Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
64 |
CMOS |
32 |
5 |
Tube |
Chip Carrier |
LDCC44,.7SQ |
Yes |
Macrocell |
4.5 V |
40 |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
4.57 mm |
29.3116 mm |
No |
Power-Up Reset; Security Fuse |
e3 |
125 MHz |
32 |
29.3116 mm |
Yes |
32 |
|||||||||
|
Microchip Technology |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
128 |
5 |
Tube |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
2 |
4.572 mm |
29.3115 mm |
No |
e3 |
125 MHz |
29.3115 mm |
Yes |
64 |
|||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
128 |
3.3 |
Tube |
3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
4.572 mm |
29.3115 mm |
No |
100 MHz |
29.3115 mm |
Yes |
64 |
||||||||||||||
|
Microchip Technology |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
128 |
5 |
Tube |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
2 |
4.572 mm |
29.3115 mm |
No |
128 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e3 |
33.3 MHz |
29.3115 mm |
Yes |
64 |
||||||||||
|
Microchip Technology |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
128 |
5 |
Tube |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
2 |
4.572 mm |
29.3115 mm |
No |
e3 |
166.7 MHz |
29.3115 mm |
Yes |
64 |
|||||||||||
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
16 ns |
Yes |
5.25 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 60 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
117.6 MHz |
29.3116 mm |
Yes |
60 |
|||||||||||
|
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
16 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 60 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e3 |
117.6 MHz |
29.3116 mm |
60 |
||||||||||||||||
Xilinx |
Flash PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
108 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 69 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
e0 |
30 s |
225 °C (437 °F) |
29.3116 mm |
Yes |
69 |
|||||||||||
|
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
125 MHz |
29.3116 mm |
Yes |
68 |
||||||||||
|
Intel |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
125 MHz |
29.3116 mm |
Yes |
68 |
||||||||||||
|
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
100 MHz |
29.3116 mm |
Yes |
68 |
||||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
4.57 mm |
29.3116 mm |
No |
64 Macrocells; In-system programmable; JTAG boundry-scan test circuitry |
e0 |
125 MHz |
225 °C (437 °F) |
29.3116 mm |
Yes |
64 |
||||||||||
Altera |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
336 |
Yes |
5.5 V |
CMOS |
68 |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
336 Logic Elements |
e0 |
385 MHz |
64 |
220 °C (428 °F) |
29.3116 mm |
68 |
||||||||||||
|
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e3 |
166.7 MHz |
29.3116 mm |
Yes |
68 |
||||||||||
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
29.3116 mm |
No |
64 |
|||||||||||
Intel |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
336 |
Yes |
5.5 V |
CMOS |
68 |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
452 Flip Flops; 336 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e0 |
64 |
29.3116 mm |
64 |
|||||||||||||
|
Intel |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
452 Flip Flops; 336 Logic elements; Configurable I/O operation with 3.3 V or 5 V |
e3 |
29.3116 mm |
64 |
||||||||||||||||||
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
128 Macrocells; Configurable I/O operation with 3.3 V or 5 V; 2 External Clocks; Shared Input/Clock |
e0 |
125 MHz |
29.3116 mm |
No |
68 |
|||||||||||
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
128 Macrocells |
125 MHz |
29.3116 mm |
No |
68 |
||||||||||||||
Xilinx |
Flash PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
108 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 69 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
e0 |
30 s |
225 °C (437 °F) |
29.3116 mm |
Yes |
69 |
|||||||||||
Xilinx |
Flash PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
72 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 69 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
e0 |
55.6 MHz |
30 s |
225 °C (437 °F) |
29.3116 mm |
Yes |
69 |
||||||||||
|
Xilinx |
Flash PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
72 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 69 I/O |
0 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
e3 |
55.6 MHz |
30 s |
245 °C (473 °F) |
29.3116 mm |
Yes |
69 |
|||||||||
Atmel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
128 |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
4.572 mm |
29.3115 mm |
No |
128 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e0 |
41.7 MHz |
225 °C (437 °F) |
29.3115 mm |
Yes |
64 |
|||||||||||
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
83.3 MHz |
29.3116 mm |
No |
64 |
|||||||||||
Atmel |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
4.572 mm |
29.3115 mm |
No |
e0 |
83.3 MHz |
225 °C (437 °F) |
29.3115 mm |
Yes |
64 |
|||||||||||
Intel |
Loadable PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
208 |
Yes |
5.25 V |
CMOS |
68 |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
208 Logic Elements |
e0 |
385 MHz |
64 |
29.3116 mm |
68 |
||||||||||||
|
Intel |
Loadable PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Registered |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
208 Logic Elements |
e3 |
29.3116 mm |
68 |
|||||||||||||||||||
Xilinx |
Flash PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
108 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 69 I/O |
0 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
e0 |
30 s |
225 °C (437 °F) |
29.3116 mm |
Yes |
69 |
|||||||||||
Lattice Semiconductor |
EE PLD |
Military |
Pin/Peg |
84 |
PGA |
Square |
Ceramic, Metal-Sealed Cofired |
25 ns |
No |
5.5 V |
128 |
CMOS |
MIL-STD-883 |
5 |
5 V |
Grid Array |
PGA84M,11X11 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
2.54 mm |
125 °C (257 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
-55 °C (-67 °F) |
Perpendicular |
S-CPGA-P84 |
5.588 mm |
29.464 mm |
No |
In-System Programmable; 4 External Clocks |
38 MHz |
30 s |
225 °C (437 °F) |
29.464 mm |
No |
64 |
|||||||||||
Intel |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
23 ns |
Yes |
5.5 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 60 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
29.3116 mm |
Yes |
60 |
|||||||||||
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
160 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 64 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
29.3116 mm |
Yes |
64 |
|||||||||||
Altera |
Loadable PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
208 |
Yes |
5.25 V |
CMOS |
68 |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
282 Flip Flops; 208 Logic elements; Built-in JTAG boundry-scan test circuitry |
e0 |
64 |
220 °C (428 °F) |
29.3116 mm |
64 |
|||||||||||||
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J84 |
3 |
4.57 mm |
29.3116 mm |
No |
In-System Programmable; 4 External Clocks |
e0 |
38 MHz |
30 s |
225 °C (437 °F) |
29.3116 mm |
No |
64 |
|||||||||
Intel |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
2 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
29.3116 mm |
Yes |
68 |
|||||||||||
Altera |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
16 ns |
Yes |
5.25 V |
CMOS |
5 |
Chip Carrier |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 56 I/O |
4 |
0 °C (32 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
320 Macrocells |
220 °C (428 °F) |
29.3116 mm |
56 |
||||||||||||||||||||
Cypress Semiconductor |
Flash PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
1 Dedicated Inputs, 64 I/O |
1 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
In-system re-programmable; 64 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e0 |
50 MHz |
29.3116 mm |
No |
64 |
||||||||||||
Intel |
Loadable PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
336 |
Yes |
5.25 V |
CMOS |
68 |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
336 Logic Elements |
e0 |
385 MHz |
64 |
29.3116 mm |
68 |
||||||||||||
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
30 s |
220 °C (428 °F) |
29.3116 mm |
No |
68 |
|||||||||
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
166.7 MHz |
29.3116 mm |
Yes |
68 |
|||||||||||
Altera |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
16 ns |
Yes |
5.5 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 60 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
320 Macrocells |
e0 |
117.6 MHz |
220 °C (428 °F) |
29.3116 mm |
Yes |
60 |
|||||||||||
Cypress Semiconductor |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
6 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
1 Dedicated Inputs, 69 I/O |
1 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
64 Macrocells; Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
29.3116 mm |
Yes |
69 |
|||||||||||
Cypress Semiconductor |
EE PLD |
Military |
J Bend |
84 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
15 ns |
Yes |
3.6 V |
128 |
CMOS |
38535Q/M;38534H;883B |
3.3 |
3.3 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
125 °C (257 °F) |
1 Dedicated Inputs, 69 I/O |
1 |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-J84 |
4.826 mm |
29.21 mm |
No |
128 Macrocells |
e0 |
62.5 MHz |
29.21 mm |
Yes |
69 |
|||||||||||
Altera |
Loadable PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
CMOS |
5 |
Chip Carrier |
Registered |
4.5 V |
1.27 mm |
85 °C (185 °F) |
4 Dedicated Inputs, 64 I/O |
4 |
-40 °C (-40 °F) |
Quad |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
No |
452 Flip Flops; 336 Logic Elements |
29.3116 mm |
64 |
||||||||||||||||||||||
Intel |
Loadable PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
504 |
Yes |
5.25 V |
CMOS |
68 |
5 |
5 V |
Chip Carrier |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
Registered |
4.75 V |
1.27 mm |
70 °C (158 °F) |
4 Dedicated Inputs, 68 I/O |
4 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
504 Logic Elements |
e0 |
357 MHz |
64 |
29.3116 mm |
68 |
||||||||||||
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
29.3116 mm |
No |
68 |
|||||||||||
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
7.5 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
166.7 MHz |
29.3116 mm |
No |
68 |
|||||||||||
Intel |
EE PLD |
Industrial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
No |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
100 MHz |
29.3116 mm |
No |
68 |
|||||||||||
Intel |
EE PLD |
Commercial |
J Bend |
84 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC84,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 68 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
No |
Configurable I/O operation with 3.3 V or 5 V |
e0 |
125 MHz |
29.3116 mm |
Yes |
68 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.