-B780
    • S-PBGA-B784
    • S-PDSO-N12
    • S-PDSO-N32
    • S-PDSO-N48
    • S-PDSO-N8
    • S-PQCC-J20
    • S-PQCC-J28
    • S-PQCC-J44
    • S-PQCC-J52
    • S-PQCC-J68
    • S-PQCC-J84
    • S-PQCC-N68
    • S-PQFP-F100
    • S-PQFP-F144
    • S-PQFP-G100
    • S-PQFP-G120
    • S-PQFP-G128
    • S-PQFP-G132
    • S-PQFP-G144
    • S-PQFP-G160
    • S-PQFP-G176
    • S-PQFP-G208
    • S-PQFP-G240
    • S-PQFP-G304
    • S-PQFP-G44
    • S-PQFP-G48
    • S-PQFP-G64
    • S-XPGA-P160
    • S-XPGA-P192
    • S-XPGA-P68
    • S-XPGA-P84
    • S-XQCC-J20
    • S-XQCC-J28
    • S-XQCC-J44
    • S-XQCC-J68
    • S-XQCC-J84
    • S-XQCC-N12
    • S-XQCC-N14
    • S-XQCC-N20
    • S-XQCC-N24
    • S-XQCC-N28
    • S-XQCC-N32
    • S-XQCC-N48
    • S-XQFP-G208
Moisture Sensitivity Level (MSL)
    • 1
    • 2
    • 3
    • 4
    • 5A
Maximum Seated Height
    • .6 mm
    • .8 mm
    • 1 mm
    • 1.1 mm
    • 1.2 mm
    • 1.27 mm
    • 1.35 mm
    • 1.4 mm
    • 1.55 mm
    • 1.6 mm
    • 1.63 mm
    • 1.7 mm
    • 1.8 mm
    • 1.86 mm
    • 1.905 mm
    • 1.93 mm
    • 1.9812 mm
    • 15.75 mm
    • 2 mm
    • 2.03 mm
    • 2.1 mm
    • 2.2 mm
    • 2.23 mm
    • 2.286 mm
    • 2.29 mm
    • 2.3 mm
    • 2.35 mm
    • 2.45 mm
    • 2.46 mm
    • 2.5 mm
    • 2.54 mm
    • 2.55 mm
    • 2.6 mm
    • 2.64 mm
    • 2.65 mm
    • 2.7 mm
    • 2.87 mm
    • 2.94 mm
    • 2.99 mm
    • 3.13 mm
    • 3.35 mm
    • 3.4 mm
    • 3.425 mm
    • 3.5 mm
    • 3.65 mm
    • 3.683 mm
    • 3.7 mm
    • 3.77 mm
    • 3.81 mm
    • 3.82 mm
    • 3.91 mm
    • 3.916 mm
    • 3.93 mm
    • 3.94 mm
    • 3.96 mm
    • 4.06 mm
    • 4.064 mm
    • 4.07 mm
    • 4.08 mm
    • 4.1 mm
    • 4.191 mm
    • 4.2 mm
    • 4.318 mm
    • 4.32 mm
    • 4.3688 mm
    • 4.369 mm
    • 4.445 mm
    • 4.45 mm
    • 4.5 mm
    • 4.57 mm
    • 4.572 mm
    • 4.699 mm
    • 4.7 mm
    • 4.826 mm
    • 4.83 mm
    • 4.953 mm
    • 4.96 mm
    • 5.0038 mm
    • 5.026 mm
    • 5.06 mm
    • 5.077 mm
    • 5.08 mm
    • 5.081 mm
    • 5.207 mm
    • 5.3 mm
    • 5.33 mm
    • 5.334 mm
    • 5.34 mm
    • 5.43 mm
    • 5.588 mm
    • 5.59 mm
    • 5.715 mm
    • 5.75 mm
Width
    • 1 mm
    • 1.6 mm
    • 10 mm
    • 10.465 mm
    • 11 mm
    • 11.24 mm
    • 11.43 mm
    • 11.4554 mm
    • 11.505 mm
    • 11.506 mm
    • 11.5062 mm
    • 11.5316 mm
    • 11.6332 mm
    • 11.638 mm
    • 12 mm
    • 13 mm
    • 13.2 mm
    • 14 mm
    • 15 mm
    • 15.24 mm
    • 16 mm
    • 16.51 mm
    • 16.585 mm
    • 16.586 mm
    • 16.5862 mm
    • 16.59 mm
    • 16.6116 mm
    • 17 mm
    • 19 mm
    • 19.1262 mm
    • 2 mm
    • 2.5 mm
    • 20 mm
    • 21 mm
    • 23 mm
    • 24 mm
    • 24.065 mm
    • 24.13 mm
    • 24.23 mm
    • 24.2316 mm
    • 27 mm
    • 27.2 mm
    • 27.69 mm
    • 27.94 mm
    • 27.9527 mm
    • 28 mm
    • 28.448 mm
    • 28.45 mm
    • 29 mm
    • 29.145 mm
    • 29.21 mm
    • 29.3115 mm
    • 29.3116 mm
    • 29.464 mm
    • 3 mm
    • 32 mm
    • 33 mm
    • 33.528 mm
    • 35 mm
    • 37.084 mm
    • 39.624 mm
    • 4 mm
    • 4.4 mm
    • 4.5 mm
    • 40 mm
    • 44.7 mm
    • 45 mm
    • 45.15 mm
    • 49.78 mm
    • 5 mm
    • 5.3 mm
    • 57.4 mm
    • 6 mm
    • 6.883 mm
    • 6.92 mm
    • 60.07 mm
    • 62.484 mm
    • 7 mm
    • 7.5 mm
    • 7.62 mm
    • 7.98 mm
    • 8 mm
    • 8.89 mm
    • 8.965 mm
    • 8.966 mm
    • 8.9662 mm
    • 9.017 mm
    • 9.085 mm
    • 9.652 mm
Qualification
    • No
    • Yes
Additional Features
    • 1 External Clock
    • 1 External Clock; Register Preload
    • 10 Macrocells
    • 10 Macrocells, 1 External Clock, Shared Input/Clock, Variable Product Terms
    • 10 Macrocells; 1 External Clock; Register Preload; Power-Up Reset; Shared Input/Clock
    • 10 Macrocells; 1 External Clock; Register Preload; Shared Input/Clock
    • 10 Macrocells; 1 External Clock; Shared Input/Clock
    • 10 Macrocells; 1 External Clock; Shared Input/Clock 5 V compatible inputs & I/O; Register preload
    • 10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms
    • 10 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset
    • 10 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock
    • 10 Macrocells; Shared Input/Clock
    • 10 Macrocells; Variable Product Terms
    • 10 Macrocells; Variable Product Terms; Power-Up Reset; 1 External Clock; Shared Input/Clock
    • 1008 Logic elements; 126 Labs; Configurable I/O operation with 3.3 V or 5 V
    • 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V
    • 108 Macrocells; Configurable I/O operation with 3.3 V or 5 V
    • 108 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 198 Flip Flops
    • 1152 Logic Elements
    • 1152 Logic elements Configurable I/O operation with 3.3 V or 5 V
    • 1152 Logic elements; Built-in JTAG boundry-scan test circuitry
    • 1152 Logic elements; Configurable I/O operation with 3.3 V or 5 V
    • 1188 Flip Flops; 1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V
    • 12 Macrocells
    • 12160 Logic Elements; 1520 Labs
    • 128 Macrocells
    • 128 Macrocells; 8 Labs
    • 128 Macrocells; 8 Labs; Configurable I/O operation with 2.5 V or 3.3 V
    • 128 Macrocells; Configurable I/O operation with 3.3 V or 5 V
    • 128 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock
    • 128 Macrocells; Shared Input/Clock
    • 128 Macrocells; Shared Input/Clock; Shared Product Terms
    • 1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V
    • 144 Macrocells With Programmable I/O Architecture
    • 144 Macrocells; Configurable I/O operation with 2.5 or 3.3 V
    • 144 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 276 Flip Flops
    • 1500 Flip Flops; 1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V
    • 16 Macrocells
    • 16 Macrocells; 2 External Clocks
    • 16 Macrocells; 2 External Clocks; Asynchronous Clocks
    • 16 Macrocells; 4 External Clocks; Shared Input/Clock; Set/Reset In Asynchronous Enable
    • 16 Macrocells; Shared Input/Clock; Shared Product Terms
    • 160 Macrocells
    • 160 Macrocells; 10 Labs; Configurable I/O operation with 3.3 V or 5 V
    • 160 Macrocells; Shared Input/Clock
    • 1728 Logic Elements
    • 1728 Logic Elements; 216 Labs
    • 1728 Logic elements Configurable I/O operation with 3.3 V or 5 V
    • 1728 Logic elements; Built-in JTAG boundry-scan test circuitry
    • 1728 Logic elements; Configurable I/O operation with 3.3 V or 5 V
    • 18 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 18 Flip Flops
    • 192 Macrocells
    • 192 Macrocells; 12 Labs
    • 192 Macrocells; 12 Labs; Configurable I/O operation with 3.3 V or 5 V
    • 192 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock
    • 192 Macrocells; Shared Input/Clock
    • 192 Macrocells; Shared Input/Clock; Shared Product Terms
    • 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock
    • 20 Macrocells
    • 208 Logic Elements
    • 208 Logic elements; 26 Labs; Configurable I/O operation with 3.3 V or 5 V
    • 216 Macrocells; Configurable I/O operation with 3.3 V or 5 V
    • 2304 Logic Elements
    • 2304 Logic elements Configurable I/O operation with 3.3 V or 5 V
    • 2304 Logic elements; Built-in JTAG boundry-scan test circuitry
    • 2304 Logic elements; Configurable I/O operation with 3.3 V or 5 V
    • 24 Macrocell; Configurable I/O
    • 24 Macrocells
    • 24 Macrocells; 2 External Clocks
    • 256 Macrocells
    • 256 Macrocells; 16 Labs; Configurable I/O operation with 2.5 V or 3.3 V
    • 256 Macrocells; 16 Labs; Configurable I/O operation with 3.3 V or 5 V
    • 256 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock
    • 256 Macrocells; Shared Input/Clock
    • 28 Macrocells
    • 282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry
    • 288 Macrocells
    • 288 Macrocells; Configurable I/O operation with 3.3 V or 5 V
    • 2880 Logic Elements
    • 2880 Logic elements Configurable I/O operation with 3.3 V or 5 V
    • 2880 Logic elements; Built-in JTAG boundry-scan test circuitry
    • 2880 Logic elements; Configurable I/O operation with 3.3 V or 5 V
    • 3.3 or 5 V I/O Capability
    • 32 Macrocells
    • 32 Macrocells; 2 Labs; Configurable I/O operation with 2.5 V or 3.3 V
    • 32 Macrocells; 2 Labs; Configurable I/O operation with 3.3 V or 5 V
    • 32 Macrocells; Configurable I/O operation with 3.3 V or 5 V
    • 32 Macrocells; Shared Input/Clock
    • 32 Macrocells; Shared Input/Clock; Shared Product Terms
    • 320 Macrocells
    • 320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V
    • 320 Macrocells; 484 Flip Flops; 20 Labs; Configurable I/O operation with 3.3 V or 5 V
    • 320 Macrocells; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V
    • 336 Logic Elements
    • 336 Logic elements; 42 Labs; Configurable I/O operation with 3.3 V or 5 V
    • 36 Macrocells
    • 36 Macrocells; Configurable I/O operation with 2.5 or 3.3 V
    • 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks
    • 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 36 Flip Flops
    • 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks
    • 3744 Logic Elements
    • 3744 Logic elements Configurable I/O operation with 3.3 V or 5 V
    • 3744 Logic elements; Built-in JTAG boundry-scan test circuitry
    • 3744 Logic elements; Configurable I/O operation with 3.3 V or 5 V
    • 384 Macrocells
    • 4 EPF81188 devices with Field programmable Interconnect; 4656 Flip Flops; 4032 Logic elements
    • 4 External Clocks
    • 4 Labs; 40 Macrocells Configurable I/O operation with 3.3 V or 5 V
    • 400 Macrocell
    • 400 Macrocells; 580 Flip Flops Configurable I/O operation with 3.3 V or 5 V
    • 400 Macrocells; 580 Flip Flops; 25 Labs; Configurable I/O operation with 3.3 V or 5 V
    • 400 Macrocells; 580 Flip Flops; Configurable I/O operation with 3.3 V or 5 V
    • 452 Flip Flops; 336 Logic Elements
    • 452 Flip Flops; 336 Logic elements; Configurable I/O operation with 3.3 V or 5 V
    • 48 Macrocell; Configurable I/O
    • 48 Macrocells
    • 48 Macrocells; 4 External Clocks; Shared Input/Clock
    • 48 Macrocells; Shared Input/Clock
    • 480 Macrocells
    • 480 Macrocells; 676 Flip Flops; Configurable I/O operation with 3.3 V or 5 V
    • 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V
    • 4992 Logic Elements
    • 4992 Logic Elements; 624 Labs
    • 4992 Logic elements Configurable I/O operation with 3.3 V or 5 V
    • 504 Logic Elements
    • 504 Logic elements; 63 Labs; Configurable I/O operation with 3.3 V or 5 V
    • 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V
    • 512 Macrocells; 32 Labs; Configurable I/O operation with 2.5 V or 3.3 V
    • 512 Macrocells
    • 512 Macrocells; Configurable I/O Operation with 3.3 V or 5 V
    • 52 Flip Flops
    • 54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; 108 Flip Flops
    • 54 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 108 Flip Flops
    • 560 Macrocells
    • 560 Macrocells; 35 Labs; 772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V
    • 560 Macrocells; 772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V
    • 576 Logic Elements
    • 576 Logic Elements; 72 Labs
    • 576 Logic elements Configurable I/O operation with 3.3 V or 5 V
    • 576 Logic elements; Built-in JTAG boundry-scan test circuitry
    • 576 Logic elements; Configurable I/O operation with 3.3 V or 5 V
    • 580 Flip Flops; Configurable I/O operation with 3.3 V or 5 V
    • 636 Flip Flops; 504 Logic elements; Configurable I/O operation with 3.3 V or 5 V
    • 64 MICROCELLS; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V
    • 64 Macrocell; In-System Programmable
    • 64 Macrocells
    • 64 Macrocells; 4 Labs
    • 64 Macrocells; 4 Labs; Configurable I/O operation with 2.5 V or 3.3 V
    • 64 Macrocells; 4 Labs; Configurable I/O operation with 3.3 V or 5 V
    • 64 Macrocells; Configurable I/O operation with 3.3 V or 5 V
    • 64 Macrocells; In-system programmable; JTAG boundry-scan test circuitry
    • 64 Macrocells; Shared Input/Clock; Shared Product Terms
    • 672 Logic elements; 84 Labs; Configurable I/O operation with 3.3 V or 5 V
    • 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V
    • 676 Flip Flops; Configurable I/O operation with 3.3 V or 5 V
    • 72 Macrocells
    • 72 Macrocells; Configurable I/O operation with 3.3 V or 5 V
    • 72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks
    • 72 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 3 External Clocks; 126 Flip Flops
    • 772 Flip Flops; Configurable I/O operation with 3.3 V or 5 V
    • 8 Labs; 80 Macrocells Configurable I/O operation with 3.3 V or 5 V
    • 8 Macrocell; Power Up Reset; Shared Input/Clock
    • 8 Macrocells
    • 8 Macrocells; 1 External Clock; 5 V compatile Inputs & I/O; Register Preload; Power-up reset
    • 8 Macrocells; 1 External Clock; Register Preload; Shared Input/Clock
    • 8 Macrocells; 1 External Clock; Shared Input/Clock
    • 8 Macrocells; 1 External Clock; Shared Input/Clock; Power-Up Reset
    • 8 Macrocells; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset
    • 8 Macrocells; 1 External Clock; Shared Input/Clock; Variable Product Terms; Power-Up Reset
    • 8 Macrocells; 1 External Clock; Shared Input/Clock; Zero-Standby Function
    • 8 Macrocells; Register Preload; Power-Up Reset; 1 External Clock; Shared Input/Clock
    • 8 Macrocells; Shared Input/Clock
    • 820 Flip Flops; 672 Logic Elements; Configurable I/O Operation
    • 820 Flip Flops; 672 Logic elements; Configurable I/O operation with 3.3 V or 5 V
    • 96 Macrocells
    • 960 Macrocells
    • 9984 Logic Elements
    • Also Configurable with 5 V VCC
    • Also operates at 3.3 V nominal supply
    • Asynchronous Registered; 10 Macrocells; Register Preload; Power-Up Reset
    • Can Also Be Used 10000 Logic Gates
    • Can Also Be Used 16000 Logic Gates
    • Can Also Be Used 24000 Logic Gates
    • Can also be operated at 5 V
    • Can also operate at 3.3 V or 5 V supply
    • Can also operate at 3V to 3.6V supply
    • Can also operate at 5 V supply
    • Can also operate with 3.3 V supply
    • Can also use 16000 Gates
    • Configurable I/O operation with 3.3 V or 5 V
    • Configurable I/O operation with 3.3 V or 5 V; 18 Output Macrocells
    • Configurable I/O operation with 3.3 V or 5 V; Insystem Programmable
    • F_Max for 12-bit counter application is 40 MHz; Labs interconnected by PIA; 4 Labs; 48 Macrocells
    • F_Max for 12-bit counter application is 50 MHz; Labs interconnected by PIA; 4 Labs; 48 Macrocells
    • F_Max for 12-bit counter applicationsIS 33.3 MHz; Labs interconnected by PIA; 4 Labs; 48 Macrocells
    • F_Max for 6-bit couner CNT_/HLD0 application = 33 MHz; Programmable sequence generator
    • Fast Zero Power Design Technology
    • Field-Programmable Logic Sequencer
    • High Speed Decoder
    • In System Programmable
    • In-System Programmable
    • In-System Programmable; 3 External Clocks
    • In-System Programmable; 4 External Clocks
    • In-system re-programmable; 64 Macrocells; Configurable I/O operation with 3.3 V or 5 V
    • It can also operate at 2.5 V and 3.3 V
    • It can also operate at 3.3 V
    • LG-MAX
    • LG-MAX Seated HGT-NOM
    • Labs With Fasttrack Interconnect; 1500 Flipflops; 1296 Logic Elements
    • Labs With Fasttrack Interconnect; 452 Flip Flops; 336 Logic Elements
    • Labs interconnected by PIA; 12 Labs; 1 External Clock
    • Labs interconnected by PIA; 12 Labs; 192 Macrocells; 1 External Clock; Shared Input/Clock
    • Labs interconnected by PIA; 16 Labs; 2 External Clocks
    • Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock
    • Labs interconnected by PIA; 4 Labs; 64 Macrocells; 1 External Clock; Shared Input/Clock
    • Labs interconnected by PIA; 8 Labs; 1 External Clock
    • Labs interconnected by PIA; 8 Labs; 128 Macrocells; 1 External Clock; Shared Input/Clock
    • Macrocells Interconnected By Global And/Or Local Bus; 48 Macrocells; 4 External Clocks
    • Macrocells Interconnected By Global Bus; 10 Macrocells; 1 External Clock
    • Macrocells Interconnected By Global Bus; 16 Macrocells; 2 External Clocks
    • Macrocells Interconnected By Global Bus; 24 Macrocells; 2 External Clocks
    • Macrocells Interconnected By Global Bus; Synchronous Timing Generator; 64 Macrocells
    • Macrocells interconnected by PIA; 1 LAB; 32 Macrocells; 1 External Clock; Shared Input/Clock
    • Macrocells interconnected by PIA; 16 Macrocells; 1 External Clock; Shared Input/Clock
    • Macrocells interconnected by PIA; 32 Macrocells; 1 External Clock; Shared Input/Clock
    • Open Collector Output
    • PAL Blocks interconnected by PIA; 144 Macrocells; Configurable I/O operation with 3.3 V or 5 V
    • PAL Blocks interconnected by PIA; 36 Macrocells; Configurable I/O operation with 3.3 V or 5 V
    • PAL Blocks interconnected by PIA; 72 Macrocells
    • PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock
    • PAL with Macrocells; 8 Macrocells
    • PAL with Macrocells; 8 Macrocells; 1 External Clock; Shared Input/Clock
    • PAL with Macrocells; 8 Macrocells; 2 External Clocks; Shared Input/Clock
    • PLS
    • Pal With Macros; 38 Macros; 2 External Clocks; Buried Macros; Input Macros
    • Pal With Macros; 8 Macros; 1 External Clock; Shared Input/Clock; Register Preload; Power-Up Reset
    • Power-Up Reset
    • Power-Up Reset; 1 External Clock; Register Preload
    • Power-Up Reset; Register Preload
    • Power-Up Reset; Security Fuse
    • Programmable Logic Sequencer
    • Programmable Logic Sequencer; 1 External Clock
    • Programmable Logic Sequencer; 2 External Clocks; Shared Input/Clock
    • Programmable Multi-Function Pld; 1 External Clock; Shared Input/Clock; Register Preload
    • Programmable Multi-Function Pld; Register Preload; Shared Input/Clock
    • Programmable Output Polarity
    • Programmable Output Polarity; 8 Macrocells; Register Preload; Power-Up Reset
    • Programmable Output Polarity; Shared Input/Clock
    • Programmable Sequence Generator
    • Real Digital Design Technology
    • Real digital design technology, XILIK00225-1
    • Real digital design technology, XILIK00255-1
    • Register Preload
    • Register Preload; Power-Up Reset
    • Seated HGT-NOM
    • Security Fuse
    • Shared Input/Clock
    • Stand-Alone Microsequencer
    • Synchronous State Machine; 12 I/O Macrocells; 3 External Clocks; Shared Input/Clock
    • Tri-State Output
    • Typical gates = 12000 to 240000
    • Use ISPLSI1048EA for new designs
    • Use ISPLSI1048EA for new designs; Use 1048E-70 for new 1048E-50 designs
    • Zero Standby Function; 16 Macrocells With Configurable I/O
    • Zero-Standby Function
JESD-609 Code
    • e0
    • e1
    • e2
    • e3
    • e4
Maximum Clock Frequency
    • 10 MHz
    • 10.5 MHz
    • 100 MHz
    • 102 MHz
    • 103 MHz
    • 103.1 MHz
    • 104.16 MHz
    • 105 MHz
    • 105.3 MHz
    • 107.52 MHz
    • 108 MHz
    • 109.8 MHz
    • 11.1 MHz
    • 110 MHz
    • 111 MHz
    • 111.1 MHz
    • 112 MHz
    • 115 MHz
    • 116.3 MHz
    • 117 MHz
    • 117.6 MHz
    • 118 MHz
    • 118.3 MHz
    • 119 MHz
    • 12 MHz
    • 12.2 MHz
    • 12.5 MHz
    • 125 MHz
    • 126.6 MHz
    • 129.9 MHz
    • 13.3 MHz
    • 130 MHz
    • 133 MHz
    • 133.3 MHz
    • 135 MHz
    • 135.1 MHz
    • 137 MHz
    • 138.88 MHz
    • 138.9 MHz
    • 139 MHz
    • 14 MHz
    • 14.2 MHz
    • 14.3 MHz
    • 14.9 MHz
    • 140 MHz
    • 141 MHz
    • 142 MHz
    • 142.8 MHz
    • 142.9 MHz
    • 143 MHz
    • 144.9 MHz
    • 145 MHz
    • 147.1 MHz
    • 149 MHz
    • 15 MHz
    • 15.4 MHz
    • 150 MHz
    • 151.5 MHz
    • 152 MHz
    • 153 MHz
    • 154 MHz
    • 156 MHz
    • 156.3 MHz
    • 16 MHz
    • 16.5 MHz
    • 16.6 MHz
    • 16.7 MHz
    • 16.9 MHz
    • 160 MHz
    • 163.9 MHz
    • 164 MHz
    • 166 MHz
    • 166.66 MHz
    • 166.7 MHz
    • 167 MHz
    • 168 MHz
    • 17 MHz
    • 17.24 MHz
    • 17.5 MHz
    • 17.9 MHz
    • 172 MHz
    • 172.4 MHz
    • 175 MHz
    • 178.6 MHz
    • 18 MHz
    • 18.1 MHz
    • 18.2 MHz
    • 18.5 MHz
    • 18.9 MHz
    • 184.1 MHz
    • 185.2 MHz
    • 188.7 MHz
    • 19.6 MHz
    • 192 MHz
    • 192.3 MHz
    • 196.1 MHz
    • 20 MHz
    • 20.8 MHz
    • 200 MHz
    • 201.1 MHz
    • 204 MHz
    • 208 MHz
    • 208.3 MHz
    • 21 MHz
    • 21.7 MHz
    • 212 MHz
    • 212.8 MHz
    • 213 MHz
    • 22 MHz
    • 22.2 MHz
    • 22.9 MHz
    • 222 MHz
    • 222.2 MHz
    • 227.3 MHz
    • 23.2 MHz
    • 23.3 MHz
    • 23.5 MHz
    • 23.8 MHz
    • 238.1 MHz
    • 243.9 MHz
    • 247.5 MHz
    • 25 MHz
    • 250 MHz
    • 26.3 MHz
    • 27 MHz
    • 27.7 MHz
    • 277.8 MHz
    • 28.5 MHz
    • 28.6 MHz
    • 285.7 MHz
    • 29 MHz
    • 29.4 MHz
    • 294 MHz
    • 30 MHz
    • 30.3 MHz
    • 300 MHz
    • 303 MHz
    • 31.2 MHz
    • 31.25 MHz
    • 31.3 MHz
    • 32 MHz
    • 32.3 MHz
    • 33 MHz
    • 33.3 MHz
    • 333 MHz
    • 34 MHz
    • 34.5 MHz
    • 35 MHz
    • 35.7 MHz
    • 357 MHz
    • 37 MHz
    • 37.5 MHz
    • 38 MHz
    • 38.5 MHz
    • 385 MHz
    • 388 MHz
    • 40 MHz
    • 41.6 MHz
    • 41.67 MHz
    • 41.7 MHz
    • 417 MHz
    • 42 MHz
    • 44 MHz
    • 45 MHz
    • 45.4 MHz
    • 45.5 MHz
    • 450 MHz
    • 454 MHz
    • 47 MHz
    • 47.6 MHz
    • 47.62 MHz
    • 48 MHz
    • 48.5 MHz
    • 49 MHz
    • 5 MHz
    • 50 MHz
    • 500 MHz
    • 52 MHz
    • 52.5 MHz
    • 52.6 MHz
    • 52.63 MHz
    • 53 MHz
    • 53.76 MHz
    • 54.1 MHz
    • 55 MHz
    • 55.5 MHz
    • 55.6 MHz
    • 56 MHz
    • 57 MHz
    • 57.8 MHz
    • 58 MHz
    • 58.8 MHz
    • 59 MHz
    • 60 MHz
    • 60.6 MHz
    • 62 MHz
    • 62.5 MHz
    • 62.89 MHz
    • 63 MHz
    • 64 MHz
    • 64.5 MHz
    • 65 MHz
    • 66 MHz
    • 66.6 MHz
    • 66.67 MHz
    • 66.7 MHz
    • 67 MHz
    • 67.11 MHz
    • 67.56 MHz
    • 67.7 MHz
    • 68 MHz
    • 69 MHz
    • 71 MHz
    • 71.4 MHz
    • 71.43 MHz
    • 71.9 MHz
    • 72.5 MHz
    • 74 MHz
    • 76.9 MHz
    • 77 MHz
    • 78.1 MHz
    • 80 MHz
    • 81.3 MHz
    • 83 MHz
    • 83.3 MHz
    • 83.33 MHz
    • 833 MHz
    • 85 MHz
    • 86 MHz
    • 87 MHz
    • 88 MHz
    • 9.8 MHz
    • 90 MHz
    • 90.1 MHz
    • 90.9 MHz
    • 91 MHz
    • 93.5 MHz
    • 94.3 MHz
    • 95 MHz
    • 95.2 MHz
    • 95.23 MHz
    • 97 MHz
    • 98 MHz
Maximum Time At Peak Reflow Temperature (s)
    • 10 s
    • 20 s
    • 30 s
    • 40 s
    • 5 s
No. of Outputs
    • 10
    • 100
    • 102
    • 104
    • 1048
    • 106
    • 108
    • 11
    • 112
    • 113
    • 114
    • 116
    • 117
    • 118
    • 12
    • 120
    • 124
    • 128
    • 132
    • 133
    • 134
    • 135
    • 136
    • 138
    • 140
    • 143
    • 144
    • 147
    • 148
    • 15
    • 150
    • 153
    • 16
    • 160
    • 167
    • 168
    • 17
    • 171
    • 172
    • 173
    • 175
    • 176
    • 177
    • 180
    • 181
    • 182
    • 183
    • 184
    • 185
    • 186
    • 188
    • 189
    • 191
    • 192
    • 199
    • 20
    • 203
    • 204
    • 208
    • 212
    • 218
    • 219
    • 22
    • 220
    • 238
    • 24
    • 240
    • 246
    • 249
    • 254
    • 263
    • 270
    • 271
    • 272
    • 274
    • 30
    • 303
    • 308
    • 310
    • 32
    • 33
    • 333
    • 338
    • 34
    • 354
    • 358
    • 36
    • 360
    • 368
    • 369
    • 376
    • 38
    • 4
    • 400
    • 406
    • 413
    • 424
    • 45
    • 466
    • 470
    • 480
    • 486
    • 496
    • 5
    • 500
    • 52
    • 524
    • 54
    • 55
    • 580
    • 588
    • 59
    • 6
    • 60
    • 62
    • 64
    • 66
    • 68
    • 7
    • 700
    • 708
    • 71
    • 72
    • 723
    • 73
    • 74
    • 76
    • 78
    • 79
    • 8
    • 80
    • 800
    • 808
    • 81
    • 84
    • 85
    • 9
    • 92
    • 95
    • 96
Peak Reflow Temperature (C)
    • 220 °C (428 °F)
    • 225 °C (437 °F)
    • 235 °C (455 °F)
    • 240 °C (464 °F)
    • 245 °C (473 °F)
    • 250 °C (482 °F)
    • 256 °C (492.8 °F)
    • 260 °C (500 °F)
Length
    • 1.2 mm
    • 1.6 mm
    • 10 mm
    • 11 mm
    • 11.24 mm
    • 11.43 mm
    • 11.455 mm
    • 11.505 mm
    • 11.506 mm
    • 11.5062 mm
    • 11.5316 mm
    • 11.6332 mm
    • 11.638 mm
    • 12 mm
    • 12.8 mm
    • 13 mm
    • 13.03 mm
    • 13.09 mm
    • 13.72 mm
    • 14 mm
    • 14.355 mm
    • 15 mm
    • 15.367 mm
    • 15.4 mm
    • 15.57 mm
    • 16 mm
    • 16.51 mm
    • 16.585 mm
    • 16.586 mm
    • 16.5862 mm
    • 16.59 mm
    • 16.6116 mm
    • 17 mm
    • 17.9 mm
    • 19 mm
    • 19.1262 mm
    • 19.2 mm
    • 19.6 mm
    • 2 mm
    • 2.2 mm
    • 2.5 mm
    • 20 mm
    • 21 mm
    • 23 mm
    • 24 mm
    • 24.003 mm
    • 24.065 mm
    • 24.13 mm
    • 24.195 mm
    • 24.2 mm
    • 24.23 mm
    • 24.2316 mm
    • 24.257 mm
    • 24.305 mm
    • 24.325 mm
    • 24.35 mm
    • 24.6 mm
    • 25.15 mm
    • 25.27 mm
    • 25.4 mm
    • 25.527 mm
    • 25.55 mm
    • 25.908 mm
    • 26.125 mm
    • 26.1366 mm
    • 26.162 mm
    • 26.695 mm
    • 26.73 mm
    • 27 mm
    • 27.2 mm
    • 27.69 mm
    • 27.94 mm
    • 27.9527 mm
    • 28 mm
    • 28.448 mm
    • 28.45 mm
    • 29 mm
    • 29.145 mm
    • 29.21 mm
    • 29.3115 mm
    • 29.3116 mm
    • 29.464 mm
    • 29.8 mm
    • 3 mm
    • 30.099 mm
    • 30.378 mm
    • 30.734 mm
    • 31.14 mm
    • 31.64 mm
    • 31.68 mm
    • 31.6865 mm
    • 31.7 mm
    • 31.75 mm
    • 31.855 mm
    • 31.875 mm
    • 31.877 mm
    • 31.88 mm
    • 31.887 mm
    • 31.915 mm
    • 31.9405 mm
    • 31.955 mm
    • 32 mm
    • 32.005 mm
    • 32.2 mm
    • 33 mm
    • 33.528 mm
    • 34.29 mm
    • 34.48 mm
    • 34.925 mm
    • 35 mm
    • 35.505 mm
    • 36.32 mm
    • 36.51 mm
    • 36.83 mm
    • 37.0205 mm
    • 37.084 mm
    • 39.624 mm
    • 4 mm
    • 4.5 mm
    • 40 mm
    • 44.7 mm
    • 45 mm
    • 45.15 mm
    • 49.78 mm
    • 5 mm
    • 52.07 mm
    • 52.324 mm
    • 52.425 mm
    • 52.4256 mm
    • 57.4 mm
    • 6 mm
    • 6.5 mm
    • 60.07 mm
    • 62.484 mm
    • 7 mm
    • 7.2 mm
    • 7.8 mm
    • 8 mm
    • 8.89 mm
    • 8.965 mm
    • 8.966 mm
    • 8.9662 mm
    • 9.017 mm
JTAG Boundary Scan Test
    • No
    • Yes
No. of I/O Lines
    • 0
    • 10
    • 100
    • 101
    • 102
    • 104
    • 106
    • 1060
    • 108
    • 11
    • 110
    • 112
    • 113
    • 114
    • 116
    • 117
    • 118
    • 12
    • 120
    • 124
    • 125
    • 128
    • 13
    • 130
    • 132
    • 133
    • 134
    • 135
    • 136
    • 139
    • 141
    • 142
    • 143
    • 144
    • 146
    • 147
    • 148
    • 149
    • 150
    • 151
    • 152
    • 153
    • 155
    • 158
    • 159
    • 16
    • 160
    • 161
    • 164
    • 166
    • 167
    • 168
    • 17
    • 171
    • 172
    • 173
    • 174
    • 175
    • 176
    • 180
    • 181
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Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EPM2210F324C5N

Intel

Flash PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

2.625 V

1700

CMOS

272

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 272 I/O

0

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

30 s

272

260 °C (500 °F)

19 mm

Yes

272

EPM2210F324I5N

Intel

Flash PLD

Ball

324

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

2.625 V

1700

CMOS

272

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

100 °C (212 °F)

0 Dedicated Inputs, 272 I/O

0

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

30 s

272

260 °C (500 °F)

19 mm

Yes

272

EPM2210F324C4N

Intel

Flash PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

2.625 V

1700

CMOS

272

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 272 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

272

19 mm

Yes

272

5M2210ZF324C5N

Intel

Flash PLD

Other

Ball

324

LBGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

1700

CMOS

271

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

271 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

1.55 mm

19 mm

No

e1

201.1 MHz

271

19 mm

Yes

271

EPM2210F324C3N

Intel

Flash PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

1700

CMOS

272

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 272 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

272

19 mm

Yes

272

EPM2210F324A5N

Intel

Flash PLD

Automotive

Ball

324

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

2.625 V

1700

CMOS

272

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

125 °C (257 °F)

0 Dedicated Inputs, 272 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e1

272

19 mm

Yes

272

EPM2210F324C5

Intel

Flash PLD

Commercial Extended

Ball

324

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

2.625 V

1700

CMOS

272

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 272 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e0

272

19 mm

Yes

272

5M2210ZF324C4N

Intel

Flash PLD

Other

Ball

324

LBGA

Square

Plastic/Epoxy

9.1 ns

Yes

1.89 V

1700

CMOS

271

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

271 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

1.55 mm

19 mm

No

e1

247.5 MHz

271

19 mm

Yes

271

5M1270ZF324C5N

Intel

Flash PLD

Other

Ball

324

LBGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

980

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

85 °C (185 °F)

271 I/O

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

1.55 mm

19 mm

No

e1

201.1 MHz

19 mm

Yes

271

XC2C512-10FGG324I

Xilinx

Flash PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

512

CMOS

270

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 270 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

91 MHz

30 s

270

250 °C (482 °F)

23 mm

Yes

270

EPM2210F324C3

Intel

Flash PLD

Commercial Extended

Ball

324

BGA

Square

Plastic/Epoxy

7 ns

Yes

2.625 V

1700

CMOS

272

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 272 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e0

272

19 mm

Yes

272

EPM2210F324C4

Intel

Flash PLD

Commercial Extended

Ball

324

BGA

Square

Plastic/Epoxy

9.1 ns

Yes

2.625 V

1700

CMOS

272

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 272 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e0

272

19 mm

Yes

272

EPM2210F324I5

Intel

Flash PLD

Ball

324

BGA

Square

Plastic/Epoxy

11.2 ns

Yes

2.625 V

1700

CMOS

272

2.5

1.5/3.3,2.5/3.3 V

Grid Array

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

2.375 V

1 mm

100 °C (212 °F)

0 Dedicated Inputs, 272 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.2 mm

19 mm

No

It can also operate at 3.3 V

e0

272

19 mm

Yes

272

EP20K30EFC324-3

Altera

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

3.98 ns

1200

Yes

1.89 V

CMOS

120

1.8

1.8,1.8/3.3 V

Grid Array

BGA324,18X18,40

Field Programmable Gate Arrays

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 128 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.1 mm

19 mm

No

e1

160 MHz

120

220 °C (428 °F)

19 mm

128

5M1270ZF324I5N

Intel

Flash PLD

Industrial

Ball

324

LBGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

980

CMOS

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

100 °C (212 °F)

271 I/O

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

1.55 mm

19 mm

No

e1

201.1 MHz

19 mm

Yes

271

5M2210ZF324I5N

Intel

Flash PLD

Industrial

Ball

324

LBGA

Square

Plastic/Epoxy

11.2 ns

Yes

1.89 V

1700

CMOS

271

1.8

1.8,1.2/3.3 V

Grid Array, Low Profile

BGA324,18X18,40

Programmable Logic Devices

Yes

Macrocell

1.71 V

1 mm

100 °C (212 °F)

271 I/O

0

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B324

3

1.55 mm

19 mm

No

e1

201.1 MHz

30 s

271

260 °C (500 °F)

19 mm

Yes

271

EP20K100FC324-1

Intel

Loadable PLD

Other

Ball

324

BGA

Square

Plastic/Epoxy

2.5 ns

4160

Yes

2.625 V

CMOS

246

2.5

2.5,2.5/3.3 V

Grid Array

BGA324(UNSPEC)

Field Programmable Gate Arrays

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 252 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

3.5 mm

19 mm

No

e0

246

19 mm

252

XC2C512-10FG324C

Xilinx

Flash PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

512

CMOS

270

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 270 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

91 MHz

30 s

270

225 °C (437 °F)

23 mm

Yes

270

XCR3512XL-7FGG324C

Xilinx

EE PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

512

CMOS

3.3

3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 260 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

135 MHz

30 s

250 °C (482 °F)

23 mm

Yes

260

XC2C512-7FGG324C

Xilinx

Flash PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

512

CMOS

270

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 270 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

119 MHz

30 s

270

250 °C (482 °F)

23 mm

Yes

270

XC2C384-7FG324C

Xilinx

Flash PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

384

CMOS

240

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 240 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

112 MHz

30 s

240

225 °C (437 °F)

23 mm

Yes

240

XC2C384-10FGG324C

Xilinx

Flash PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

384

CMOS

240

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 240 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

83 MHz

30 s

240

250 °C (482 °F)

23 mm

Yes

240

XCR3384XL-10FG324I

Xilinx

EE PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

384

CMOS

3.3

3/3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 220 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

102 MHz

30 s

225 °C (437 °F)

23 mm

Yes

220

XCR3512XL-7FG324C

Xilinx

EE PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

512

CMOS

3.3

3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 260 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

135 MHz

30 s

225 °C (437 °F)

23 mm

Yes

260

XCR3384XL-12FGG324C

Xilinx

EE PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

384

CMOS

3.3

3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 220 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

83 MHz

30 s

250 °C (482 °F)

23 mm

Yes

220

XC2C512-7FG324C

Xilinx

Flash PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

512

CMOS

270

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 270 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

119 MHz

30 s

270

225 °C (437 °F)

23 mm

Yes

270

XC2C512-6FG324C

Xilinx

Flash PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

512

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 270 I/O

0

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

30 s

225 °C (437 °F)

23 mm

Yes

270

XCR3384XL-10FGG324I

Xilinx

EE PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

384

CMOS

3.3

3/3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 220 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

102 MHz

30 s

250 °C (482 °F)

23 mm

Yes

220

XC2C384-10FGG324I

Xilinx

Flash PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

384

CMOS

240

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 240 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

83 MHz

30 s

240

250 °C (482 °F)

23 mm

Yes

240

XCR3384XL-10FG324C

Xilinx

EE PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

384

CMOS

3.3

3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 220 I/O

0

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

102 MHz

30 s

225 °C (437 °F)

23 mm

Yes

220

XCR3384XL-12FGG324I

Xilinx

EE PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

384

CMOS

3.3

3/3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 220 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

83 MHz

30 s

250 °C (482 °F)

23 mm

Yes

220

XCR3384XL-12FG324I

Xilinx

EE PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

384

CMOS

3.3

3/3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 220 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

83 MHz

30 s

225 °C (437 °F)

23 mm

Yes

220

XCR3384XL-12FG324C

Xilinx

EE PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

384

CMOS

3.3

3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 220 I/O

0

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

83 MHz

30 s

225 °C (437 °F)

23 mm

Yes

220

XCR3512XL-10FGG324C

Xilinx

EE PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 260 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

97 MHz

30 s

250 °C (482 °F)

23 mm

Yes

260

XC2C384-6FGG324C

Xilinx

Flash PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

384

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 240 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

30 s

250 °C (482 °F)

23 mm

Yes

240

XC2C384-10FG324C

Xilinx

Flash PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

384

CMOS

240

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 240 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

83 MHz

30 s

240

225 °C (437 °F)

23 mm

Yes

240

XCR3512XL-10FG324C

Xilinx

EE PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 260 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

97 MHz

30 s

225 °C (437 °F)

23 mm

Yes

260

XCR3512XL-12FG324I

Xilinx

EE PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

512

CMOS

3.3

3/3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 260 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

77 MHz

30 s

225 °C (437 °F)

23 mm

Yes

260

XCR3512XL-12FGG324I

Xilinx

EE PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

512

CMOS

3.3

3/3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 260 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

77 MHz

30 s

250 °C (482 °F)

23 mm

Yes

260

XCR3384XL-7FG324C

Xilinx

EE PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

384

CMOS

3.3

3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 220 I/O

0

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

135 MHz

30 s

225 °C (437 °F)

23 mm

Yes

220

XCR3384XL-7FGG324C

Xilinx

EE PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

384

CMOS

3.3

3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 220 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

135 MHz

30 s

250 °C (482 °F)

23 mm

Yes

220

XCR3512XL-12FG324C

Xilinx

EE PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

512

CMOS

3.3

3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 260 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

77 MHz

30 s

225 °C (437 °F)

23 mm

Yes

260

XCR3512XL-10FG324I

Xilinx

EE PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

3/3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 260 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

97 MHz

30 s

225 °C (437 °F)

23 mm

Yes

260

XCR3384XL-10FGG324C

Xilinx

EE PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

384

CMOS

3.3

3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 220 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

102 MHz

30 s

250 °C (482 °F)

23 mm

Yes

220

XC2C512-6FGG324C

Xilinx

Flash PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

512

CMOS

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 270 I/O

0

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

30 s

250 °C (482 °F)

23 mm

Yes

270

XCR3512XL-12FGG324C

Xilinx

EE PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

512

CMOS

3.3

3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 260 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

77 MHz

30 s

250 °C (482 °F)

23 mm

Yes

260

XCR3512XL-10FGG324I

Xilinx

EE PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

3/3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 260 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

97 MHz

30 s

250 °C (482 °F)

23 mm

Yes

260

XC2C512-10FG324I

Xilinx

Flash PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

512

CMOS

270

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 270 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

91 MHz

30 s

270

225 °C (437 °F)

23 mm

Yes

270
Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.